用于高冲击检测硅基三轴集成压阻式MEMS加速度芯片的建模与仿真
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摘要
主要讨论硅基单芯片集成的三轴压阻式MEMS加速度计芯片的建模与仿真。通过有限元软件ANSYS建立的结构模型可以较好的理解和分析所要设计的加速度芯片在承受任意不同轴向加速度所产生惯性力时的静态表现。利用有限元软件ANSYS我们详细分析了各个悬臂梁在承受不同轴向惯性力时的应力变化,确定出敏感电阻的位置。通过LS-DYNA软件对所设计的加速度计芯片进行了不同方向撞击刚性墙时的器件受力分析,分析结果表明所设计的结构在理论上是可行的。
This paper presents analytical models for tri-axial accelerometer chip based on one seismic mass and eight beams.The model makes it possible to better understand and to predict the behavior of the accelerometer.The accelerometer discussed in this paper was designed to measure inertia force in an arbitrary direction.This paper uses finite element design for optimization of the device structure.FEA software ANSYS was used to simulate the behavior of the accelerometer when it was subjected to inertia force in random direction.We analyses the positions on every beam when the mass subjects different direction acceleration in order to find the suitable position.The FEA software LS-DYNA was used to simulate the accelerometer impacts to the steel wall in random directions.Analysis Results presents that the theoretical structure is feasible.
This paper presents analytical models for tri-axial accelerometer chip based on one seismic mass and eight beams.The model makes it possible to better understand and to predict the behavior of the accelerometer.The accelerometer discussed in this paper was designed to measure inertia force in an arbitrary direction.This paper uses finite element design for optimization of the device structure.FEA software ANSYS was used to simulate the behavior of the accelerometer when it was subjected to inertia force in random direction.We analyses the positions on every beam when the mass subjects different direction acceleration in order to find the suitable position.The FEA software LS-DYNA was used to simulate the accelerometer impacts to the steel wall in random directions.Analysis Results presents that the theoretical structure is feasible.
引文
[1]Shang Chen,Chenyang Xue,Wendong Zhang.A New MEMS Ac-celerometer Applied in Civil Engineering and Its Calibration Test[C]//Proceeding of the 3rd IEEE Int Conf on Nano/Micro Engi-neered and Molecular Systems.Sanya,China,January 6-9,2008:959-964.
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[3]Xingguo Xiong,Yu-Liang Wu,Wen-ben Jone.Material Fatigue andReliability of MEMS Accelerometers[C]//IEEE InternationalSymposium on Defect and Fault Tolerance of VLSI system 2008.Boston,USA,Oct.1-3:314-322.
[4]Weidong Huang,Xia Cai,Bulu Xu,et al.Packaging Effects on thePerformances of MEMS for High-G Accelerometer with Double-Can-tilevers[J].Sensors and Actuators A,2003,102(3):268-278.
[5]Smith C S.Piezoresistance in Germanium and Silicon[J].PhysicsReview,Vol.94(1954):42-49.
[6]Roylance L M,Angell J B.A Batch-Fabricated Silicon Accelero-meter[J].IEEE Trans Electron Devices,ED-26(1979):1911-1917.
[7]Min-Hang Bao.Micro Mechanical Transducers:Pressure Sensors,Accelerometers and Gyroscopes.Handbook of Sensors and Actuator[M].Amsterdam:Elsevier Science,2000,241-262.
[8]Min-Hang Bao.Analysis and Design Principles of MEMS Devices[M].1st ed.Netherlands:ELSEVIER Science,2005,279-284.
[9]李刚.硅微机械三维加速度计研究[D].硕士学位论文.北京大学,2000,66-67.
[10]张新,费业泰.一体化三维加速度传感器弹性体结构设计[J].制造业自动化,2006,28(12):65-67.
[11]王雅萍,李俊国,朱目成.一种三维加速度计弹性体的分析与设计[J].传感器与微系统,2006:25(2):61-63.
[12]祈晓谨.MEMS高g值加速度传感器研究[D]:硕士学位论文.中北大学,2007,56-60.
[13]郇勇,张泰华,杨业敏.用Hopkinson杆冲击加载研究高量程微加速度计芯片的抗过载能力[J].传感技术学报,2003,16(2):128-131.
[14]刘宗林,李圣怡,吴学忠.新型三轴微加速度计设计[J].传感技术学报,2004,17(3):488-504.
[15]任勇峰,王晓丽.一种结构新颖的地震动加速度计[J].微纳电子技术,2007,44(3):142-145.
[2]Xia Lou,Jinjie Shi,Wei Zhang.Study on the Packaging Technologyfor a High-G MEMS Accelerometer[C]//2005 Electronics Packa-ging Technology Conference Singapore,2005:103-104.
[3]Xingguo Xiong,Yu-Liang Wu,Wen-ben Jone.Material Fatigue andReliability of MEMS Accelerometers[C]//IEEE InternationalSymposium on Defect and Fault Tolerance of VLSI system 2008.Boston,USA,Oct.1-3:314-322.
[4]Weidong Huang,Xia Cai,Bulu Xu,et al.Packaging Effects on thePerformances of MEMS for High-G Accelerometer with Double-Can-tilevers[J].Sensors and Actuators A,2003,102(3):268-278.
[5]Smith C S.Piezoresistance in Germanium and Silicon[J].PhysicsReview,Vol.94(1954):42-49.
[6]Roylance L M,Angell J B.A Batch-Fabricated Silicon Accelero-meter[J].IEEE Trans Electron Devices,ED-26(1979):1911-1917.
[7]Min-Hang Bao.Micro Mechanical Transducers:Pressure Sensors,Accelerometers and Gyroscopes.Handbook of Sensors and Actuator[M].Amsterdam:Elsevier Science,2000,241-262.
[8]Min-Hang Bao.Analysis and Design Principles of MEMS Devices[M].1st ed.Netherlands:ELSEVIER Science,2005,279-284.
[9]李刚.硅微机械三维加速度计研究[D].硕士学位论文.北京大学,2000,66-67.
[10]张新,费业泰.一体化三维加速度传感器弹性体结构设计[J].制造业自动化,2006,28(12):65-67.
[11]王雅萍,李俊国,朱目成.一种三维加速度计弹性体的分析与设计[J].传感器与微系统,2006:25(2):61-63.
[12]祈晓谨.MEMS高g值加速度传感器研究[D]:硕士学位论文.中北大学,2007,56-60.
[13]郇勇,张泰华,杨业敏.用Hopkinson杆冲击加载研究高量程微加速度计芯片的抗过载能力[J].传感技术学报,2003,16(2):128-131.
[14]刘宗林,李圣怡,吴学忠.新型三轴微加速度计设计[J].传感技术学报,2004,17(3):488-504.
[15]任勇峰,王晓丽.一种结构新颖的地震动加速度计[J].微纳电子技术,2007,44(3):142-145.
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