热驱动形状记忆聚合物三维力学本构模型
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摘要
假设形状记忆聚合物(SMP)为各向同性材料,其体积变形是弹性的,形状变化的流变规律满足Tobushi建立的一维本构模型的基础上,应用固体力学和热粘弹性理论建立了SMP三维本构模型,使其不仅能描述简单应力状态下的热力学行为,也能描述复杂应力状态下的热力学行为.然后基于ABAQUS的二次开发平台编写了可供ABAQUS调用的UMAT子程序,对SMP试样实现形状记忆效应的热力学过程数值模拟,数值模拟结果与Tobushi等的实验结果吻合良好,表明建立的SMP三维本构模型能够有效的描述SMP的热力学行为,可为SMP的工程应用提供理论参考.
Assuming the shape memory polymers is an isotropic material,by the application of solid mechanics and thermal viscoelasticity theory,a 3Dconstitutive equation of SMP is developed based on tobushi' s 1Dconstitutive equation,so it can not only describe the thermo-mechanical behavior under simple stress state,but also describe the thermo-mechanical behavior under complex stress state.A UMAT subroutine is programmed with fortran based on ABAQUS secondary development platform,then the SMP thermo-mechanical behavior is numerically simulated by ABAQUS.Numerical simulation results coincide with Tobushi' s experimental results,which shows the thermo-mechanical behavior of SMP and it' s shape memory effect can be described by the three dimensional constitutive model of SMP.
引文
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