孔隙率与界面结构对高体积分数SiC_p/Al复合材料热学和力学性能的影响（英文）
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摘要
采用放电等离子烧结技术成功制备具有高热学和力学性能的50vol.%SiC_p/Al复合材料,研究烧结温度对复合材料热导率、热膨胀系数和抗弯强度的影响。结果表明,在520℃下烧结获得的复合材料,导热系数为189W/(m·K),热膨胀系数(50～200℃)为10.03×10~(-6)K~(-1),抗弯强度为649 MPa。Al合金基体与SiC颗粒之间的界面结合良好,复合材料接近完全致密,因而具有较高的热学性能和力学性能。为满足高性能电子封装材料的制备提供一种新的可行方法。
50 vol.% SiC_p/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient of thermal expansion and bending strength of the SiC_p/Al composites were carefully investigated. The results show that the SiC_p/Al composites sintered at 520 ℃ exhibits a thermal conductivity of 189 W/(m·K), a coefficient of thermal expansion(50-200 ℃) of 10.03×10~(-6) K~(-1) and a bending strength of 649 MPa. The high thermal and mechanical properties can be ascribed to the nearly full density and the well interfacial bonding between the alloy matrix and the SiC particles. This work provides a promising pathway for producing materials to meet the needs of high performance electronic packaging.
50 vol.% SiC_p/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient of thermal expansion and bending strength of the SiC_p/Al composites were carefully investigated. The results show that the SiC_p/Al composites sintered at 520 ℃ exhibits a thermal conductivity of 189 W/(m·K), a coefficient of thermal expansion(50-200 ℃) of 10.03×10~(-6) K~(-1) and a bending strength of 649 MPa. The high thermal and mechanical properties can be ascribed to the nearly full density and the well interfacial bonding between the alloy matrix and the SiC particles. This work provides a promising pathway for producing materials to meet the needs of high performance electronic packaging.
引文
[1]TAN Zhan-qiu,LI Zhi-qiang,FAN Gen-lian,KAI Xi-zhou,JI Gang,ZHANG Lan-ting,ZHANG Di.Fabrication of diamond/aluminum composites by vacuum hot pressing:Process optimization and thermal properties[J].Composites Part B:Engineering,2013,47:173-180.
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[3]WANG Shi-ren,QIU Jing-jing.Enhancing thermal conductivity of glass fiber/polymer composites through carbon nanotubes incorporation[J].Composites Part B:Engineering,2010,41(7):533-536.
[4]YOSHIDA K,MORIGAMI H.Thermal properties of diamond/copper composite material[J].Microelectronics Reliability,2004,44(2):303-308.
[5]MIZUUCHI K,INOUE K,AGARI Y,SUGIOKA M,TANAKA M,TAKEUCHI T,TANI J,KAWAHARA M,MAKINO Y,ITO M.Bimodal and monomodal diamond particle effect on the thermal properties of diamond-particle-dispersed Al-matrix composite fabricated by SPS[J].Microelectronics Reliability,2014,54(11):2463-2470.
[6]CHU Ke,JIA Cheng-chang,TIAN Wen-huai,LIANG Xue-bing,CHEN Hui,GUO Hong.Thermal conductivity of spark plasma sintering consolidated SiCp/Al composites containing pores:Numerical study and experimental validation[J].Composites Part A:Applied Science and Manufacturing,2010,41(1):161-167.
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[8]YOSHIOKA T,MAKINO Y,MIYAKE S.Influence of phase change in intergranular oxides to thermal conductivity of AlN sintered by millimeter-wave heating[J].Journal of the Japan Society of Powder and Powder Metallurgy,2003,50(11):916-920.
[9]XUE C,YU J K.Enhanced thermal transfer and bending strength of SiC/Al composite with controlled interfacial reaction[J].Materials and Design,2014,53(1):74-78.
[10]WAND Dong-mei,ZHENG Zhi-xiang,LV Jun,XU Guang-qing,ZHOU Shi-ang,TANG Wen-ming,WU Yu-cheng.Enhanced thermal conductive 3D-SiC/Al-Si-Mg interpenetrating composites fabricated by pressureless infiltration[J].Ceramics International,2017,43(2):1755-1761.
[11]MIZUUCHI K,INOUE K,AGARI Y,NAGAOKA T,SUGIOKA M,TANAKA M,TAKEUCHI T,TANI J,KAWAHARA M,MAKINO Y,ITO M.Processing of Al/SiC composites in continuous solid-liquid co-existent state by SPS and their thermal properties[J].Composites Part B:Engineering,2012,43(4):2012-2019.
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[14]KUMARI L,ZHANG T,DU G H,LI W Z,WANG Q W,DATYE A,WU K H.Thermal properties of CNT-Alumina nanocomposites[J].Composites Science and Technology,2008,68(9):2178-2183.
[15]DASH K,CHAIRA D,RAY B C.Synthesis and characterization of aluminium-alumina micro-and nano-composites by spark plasma sintering[J].Materials Research Bulletin,2013,48(7):2535-2542.
[16]ELDESOUKY A,JOHNSSON M,SVENGREN H,ATTALLAH MM,SALEM H G.Effect of grain size reduction of AA2124 aluminum alloy power compacted by spark plasma sintering[J].Journal of Alloys and Compounds.2014,609:215-221.
[17]WU Chuan-dong,FANG Pan,LUO Guo-qiang,CHEN Fei,SHENQiang,ZHANG Lian-meng,ENRIQUE J L.Effect of plasma activated sintering parameters on microstructure and mechanical properties of Al-7075/B4C composites[J].Journal of Alloys and Compounds,2014,615:276-282.
[18]AKIN I,HOTTA M,SAHIN F C,YUCEL O,GOLLER G,GOTO T.Microstructure and densification of ZrB2-SiC composites prepared by spark plasma sintering[J].Journal of the European Ceramic Society,2009,29(11):2379-2385.
[19]LIU Pei,WANG Ai-qin,XIE Jing-pei,HAO Shi-ming.Characterization and evaluation of interface in SiCp/Al composite[J].Transactions of Nonferrous Metals Society of China,2015,25(5):1410-1418.
[20]HUANG Dan,CHEN Wei-ping,ZHANG Shao-yang,HE Zeng-xian.Dry friction and wear performance of SiC 3D continuous ceramic frame reinforced 7075Al alloy[J].Transactions of Nonferrous Metals Society of China,2010,20(1):54-58.
[21]MEIR S,KALABUKHOV S,FROUMIN N,DARIEL M P,FRAGEN.Synthesis and densification of transparent magnesium aluminate spinel by SPS processing[J].Journal of the American Ceramic Society,2009,92(2):358-364.
[22]KIM G S,SHIN D H,SEO Y I,KIM Y D.Microstructure and mechanical properties of a ZnS-SiO2 composite prepared by ball-milling and spark plasma sintering[J].Materials Characterization,2008,59(9):1201-1205.
[23]ZHANG Zhao-hui,WANG Fu-chi,LUO Jie,LEE Shu-kui,WANGLu.Microstructures and mechanical properties of spark plasma sintered Al-SiC composites containing high volume fraction of SiC[J].Materials Science and Engineering A,2010,527(27-28):7235-7240.
[24]VANMEENSEL K,LAPTEV A,HENNICKE J,VLEUGELS J,OVD B.Modelling of the temperature distribution during field assisted sintering[J].Acta Materialia,2005,53(16):4379-4388.
[25]YIN Fa-zhang,GUO Hong,JIA Cheng-chang,ZHANG Xi-min,ZHANG Yong-zhong.High thermal conductivity SiCp/Al electronic packaging materials by spark plasma sintering[J].Acta Materiae Compositae Sinica,2010,27(1):57-61.
[26]ZENG Jing,PENG Chao-qun,WANG Ri-chu,WANG Xiao-feng.Research and development of metal matrix composites for electronic packaging[J].The Chinese Journal of Nonferrous Metals,2015,25(12):3255-3270.(in Chinese)
[27]MAO Xue-zhi,HONG Yu,WANG Bin-hao,LIU Jun-wu,ZHANGYu-jun,FENG Dong,YANG Lei,SHI Chang-dong,WU Yu-cheng,TANG Wen-ming.Fabrication,microstructures and properties of50 vol.-%SiCp/6061Al composites via a pressureless sintering technique[J].Powder Metallurgy,2017(9):1-9.
[28]LYNCH J F,SPINDEL R C,SANG C C,MILLER J H,BIRDSALLT G.Results from the 1984 Marginal Ice Zone Experiment preliminary tomography transmissions:Implications for marginal ice zone,Arctic,and surface wave tomography[J].Journal of Composite Materials,1987,21:508-515
[29]MOLINA J M,PRIETO R,NARCISO J,LOUIS E.The effect of porosity on the thermal conductivity of Al-12wt.%Si/SiCcomposites[J].Scripta Mater,2009,60:582-585.
[30]TURNER P S.Thermal expansion stresses in reinforced plastics[J].Journal of Research of the National Bureau of Standards,1946,37:239-250.
[31]KERNER E H.The elastic and thermo-elastic properties of composite media[J].Proceedings of the Physical Society:Section B,1956,69:808-813.
[32]LEMIEUX S,ELOMARI S,NEMES J A,SKIBO M D.Thermal expansion of isotropic duralcan metal-matrix composites[J].Journal of Materials Science,1998,33(17):4381-4387.
[33]SANCHEZ J M,ALVAREZ M,RODRIGUEZ N,ARISTIZABAL M.Effect of Ni powder characteristics on the consolidation of ultrafine TiMoCN cermets by means of SPS and HIP technologies[J].Materials Science and Engineering A,2009,500(1-2):225-232.
[34]SHEN Y L,WILLIAMS J J,PIOTROWSKI G,CHAWLA N,GUOY L.Correlation between tensile and indentation behavior of particlereinforced metal matrix composites:an experimental and numerical study[J].Acta Materialia,2001,49(16):3219-3229.
[2]YU J H,WANG C B,SHEN Q,ZHANG L M.Preparation and properties of Sip/Al composites by spark plasma sintering[J].Materials and Design,2012,41:198-202.
[3]WANG Shi-ren,QIU Jing-jing.Enhancing thermal conductivity of glass fiber/polymer composites through carbon nanotubes incorporation[J].Composites Part B:Engineering,2010,41(7):533-536.
[4]YOSHIDA K,MORIGAMI H.Thermal properties of diamond/copper composite material[J].Microelectronics Reliability,2004,44(2):303-308.
[5]MIZUUCHI K,INOUE K,AGARI Y,SUGIOKA M,TANAKA M,TAKEUCHI T,TANI J,KAWAHARA M,MAKINO Y,ITO M.Bimodal and monomodal diamond particle effect on the thermal properties of diamond-particle-dispersed Al-matrix composite fabricated by SPS[J].Microelectronics Reliability,2014,54(11):2463-2470.
[6]CHU Ke,JIA Cheng-chang,TIAN Wen-huai,LIANG Xue-bing,CHEN Hui,GUO Hong.Thermal conductivity of spark plasma sintering consolidated SiCp/Al composites containing pores:Numerical study and experimental validation[J].Composites Part A:Applied Science and Manufacturing,2010,41(1):161-167.
[7]LORENTZEN T,CLARKE A P,POULSEN H F,GARBE S,GRAAFSMA H.Local strain contours around inclusions in wire-drawn CuW composites[J].Composites Part A:Applied Science and Manufacturing,1997,28(7):667-674.
[8]YOSHIOKA T,MAKINO Y,MIYAKE S.Influence of phase change in intergranular oxides to thermal conductivity of AlN sintered by millimeter-wave heating[J].Journal of the Japan Society of Powder and Powder Metallurgy,2003,50(11):916-920.
[9]XUE C,YU J K.Enhanced thermal transfer and bending strength of SiC/Al composite with controlled interfacial reaction[J].Materials and Design,2014,53(1):74-78.
[10]WAND Dong-mei,ZHENG Zhi-xiang,LV Jun,XU Guang-qing,ZHOU Shi-ang,TANG Wen-ming,WU Yu-cheng.Enhanced thermal conductive 3D-SiC/Al-Si-Mg interpenetrating composites fabricated by pressureless infiltration[J].Ceramics International,2017,43(2):1755-1761.
[11]MIZUUCHI K,INOUE K,AGARI Y,NAGAOKA T,SUGIOKA M,TANAKA M,TAKEUCHI T,TANI J,KAWAHARA M,MAKINO Y,ITO M.Processing of Al/SiC composites in continuous solid-liquid co-existent state by SPS and their thermal properties[J].Composites Part B:Engineering,2012,43(4):2012-2019.
[12]SAHINER A,BEDIR F,YILMAZ N.Characteristic properties of Al-Cu-SiCp,and Al-Cu-B4Cp,composites produced by hot pressing method under nitrogen atmosphere[J].Materials and Design,2007,28(4):1238-1244.
[13]TENG Fei,YU Kun,LUO Jie,FANG Hong-jie,SHI Chun-li,DAIYi-long,XIONG Han-qing.Microstructures and properties of Al-50%SiC composites for electronic packaging applications[J].Transactions of Nonferrous Metals Society of China,2016,26(10):2647-2652.
[14]KUMARI L,ZHANG T,DU G H,LI W Z,WANG Q W,DATYE A,WU K H.Thermal properties of CNT-Alumina nanocomposites[J].Composites Science and Technology,2008,68(9):2178-2183.
[15]DASH K,CHAIRA D,RAY B C.Synthesis and characterization of aluminium-alumina micro-and nano-composites by spark plasma sintering[J].Materials Research Bulletin,2013,48(7):2535-2542.
[16]ELDESOUKY A,JOHNSSON M,SVENGREN H,ATTALLAH MM,SALEM H G.Effect of grain size reduction of AA2124 aluminum alloy power compacted by spark plasma sintering[J].Journal of Alloys and Compounds.2014,609:215-221.
[17]WU Chuan-dong,FANG Pan,LUO Guo-qiang,CHEN Fei,SHENQiang,ZHANG Lian-meng,ENRIQUE J L.Effect of plasma activated sintering parameters on microstructure and mechanical properties of Al-7075/B4C composites[J].Journal of Alloys and Compounds,2014,615:276-282.
[18]AKIN I,HOTTA M,SAHIN F C,YUCEL O,GOLLER G,GOTO T.Microstructure and densification of ZrB2-SiC composites prepared by spark plasma sintering[J].Journal of the European Ceramic Society,2009,29(11):2379-2385.
[19]LIU Pei,WANG Ai-qin,XIE Jing-pei,HAO Shi-ming.Characterization and evaluation of interface in SiCp/Al composite[J].Transactions of Nonferrous Metals Society of China,2015,25(5):1410-1418.
[20]HUANG Dan,CHEN Wei-ping,ZHANG Shao-yang,HE Zeng-xian.Dry friction and wear performance of SiC 3D continuous ceramic frame reinforced 7075Al alloy[J].Transactions of Nonferrous Metals Society of China,2010,20(1):54-58.
[21]MEIR S,KALABUKHOV S,FROUMIN N,DARIEL M P,FRAGEN.Synthesis and densification of transparent magnesium aluminate spinel by SPS processing[J].Journal of the American Ceramic Society,2009,92(2):358-364.
[22]KIM G S,SHIN D H,SEO Y I,KIM Y D.Microstructure and mechanical properties of a ZnS-SiO2 composite prepared by ball-milling and spark plasma sintering[J].Materials Characterization,2008,59(9):1201-1205.
[23]ZHANG Zhao-hui,WANG Fu-chi,LUO Jie,LEE Shu-kui,WANGLu.Microstructures and mechanical properties of spark plasma sintered Al-SiC composites containing high volume fraction of SiC[J].Materials Science and Engineering A,2010,527(27-28):7235-7240.
[24]VANMEENSEL K,LAPTEV A,HENNICKE J,VLEUGELS J,OVD B.Modelling of the temperature distribution during field assisted sintering[J].Acta Materialia,2005,53(16):4379-4388.
[25]YIN Fa-zhang,GUO Hong,JIA Cheng-chang,ZHANG Xi-min,ZHANG Yong-zhong.High thermal conductivity SiCp/Al electronic packaging materials by spark plasma sintering[J].Acta Materiae Compositae Sinica,2010,27(1):57-61.
[26]ZENG Jing,PENG Chao-qun,WANG Ri-chu,WANG Xiao-feng.Research and development of metal matrix composites for electronic packaging[J].The Chinese Journal of Nonferrous Metals,2015,25(12):3255-3270.(in Chinese)
[27]MAO Xue-zhi,HONG Yu,WANG Bin-hao,LIU Jun-wu,ZHANGYu-jun,FENG Dong,YANG Lei,SHI Chang-dong,WU Yu-cheng,TANG Wen-ming.Fabrication,microstructures and properties of50 vol.-%SiCp/6061Al composites via a pressureless sintering technique[J].Powder Metallurgy,2017(9):1-9.
[28]LYNCH J F,SPINDEL R C,SANG C C,MILLER J H,BIRDSALLT G.Results from the 1984 Marginal Ice Zone Experiment preliminary tomography transmissions:Implications for marginal ice zone,Arctic,and surface wave tomography[J].Journal of Composite Materials,1987,21:508-515
[29]MOLINA J M,PRIETO R,NARCISO J,LOUIS E.The effect of porosity on the thermal conductivity of Al-12wt.%Si/SiCcomposites[J].Scripta Mater,2009,60:582-585.
[30]TURNER P S.Thermal expansion stresses in reinforced plastics[J].Journal of Research of the National Bureau of Standards,1946,37:239-250.
[31]KERNER E H.The elastic and thermo-elastic properties of composite media[J].Proceedings of the Physical Society:Section B,1956,69:808-813.
[32]LEMIEUX S,ELOMARI S,NEMES J A,SKIBO M D.Thermal expansion of isotropic duralcan metal-matrix composites[J].Journal of Materials Science,1998,33(17):4381-4387.
[33]SANCHEZ J M,ALVAREZ M,RODRIGUEZ N,ARISTIZABAL M.Effect of Ni powder characteristics on the consolidation of ultrafine TiMoCN cermets by means of SPS and HIP technologies[J].Materials Science and Engineering A,2009,500(1-2):225-232.
[34]SHEN Y L,WILLIAMS J J,PIOTROWSKI G,CHAWLA N,GUOY L.Correlation between tensile and indentation behavior of particlereinforced metal matrix composites:an experimental and numerical study[J].Acta Materialia,2001,49(16):3219-3229.
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