微量稀土Ce对Sn-Cu-Ni钎料焊点可靠性影响的研究
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摘要
近年来,无铅钎料的研究一直是热点课题,但是完全实现无铅钎料的商业化生产与应用,仍有许多问题需要深入研究。本文以无铅钎料Sn-0.5Cu-0.05Ni为主要研究对象,在其中添加不同含量的稀土铈,较为系统地研究了微量稀土铈对Sn-Cu-Ni无铅钎料的物理性能、润湿性能与焊点可靠性的影响。
添加微量的稀土铈对Sn-Cu-Ni钎料的熔化温度和密度的影响不大,而电阻率有所上升,但低于传统的Sn-37Pb钎料的电阻率,说明该钎料具有良好的电流传输能力,可以减少电路中的发热。
采用铺展性试验方法和润湿平衡法测试了Sn-Cu-Ni-Ce无铅钎料的润湿性,结果表明,在相同温度与相同气氛下,微量稀土铈的加入可提高Sn-Cu-Ni无铅钎料的润湿性能,且N2保护和温度升高能更进一步提高钎料的润湿性,但温度不能过高,由于熔融钎料表面氧化,温度过高对改善钎料润湿性的作用有所削弱。
对Sn-Cu-Ni-Ce无铅钎料焊点进行了力学性能测试,并分析了钎料的显微组织,结果表明,Sn-Cu-Ni钎料中添加适量的稀土铈,能够细化钎料组织,从而提高焊点的力学性能。当铈的含量为0.05%左右时,焊点的力学性能达到最佳值。铈含量超过0.05%后,继续增大稀土铈的添加量,Sn-Cu-Ni钎料的显微组织中出现黑色的稀土脆性化合物,焊点力学性能也随之有所下降。
研究了在热循环试验条件下片式电阻Sn-Cu-Ni-Ce焊点力学性能的变化规律。结果表明,随着热循环次数的增加,片式电阻Sn-Cu-Ni-Ce焊点的剪切力逐渐降低;在长时间热循环条件下,焊点开始萌生裂纹,导致焊点可靠性下降。研究结果对新型Sn-Cu-Ni-Ce无铅钎料的发展与应用有较好的理论指导意义。
The research in lead-free solder alloy has been a popular topic in recent years, but a lot of problems in full commercial production and application of lead-free solder must be studied in detail. Based on Sn-0.5Cu-0.05Ni lead-free solder, effects of rare earth Cerium on physical properties, wettability and reliability of soldered joints were studied.
The addition of Cerium has little effect on melting temperature and density of Sn-Cu-Ni lead-free solder. Its resistivity is lower than traditional Sn-Pb solder, which indicated that the alloy has an excellent electrical transmit ability and it can reduce the heat produced in the electrocircuit.
The wettability of Sn-Cu-Ni-Ce solder on Cu substrate was investigated by spreading area method and wetting balance testing method. The results show that the wettability of solder can be improved by adding minute amount of Cerium under the condition of same temperature and atmosphere. Both N2 atmosphere and heading up of the temperature can improve the wettability, but the temperature can’t be too high, or it will reduce the wettability.
Mechanical properties of soldered joints and the microstructure of Sn-Cu-Ni-Ce solder were investigated respectively. The results indicate that with the increase of the content of Ce added to the Sn-Cu-Ni solder, the microstructure of Sn-Cu-Ni solder is fine and uniform, so the mechanical properties of soldered joints are improved observably. Experimental results also show that the optimum mechanical properties of joints are obtained when the content of Ce is about 0.05% which added to the Sn-Cu-Ni solder. However, when the content of Ce is over 0.05%, some black and brickle compounds show up, and the mechanical properties of soldered joints deteriorate as well.
The influence of thermal cycling on mechanical property of the chip resistor joints which soldered with Sn-Cu-Ni-Ce solder was studied. The results indicate that with the increase of thermal cycling times, the shear forces of the chip resistor joints soldered with Sn-Cu-Ni-Ce solder decreased gradually, and the reliability of soldered joints decreased as well after long time cycling as a result of the existence of crack in soldered joint. The research results have favorable guidance meaning for the development and application of novel Sn-Cu-Ni-Ce lead free solder.
添加微量的稀土铈对Sn-Cu-Ni钎料的熔化温度和密度的影响不大,而电阻率有所上升,但低于传统的Sn-37Pb钎料的电阻率,说明该钎料具有良好的电流传输能力,可以减少电路中的发热。
采用铺展性试验方法和润湿平衡法测试了Sn-Cu-Ni-Ce无铅钎料的润湿性,结果表明,在相同温度与相同气氛下,微量稀土铈的加入可提高Sn-Cu-Ni无铅钎料的润湿性能,且N2保护和温度升高能更进一步提高钎料的润湿性,但温度不能过高,由于熔融钎料表面氧化,温度过高对改善钎料润湿性的作用有所削弱。
对Sn-Cu-Ni-Ce无铅钎料焊点进行了力学性能测试,并分析了钎料的显微组织,结果表明,Sn-Cu-Ni钎料中添加适量的稀土铈,能够细化钎料组织,从而提高焊点的力学性能。当铈的含量为0.05%左右时,焊点的力学性能达到最佳值。铈含量超过0.05%后,继续增大稀土铈的添加量,Sn-Cu-Ni钎料的显微组织中出现黑色的稀土脆性化合物,焊点力学性能也随之有所下降。
研究了在热循环试验条件下片式电阻Sn-Cu-Ni-Ce焊点力学性能的变化规律。结果表明,随着热循环次数的增加,片式电阻Sn-Cu-Ni-Ce焊点的剪切力逐渐降低;在长时间热循环条件下,焊点开始萌生裂纹,导致焊点可靠性下降。研究结果对新型Sn-Cu-Ni-Ce无铅钎料的发展与应用有较好的理论指导意义。
The research in lead-free solder alloy has been a popular topic in recent years, but a lot of problems in full commercial production and application of lead-free solder must be studied in detail. Based on Sn-0.5Cu-0.05Ni lead-free solder, effects of rare earth Cerium on physical properties, wettability and reliability of soldered joints were studied.
The addition of Cerium has little effect on melting temperature and density of Sn-Cu-Ni lead-free solder. Its resistivity is lower than traditional Sn-Pb solder, which indicated that the alloy has an excellent electrical transmit ability and it can reduce the heat produced in the electrocircuit.
The wettability of Sn-Cu-Ni-Ce solder on Cu substrate was investigated by spreading area method and wetting balance testing method. The results show that the wettability of solder can be improved by adding minute amount of Cerium under the condition of same temperature and atmosphere. Both N2 atmosphere and heading up of the temperature can improve the wettability, but the temperature can’t be too high, or it will reduce the wettability.
Mechanical properties of soldered joints and the microstructure of Sn-Cu-Ni-Ce solder were investigated respectively. The results indicate that with the increase of the content of Ce added to the Sn-Cu-Ni solder, the microstructure of Sn-Cu-Ni solder is fine and uniform, so the mechanical properties of soldered joints are improved observably. Experimental results also show that the optimum mechanical properties of joints are obtained when the content of Ce is about 0.05% which added to the Sn-Cu-Ni solder. However, when the content of Ce is over 0.05%, some black and brickle compounds show up, and the mechanical properties of soldered joints deteriorate as well.
The influence of thermal cycling on mechanical property of the chip resistor joints which soldered with Sn-Cu-Ni-Ce solder was studied. The results indicate that with the increase of thermal cycling times, the shear forces of the chip resistor joints soldered with Sn-Cu-Ni-Ce solder decreased gradually, and the reliability of soldered joints decreased as well after long time cycling as a result of the existence of crack in soldered joint. The research results have favorable guidance meaning for the development and application of novel Sn-Cu-Ni-Ce lead free solder.
引文
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[3]菅沼克昭.无铅焊接技术[M].宁晓山,译.北京:科学出版社, 2004. 48~50.
[4]刘汉诚,汪正平,李宁成,等.电子制造技术[M].姜岩峰,张常年,译.北京:化学工业出版社, 2005. 221~227.
[5]郭福.无铅钎焊技术与应用[M].北京:科学出版社, 2006. 1~5.
[6] Abtew M, Selvaduray G. Lead-free solders in microelectronics[J]. Material Science and Engineering: R, 2000, 27(5): 95~141.
[7]张文典.实用表面组装技术[M].北京:电子工业出版社, 2006. 150~180.
[8]周甘宇. Sn-Zn系和Sn-Cu系无铅焊锡的研制[D].长沙:中南大学, 2004.
[9]虞自基.环境中微量重金属元素的污染危害与迁移转移[M].北京:科学出版社, 1987. 18~25.
[10] Bill Trumble. Get the Lead out. IEEE Spetrum. 1998: 55~60.
[11] Bannos T S. Lead-Free Solder to Meet New Drinking Water Regulations[J]. Welding Journal, 1988: 23~26.
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