粗铝丝超声引线键合强度在线监测方法研究
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摘要
粗铝丝超声引线键合强度对超声功率、键合力、键合时间等因素敏感,实现键合强度的在线监测对于提高键合可靠性具有重要的工程价值。针对当前缺乏有效的在线键合强度预测方法的现状,本文提出了通过实时在线分析换能器驱动电流、建立电流信号与强度之间的关联规律,来监测并估计键合强度的方法。主要工作包括：
1.基于U3000型粗铝丝引线键合机,建立了粗铝丝引线键合强度在线监测实验平台,搭建了换能器驱动电流信号传感电路,开发了基于NI数据采集卡PCI6110及LabView的超声引线键合过程信号监测系统；比较分析了反映键合过程的四种信号,确定并选择换能器驱动电流信号为超声引线键合过程监测信号；通过键合点的抗剪切试验,获得了反映键合点强度的抗剪切力数据。
2.分析比较了主要时频分析方法,根据换能器驱动电流信号变化快的特点,选择小波包变换和Wigner-Ville变换作为主要的信号分析方法。获得了驱动电流信号反映的键合过程特征,包括键合过程系统消耗的平均能量、键合过程系统消耗能量的变化程度、键合中后期的系统消耗能量的变化等12个特征,并初步分析了上述特征与强度间的关联关系。
3.建立了基于人工神经网络的粗铝丝超声引线键合强度在线监测系统,针对典型的键合条件,选择了键合过程系统消耗的平均能量、键合过程系统消耗能量的变化程度、键合中后期的系统消耗能量的变化等8种特征作为输入,键合强度作为输出,采集了120组实际键合过程数据,对人工神经网络进行训练,获得了信号特征与键合强度之间的关联关系。并将上述系统应用于U3000粗铝丝超声引线键合机,实现了键合失败的实时在线识别和键合强度的实时在线估测。
The bond quality of the aluminum wire bond is sensitive to ultrasonic power, bond force, bond time etc. Realizing the bond quality on-line monitoring is very valuable to improve the bond reliability. Contraposing the absence of the methods of effective on-line bond quality forecast, a method was proposed that is obtaining the relations between the current signals and bond quality through the analysis of the transducer drive current.
1. An on-line quality monitoring system of the aluminum wire bond was constructed based on the aluminum wire bonder U3000.The sensing circuit was constructed.The signals monitoring system of ultrasonic wire bond was developed based on PCI6110 and LabView. The bonding quality data were gathered by the offline destructive tests.
2. The main time-frequency analysis methods were contrasted. According to the characteristics of levity of transducer drive current, the analysis method was found based on wavelet and wavelet package,12 features were selected, such as consumed average energy, changing extent of consumed average energy of bond process, change of consumed energy of upper bond process etc. The relations between the current signals and bond quality were analyzed briefly.
3. Contraposing the typical bond conditions,8 features were selected, such as consumed average energy, changing extent of consumed average energy of bond process, change of consumed energy of upper bond process etc. An artificial neural network was set up using these features qua input, bond quality qua output. The relations between the current signals and bond quality were acquired by neural network training. The above methods were applied in the aluminum wire bonder U3000. The recognition of bond failure and estimate of bond quality were realized.
1.基于U3000型粗铝丝引线键合机,建立了粗铝丝引线键合强度在线监测实验平台,搭建了换能器驱动电流信号传感电路,开发了基于NI数据采集卡PCI6110及LabView的超声引线键合过程信号监测系统；比较分析了反映键合过程的四种信号,确定并选择换能器驱动电流信号为超声引线键合过程监测信号；通过键合点的抗剪切试验,获得了反映键合点强度的抗剪切力数据。
2.分析比较了主要时频分析方法,根据换能器驱动电流信号变化快的特点,选择小波包变换和Wigner-Ville变换作为主要的信号分析方法。获得了驱动电流信号反映的键合过程特征,包括键合过程系统消耗的平均能量、键合过程系统消耗能量的变化程度、键合中后期的系统消耗能量的变化等12个特征,并初步分析了上述特征与强度间的关联关系。
3.建立了基于人工神经网络的粗铝丝超声引线键合强度在线监测系统,针对典型的键合条件,选择了键合过程系统消耗的平均能量、键合过程系统消耗能量的变化程度、键合中后期的系统消耗能量的变化等8种特征作为输入,键合强度作为输出,采集了120组实际键合过程数据,对人工神经网络进行训练,获得了信号特征与键合强度之间的关联关系。并将上述系统应用于U3000粗铝丝超声引线键合机,实现了键合失败的实时在线识别和键合强度的实时在线估测。
The bond quality of the aluminum wire bond is sensitive to ultrasonic power, bond force, bond time etc. Realizing the bond quality on-line monitoring is very valuable to improve the bond reliability. Contraposing the absence of the methods of effective on-line bond quality forecast, a method was proposed that is obtaining the relations between the current signals and bond quality through the analysis of the transducer drive current.
1. An on-line quality monitoring system of the aluminum wire bond was constructed based on the aluminum wire bonder U3000.The sensing circuit was constructed.The signals monitoring system of ultrasonic wire bond was developed based on PCI6110 and LabView. The bonding quality data were gathered by the offline destructive tests.
2. The main time-frequency analysis methods were contrasted. According to the characteristics of levity of transducer drive current, the analysis method was found based on wavelet and wavelet package,12 features were selected, such as consumed average energy, changing extent of consumed average energy of bond process, change of consumed energy of upper bond process etc. The relations between the current signals and bond quality were analyzed briefly.
3. Contraposing the typical bond conditions,8 features were selected, such as consumed average energy, changing extent of consumed average energy of bond process, change of consumed energy of upper bond process etc. An artificial neural network was set up using these features qua input, bond quality qua output. The relations between the current signals and bond quality were acquired by neural network training. The above methods were applied in the aluminum wire bonder U3000. The recognition of bond failure and estimate of bond quality were realized.
引文
[1]何田.引线键合技术的现状和发展趋势.电子工业专用设备,2004,33(10)：12-14
[2]朱正宇,胡巧声.半导体封装超声波压焊的工艺参数优化.电子工业专用设备,2006,134(3)：55-60
[3]葛劢冲.微电子封装中芯片焊接技术及其设备的发展.电子工业专用设备,2000,Vol.29,No.4,5-10
[4]黄玉财.集成电路封装中的引线键合技术.电子与封装,2006(39),16-20
[5]何田.引线键合技术的现状与发展趋势.电子工业专用设备,2004,117(10)：12-14
[6]邱颖霞.微波多芯片组件中的微连接.电子工艺技术,2005,26(11)：319-322
[7]黄玉财.集成电路封装中的引线键合技术.电子与封装,200,6(7)：16-20
[8]高荣之,韩雷.键合力对超声键合换能系统振动影响的时频分析.中国机械工程,2007,18(15)：1825-1829
[9]Dehaine G, Kurzweil K, Lewandowski P. Crossing the 200 wire barrier in VLSI bonding. In:Proceedings of the 1984 International Symposium on Microelectronics. Dallas, TX, USA.1984,353-357
[10]Murals S, Srlkanth N, Grains C J. Deformation substructures and slip bands observed in thermosonic copper ball bonding. Materials characterization,2003, 50(10):39-50
[11]Jeon I. The study on failure mechanisms of bond pad metal peeling. Numerical analysis, Microelectronics reliability,2003,43(12):2055-2064
[12]高荣芝,韩雷.键合压力对粗铝丝引线键合强度的实验研究.压电与声光,2007,29(3)：366-369
[13]Rooney D T, Nager D, Gelger P et al. Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds. Microelectronics reliability,2005,45(2):379-390
[14]高荣芝.小波分析用于超声键合机理的实验研究.中南大学硕士论文,2007
[15]许文虎.基于激光Doppler测试超声换能系统动态特性研究.中南大学硕士论文,2006
[16]Landes J L. Ultrasonic Bond Energy Monitor. US Patent:4341574,1982-7-27
[17]刘长宏,高健,陈新等.键合工艺参数对封装质量的影响因素分析.半导体技术,2006,31(11)：828-832
[18]王福亮,韩雷,钟掘.超声功率对粗铝丝超声引线键合强度的影响,中国机械工程,2005,10(16)：919-923
[19]Shih-Fu Ling, Dong Zhang, Sung Yi et al. Real-Time Quality Evaluation of Wire Bonding Using Input Impedance. IEEE Transactions On Electronics Packaging Manufacturing,2006,29(4):280-284
[20]Michael Brokelmann, Jorg Wallaschek et al. Bond Process Monitoring via Self-Sensing Piezoelectric Transducers. In:2004 IEEE International Ultrasonic, Ferroelectrics, and Frequency Control Joint 50th Anniversary Conference,2004, 125-129
[21]Or S. W., Chan H. L., W. Lo V. C. et al. Ultrasonic wire bond quality monitoring using piezoelectric sensor. Sens. Actuators,1998,65(1):69-75
[22]Zschimmer G. Ultraschall-Sonotrade. German patent:DE2946154A1, 1981-06-11
[23]Pufall R. Automatic process control of wire bonding. in Proc. Electron. Compon. Technol. Conf.,1993,159-162
[24]Goebel B, Ziemann A. Quality control for wire bonding. European patent: EP0368533,1990-05-16
[25]Meusel E. Lasergestutztes Sensorsystem zur Online-Prozesskontrolle fur das Ultrachall-Bonden von Mikrosystemen(LASOP-MST). BMBF joint research project,1999,9(16):470-473
[26]Mayer M, Schwizer J. Microelectronic bonding processes monitored by integrated sensors. Sensors Update,2002,20(11):219-277
[27]隆志力,吴运新,韩雷,段吉安.引线键合劈刀超声振动信号的时频分析.振动、测试与诊断,2007,26(4)：296-332
[28].吕雷.键合过程中换能系统振动的关联维数和Lyapunov指数实验研究.中南大学硕士论文,2009
[29]微讯U-3000超声波粗铝丝压焊机使用说明书.深圳：深圳市微讯自动化设备有限公司,2004.
[30]Chiu S S. Chan H LW. Or SW. et al. Effect of electrode pattern on the outputs of piezosensors for wire bonding process control. Materials Science and Engineering,2003, B99(12):121-126
[31]王福亮,李军辉,韩雷等.热超声倒装键合界面的运动传递过程,机械工 程学报,2008,44(2)：68-73
[32]Polytec. PSV-400 Scanning Vibrometer. Waldbronn:Polytec GmbH,2004
[33]Dage Group, Dage Series 4000 & 5000 Guide, Aylesbury:Dage Precision Industries Ltd,2004
[34]彭玉华.小波变换与工程应用.北京：科学出版社,2002,85-94
[35]Janssen A. Gabor representation of generalized functions.1981,38(8):377-394
[36]Allen J B. Rabiner L R. A unified approach to short-time Fourier analysis. Proc. IEEE,1997,65(11):1558-1564
[37]Czerwinski R N. Jones D L. Adaptive short-time Fourier analysis. IEEE Signal Processing Letters,1997,4(2):42-45
[38]王宏禹.非平稳信号分析与处理.北京：国防工业出版社,1999,152-166
[39]Cohen L. Time-frequency distribution a review. Proc. of IEEE,1989,77(7), 25-35
[40]姚天任,孙洪.现代数字信号处理.武汉：华中理工大学出版社,1999,78-92
[41]程正兴.小波分析算法与应用.西安：西安交通大学出版社,1998
[42]秦前清,杨宗凯.实用小波分析.西安：西安电子科技大学出版社,1994,56-63
[43]赵松年,熊小云.子波变化与子波分析.北京：电子工业出版社,1996,121-127
[44]冉启文.小波分析方法及应用.哈尔滨：哈尔滨工业大学出版社,1995,81-86
[45]唐向红,贺振华,谢书琴.小波分析与应用.成都：四川科学技术出版社,1999,56-68
[46]崔锦泰,程正兴译.小波分析导论.西安：西安交通大学出版社,1995,45-58
[47]Burra C, Gopiath R A, Guo H.小波与小波变换导论(英文版).北京：机械工业出版社,2005,75-90
[48]唐向宏,李齐良.时频分析与小波变换.北京：科学出版社,2008,221-228
[49]张哗.信号时频分析及应用.哈尔滨：哈尔滨工业大学出版社,2006,117-146
[50]Cohen L. Time-Frequency Analysis. New York:Prentice-Hall,1995,30-36
[51]Higrid Daubechies著,李建平,杨万年译.小波十讲.北京：国防工业出版社,2004.127-151
[52]王旭,王宏,王文辉.人工神经元网络原理及应用(第二版).沈阳：东北 大学出版社,2007,19-37
[53]陈祥光,裴旭东.人工神经网络技术及应用.北京：中国电力出版社,2003,19-31
[54]冯定.神经网络专家系统.北京：科学出版社,2006,12-30
[55]Widrow B.30 Years of Adaptive Neural Networks:Perceptron, Madaline, and Backpropagation. Proceedings of the IEEE,1990,78(9):27-53
[2]朱正宇,胡巧声.半导体封装超声波压焊的工艺参数优化.电子工业专用设备,2006,134(3)：55-60
[3]葛劢冲.微电子封装中芯片焊接技术及其设备的发展.电子工业专用设备,2000,Vol.29,No.4,5-10
[4]黄玉财.集成电路封装中的引线键合技术.电子与封装,2006(39),16-20
[5]何田.引线键合技术的现状与发展趋势.电子工业专用设备,2004,117(10)：12-14
[6]邱颖霞.微波多芯片组件中的微连接.电子工艺技术,2005,26(11)：319-322
[7]黄玉财.集成电路封装中的引线键合技术.电子与封装,200,6(7)：16-20
[8]高荣之,韩雷.键合力对超声键合换能系统振动影响的时频分析.中国机械工程,2007,18(15)：1825-1829
[9]Dehaine G, Kurzweil K, Lewandowski P. Crossing the 200 wire barrier in VLSI bonding. In:Proceedings of the 1984 International Symposium on Microelectronics. Dallas, TX, USA.1984,353-357
[10]Murals S, Srlkanth N, Grains C J. Deformation substructures and slip bands observed in thermosonic copper ball bonding. Materials characterization,2003, 50(10):39-50
[11]Jeon I. The study on failure mechanisms of bond pad metal peeling. Numerical analysis, Microelectronics reliability,2003,43(12):2055-2064
[12]高荣芝,韩雷.键合压力对粗铝丝引线键合强度的实验研究.压电与声光,2007,29(3)：366-369
[13]Rooney D T, Nager D, Gelger P et al. Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds. Microelectronics reliability,2005,45(2):379-390
[14]高荣芝.小波分析用于超声键合机理的实验研究.中南大学硕士论文,2007
[15]许文虎.基于激光Doppler测试超声换能系统动态特性研究.中南大学硕士论文,2006
[16]Landes J L. Ultrasonic Bond Energy Monitor. US Patent:4341574,1982-7-27
[17]刘长宏,高健,陈新等.键合工艺参数对封装质量的影响因素分析.半导体技术,2006,31(11)：828-832
[18]王福亮,韩雷,钟掘.超声功率对粗铝丝超声引线键合强度的影响,中国机械工程,2005,10(16)：919-923
[19]Shih-Fu Ling, Dong Zhang, Sung Yi et al. Real-Time Quality Evaluation of Wire Bonding Using Input Impedance. IEEE Transactions On Electronics Packaging Manufacturing,2006,29(4):280-284
[20]Michael Brokelmann, Jorg Wallaschek et al. Bond Process Monitoring via Self-Sensing Piezoelectric Transducers. In:2004 IEEE International Ultrasonic, Ferroelectrics, and Frequency Control Joint 50th Anniversary Conference,2004, 125-129
[21]Or S. W., Chan H. L., W. Lo V. C. et al. Ultrasonic wire bond quality monitoring using piezoelectric sensor. Sens. Actuators,1998,65(1):69-75
[22]Zschimmer G. Ultraschall-Sonotrade. German patent:DE2946154A1, 1981-06-11
[23]Pufall R. Automatic process control of wire bonding. in Proc. Electron. Compon. Technol. Conf.,1993,159-162
[24]Goebel B, Ziemann A. Quality control for wire bonding. European patent: EP0368533,1990-05-16
[25]Meusel E. Lasergestutztes Sensorsystem zur Online-Prozesskontrolle fur das Ultrachall-Bonden von Mikrosystemen(LASOP-MST). BMBF joint research project,1999,9(16):470-473
[26]Mayer M, Schwizer J. Microelectronic bonding processes monitored by integrated sensors. Sensors Update,2002,20(11):219-277
[27]隆志力,吴运新,韩雷,段吉安.引线键合劈刀超声振动信号的时频分析.振动、测试与诊断,2007,26(4)：296-332
[28].吕雷.键合过程中换能系统振动的关联维数和Lyapunov指数实验研究.中南大学硕士论文,2009
[29]微讯U-3000超声波粗铝丝压焊机使用说明书.深圳：深圳市微讯自动化设备有限公司,2004.
[30]Chiu S S. Chan H LW. Or SW. et al. Effect of electrode pattern on the outputs of piezosensors for wire bonding process control. Materials Science and Engineering,2003, B99(12):121-126
[31]王福亮,李军辉,韩雷等.热超声倒装键合界面的运动传递过程,机械工 程学报,2008,44(2)：68-73
[32]Polytec. PSV-400 Scanning Vibrometer. Waldbronn:Polytec GmbH,2004
[33]Dage Group, Dage Series 4000 & 5000 Guide, Aylesbury:Dage Precision Industries Ltd,2004
[34]彭玉华.小波变换与工程应用.北京：科学出版社,2002,85-94
[35]Janssen A. Gabor representation of generalized functions.1981,38(8):377-394
[36]Allen J B. Rabiner L R. A unified approach to short-time Fourier analysis. Proc. IEEE,1997,65(11):1558-1564
[37]Czerwinski R N. Jones D L. Adaptive short-time Fourier analysis. IEEE Signal Processing Letters,1997,4(2):42-45
[38]王宏禹.非平稳信号分析与处理.北京：国防工业出版社,1999,152-166
[39]Cohen L. Time-frequency distribution a review. Proc. of IEEE,1989,77(7), 25-35
[40]姚天任,孙洪.现代数字信号处理.武汉：华中理工大学出版社,1999,78-92
[41]程正兴.小波分析算法与应用.西安：西安交通大学出版社,1998
[42]秦前清,杨宗凯.实用小波分析.西安：西安电子科技大学出版社,1994,56-63
[43]赵松年,熊小云.子波变化与子波分析.北京：电子工业出版社,1996,121-127
[44]冉启文.小波分析方法及应用.哈尔滨：哈尔滨工业大学出版社,1995,81-86
[45]唐向红,贺振华,谢书琴.小波分析与应用.成都：四川科学技术出版社,1999,56-68
[46]崔锦泰,程正兴译.小波分析导论.西安：西安交通大学出版社,1995,45-58
[47]Burra C, Gopiath R A, Guo H.小波与小波变换导论(英文版).北京：机械工业出版社,2005,75-90
[48]唐向宏,李齐良.时频分析与小波变换.北京：科学出版社,2008,221-228
[49]张哗.信号时频分析及应用.哈尔滨：哈尔滨工业大学出版社,2006,117-146
[50]Cohen L. Time-Frequency Analysis. New York:Prentice-Hall,1995,30-36
[51]Higrid Daubechies著,李建平,杨万年译.小波十讲.北京：国防工业出版社,2004.127-151
[52]王旭,王宏,王文辉.人工神经元网络原理及应用(第二版).沈阳：东北 大学出版社,2007,19-37
[53]陈祥光,裴旭东.人工神经网络技术及应用.北京：中国电力出版社,2003,19-31
[54]冯定.神经网络专家系统.北京：科学出版社,2006,12-30
[55]Widrow B.30 Years of Adaptive Neural Networks:Perceptron, Madaline, and Backpropagation. Proceedings of the IEEE,1990,78(9):27-53
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