电子封装材料用新型环氧树脂的制备及性能研究
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摘要
在过去的几十年间,人类应用半导体科技制造出高能量、高密度的仪器设备,给全世界带来了飞速的发展。近年来对先进封装材料的研究提出了迫切的需要。电子封装技术是集电子信息科学,机械,热学,化学,材料学,制造学和系统技术等多种学科于一身的技术。环氧树脂塑封料是一种重要的集成电路封装材料。本论文针对目前国内环氧树脂封装材料的现状以及国内外发展的情况,从三个大的方面进行了研究。
一,从分子结构设计的角度出发,制备了三种不同结构的环氧树脂。1有针对性的合成多芳香型环氧树脂。2对双环戊二烯酚型环氧树脂的制备工艺及性质进行了相关研究。3新酚环氧树脂的合成。
二,制备了环氧树脂/蒙脱土复合材料。其力学性能都较单纯的环氧树脂固化物优异
三,联苯型环氧树脂中试合成。在基础研究的前提下,对已有的四甲基联苯二酚型环氧树脂进行了中试合成实验,该实验对合成工艺、放大反应效应以及产量等等进行了研究。
In the past few decades, the application of semiconductor technology to produce high-energy, high-density equipment makes the world the rapid development. In recent years, the study of advanced packaging materials is in urgent needs. Electronic Packaging, by definition, set of materials science and production technology together, will be converted to intensive components of electronic circuits. The main features of Electronic Packaging include: to provide access for the IC supply current; the IC chip cooling; in sub-signal integrated circuit chip faction; the protection of IC circuitry from environmental erosion. Electronic packaging technology is a set of electronic information science, mechanical, thermal, chemistry, materials science, manufacturing science and systems technology in a variety of technical disciplines.
Electronic Packaging began 30 years ago. At that time there were two major categories of metal and ceramic shell closure. We can roughly summarize the development process of packaging: materials are metals, ceramics→ceramics, plastics→plastic. Compared with other electronic packaging materials, polymer-based electronic packaging materials (mainly plastic packaging material) are insulation, light weight, low cost, low linear expansion coefficient, and excellent dielectric properties and so on. Polymer packaging materials are mainly used in thermosetting polymers, mainly phenolic classes, polyester, epoxy and silicone. Among them, the most widely used epoxy resin.
Epoxy molding compounds is an important integrated circuit packaging materials. Standard epoxy plastic materials, mainly by the epoxy resin, filler, curing agent, curing accelerators, flame retardants and other additives, such as components of the composition. Good processability. The invention of epoxy resin has experienced quite a long period of time, its industrial production and application is only a matter of nearly 40 years. Epoxy resin developed by China began in 1956, in Shenyang, Shanghai, the two first obtain a success. After more than 40 years of efforts, China's production and application of epoxy resin has been rapid development and now has reached more than 100 manufacturers, has formed from the monomer, resin, auxiliary materials, research and development, production to application of the integrated industrial system.
The development of packaging materials for epoxy face these challenges, the people tried a lot of work. Halogen-free flame retardant epoxy resin molding materials and lead-free solder-resistant epoxy resin molding materials are currently the most promising alternative to traditional plastic materials, high-performance epoxy resins for electronic packaging materials. New high-performance epoxy resin molding material has tremendous technical content as well as the commercial value of electronic packaging materials have become a hot topic within the research field as one. IC in foreign countries, the development trend of high integration, cabling miniaturization, the chip real large-scale and surface mounting technology, our links with the corresponding plastic materials research and development has also revert to the material with high purity, low stress, low expansion and lowα-rays, high heat resistance and other performance characteristics of direction.
In this study, epoxy resin packaging material for the current domestic status quo, as well as the development of the situation at home and abroad, from the three major aspects of the study.
1, from the molecular structure of the design point of view, three different structures were prepared by epoxy resin. First through the biphenyl dimethyl ether condensation reaction of phenol and phenol methanol synthesis off a number of aromatic resin, and then through ring-opening reaction of epichlorohydrin synthesis of chloro-ether, and then with sodium hydroxide, hydrogen chloride took place off the closed-loop response synthesis of a number of aromatic epoxy resin. Two-step Preparation of epoxy resin containing the diphenyl ether structure. Through the epoxy value of the determination of infrared test for multi-aromatic epoxy resin was characterized by the structure of the test show that the synthesis product of the product structure, in line with expectations, and the epoxy value of access to the request; in subsequent tests, we confirmed the structure of the product, multi-hydroxy disappearance of aromatic resin, epoxy-based college, at the same time identify the structure of main chain methylene and phenyl absorption peaks did not change, which is consistent with expectations. Performance tests show that more aromatic epoxy resin epoxy value of access requirements, and two kinds of curing system, Tg in the 142 - 165℃, 5% weight loss temperature of 350℃and above all, a 10% weight loss in more than 390℃, has a good heat-resistant, showing the potential of materials used in electronic packaging. 2 pairs of dicyclopentadiene phenol epoxy resin and preparation process and the nature of the relevant studies. The successful synthesis of a dicyclopentadiene phenol epoxy resin, the product of the IR analysis results show that: through the reaction of epoxy group has been successful in being added to the resin molecules. TGA results of analysis showed that: synthetic resin in the 200℃below have good stability. State of relatively soft synthetic resin, epoxy value is also low, hope we can be improved for the synthesis. 3 new phenol epoxy resin synthesis. The new phenolic resin of the two methanol and phenol benzene as raw materials are added at 75℃p-toluenesulfonic acid as a catalyst, the reaction for three hours available to a new phenolic prepolymer. Preparation of a new phenol epoxy resin conditions: a four-butyl bromide, amine as a catalyst in the temperature is 80℃, epichlorohydrin: two pairs of benzene methanol = 10:1, reaction of 7 hours, and then through the crude, refined, Synthesis of high-quality chlorine epoxy resins. Adding Zn powder, obtained by making a large extent, a new phenolic resin color.
2, The Preparation of epoxy-montmorillonite composites materials. Electronic Packaging Materials to join a large number of inorganic filler. It is reported in the literature, and in the polymer by adding inorganic fillers than normal, adding nano-inorganic materials, polymer enhanced, toughening, glass transition temperature increase has a more pronounced effect. With cetyltrimethyl ammonium bromide treatment of Ca-montmorillonite (Ca-MMT), Ca-MMT layer spacing to 2.21 nm. Non-isothermal DSC method to study the E-51 epoxy / Ca-MMT system, curing reaction kinetics by the Kissinger method, obtained the apparent activation energy (AE) is 59.9 kJ / mol, according to Crane theory, calculated reaction order of 0.89, using XRD by means of organic Ca-MMT in epoxy resin and peel behavior of intercalation. The results show, Ca-MMT content and epoxy resin with the organic Ca-MMT mixture of curing temperature and time were right, after stripping the composite impact under certain conditions, can be exfoliated nanocomposites.
3, Pilot plant of biphenyl type epoxy resin synthesized. The experience we have adopted is similar to zoom with a combination of pilot response. In the context of basic research, we have already tetramethylbenzidine hydroquinone type epoxy resin synthesis carried out pilot experiments, the experiment on the synthesis process, amplification reactions effects and production, etc. were studied.
一,从分子结构设计的角度出发,制备了三种不同结构的环氧树脂。1有针对性的合成多芳香型环氧树脂。2对双环戊二烯酚型环氧树脂的制备工艺及性质进行了相关研究。3新酚环氧树脂的合成。
二,制备了环氧树脂/蒙脱土复合材料。其力学性能都较单纯的环氧树脂固化物优异
三,联苯型环氧树脂中试合成。在基础研究的前提下,对已有的四甲基联苯二酚型环氧树脂进行了中试合成实验,该实验对合成工艺、放大反应效应以及产量等等进行了研究。
In the past few decades, the application of semiconductor technology to produce high-energy, high-density equipment makes the world the rapid development. In recent years, the study of advanced packaging materials is in urgent needs. Electronic Packaging, by definition, set of materials science and production technology together, will be converted to intensive components of electronic circuits. The main features of Electronic Packaging include: to provide access for the IC supply current; the IC chip cooling; in sub-signal integrated circuit chip faction; the protection of IC circuitry from environmental erosion. Electronic packaging technology is a set of electronic information science, mechanical, thermal, chemistry, materials science, manufacturing science and systems technology in a variety of technical disciplines.
Electronic Packaging began 30 years ago. At that time there were two major categories of metal and ceramic shell closure. We can roughly summarize the development process of packaging: materials are metals, ceramics→ceramics, plastics→plastic. Compared with other electronic packaging materials, polymer-based electronic packaging materials (mainly plastic packaging material) are insulation, light weight, low cost, low linear expansion coefficient, and excellent dielectric properties and so on. Polymer packaging materials are mainly used in thermosetting polymers, mainly phenolic classes, polyester, epoxy and silicone. Among them, the most widely used epoxy resin.
Epoxy molding compounds is an important integrated circuit packaging materials. Standard epoxy plastic materials, mainly by the epoxy resin, filler, curing agent, curing accelerators, flame retardants and other additives, such as components of the composition. Good processability. The invention of epoxy resin has experienced quite a long period of time, its industrial production and application is only a matter of nearly 40 years. Epoxy resin developed by China began in 1956, in Shenyang, Shanghai, the two first obtain a success. After more than 40 years of efforts, China's production and application of epoxy resin has been rapid development and now has reached more than 100 manufacturers, has formed from the monomer, resin, auxiliary materials, research and development, production to application of the integrated industrial system.
The development of packaging materials for epoxy face these challenges, the people tried a lot of work. Halogen-free flame retardant epoxy resin molding materials and lead-free solder-resistant epoxy resin molding materials are currently the most promising alternative to traditional plastic materials, high-performance epoxy resins for electronic packaging materials. New high-performance epoxy resin molding material has tremendous technical content as well as the commercial value of electronic packaging materials have become a hot topic within the research field as one. IC in foreign countries, the development trend of high integration, cabling miniaturization, the chip real large-scale and surface mounting technology, our links with the corresponding plastic materials research and development has also revert to the material with high purity, low stress, low expansion and lowα-rays, high heat resistance and other performance characteristics of direction.
In this study, epoxy resin packaging material for the current domestic status quo, as well as the development of the situation at home and abroad, from the three major aspects of the study.
1, from the molecular structure of the design point of view, three different structures were prepared by epoxy resin. First through the biphenyl dimethyl ether condensation reaction of phenol and phenol methanol synthesis off a number of aromatic resin, and then through ring-opening reaction of epichlorohydrin synthesis of chloro-ether, and then with sodium hydroxide, hydrogen chloride took place off the closed-loop response synthesis of a number of aromatic epoxy resin. Two-step Preparation of epoxy resin containing the diphenyl ether structure. Through the epoxy value of the determination of infrared test for multi-aromatic epoxy resin was characterized by the structure of the test show that the synthesis product of the product structure, in line with expectations, and the epoxy value of access to the request; in subsequent tests, we confirmed the structure of the product, multi-hydroxy disappearance of aromatic resin, epoxy-based college, at the same time identify the structure of main chain methylene and phenyl absorption peaks did not change, which is consistent with expectations. Performance tests show that more aromatic epoxy resin epoxy value of access requirements, and two kinds of curing system, Tg in the 142 - 165℃, 5% weight loss temperature of 350℃and above all, a 10% weight loss in more than 390℃, has a good heat-resistant, showing the potential of materials used in electronic packaging. 2 pairs of dicyclopentadiene phenol epoxy resin and preparation process and the nature of the relevant studies. The successful synthesis of a dicyclopentadiene phenol epoxy resin, the product of the IR analysis results show that: through the reaction of epoxy group has been successful in being added to the resin molecules. TGA results of analysis showed that: synthetic resin in the 200℃below have good stability. State of relatively soft synthetic resin, epoxy value is also low, hope we can be improved for the synthesis. 3 new phenol epoxy resin synthesis. The new phenolic resin of the two methanol and phenol benzene as raw materials are added at 75℃p-toluenesulfonic acid as a catalyst, the reaction for three hours available to a new phenolic prepolymer. Preparation of a new phenol epoxy resin conditions: a four-butyl bromide, amine as a catalyst in the temperature is 80℃, epichlorohydrin: two pairs of benzene methanol = 10:1, reaction of 7 hours, and then through the crude, refined, Synthesis of high-quality chlorine epoxy resins. Adding Zn powder, obtained by making a large extent, a new phenolic resin color.
2, The Preparation of epoxy-montmorillonite composites materials. Electronic Packaging Materials to join a large number of inorganic filler. It is reported in the literature, and in the polymer by adding inorganic fillers than normal, adding nano-inorganic materials, polymer enhanced, toughening, glass transition temperature increase has a more pronounced effect. With cetyltrimethyl ammonium bromide treatment of Ca-montmorillonite (Ca-MMT), Ca-MMT layer spacing to 2.21 nm. Non-isothermal DSC method to study the E-51 epoxy / Ca-MMT system, curing reaction kinetics by the Kissinger method, obtained the apparent activation energy (AE) is 59.9 kJ / mol, according to Crane theory, calculated reaction order of 0.89, using XRD by means of organic Ca-MMT in epoxy resin and peel behavior of intercalation. The results show, Ca-MMT content and epoxy resin with the organic Ca-MMT mixture of curing temperature and time were right, after stripping the composite impact under certain conditions, can be exfoliated nanocomposites.
3, Pilot plant of biphenyl type epoxy resin synthesized. The experience we have adopted is similar to zoom with a combination of pilot response. In the context of basic research, we have already tetramethylbenzidine hydroquinone type epoxy resin synthesis carried out pilot experiments, the experiment on the synthesis process, amplification reactions effects and production, etc. were studied.
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