LTCF无源集成铁氧体材料及器件研究
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摘要
LTCF(Low Temperature Co-fired Ferrite)材料和器件技术可以满足现代电子系统小型化、轻量化和集成化的发展要求，目前已成为最具发展潜力的无源集成技术。
本论文主要针对LTCF无源集成铁氧体材料和器件展开研究，首先从烧结热力学理论和传质动力学理论角度分析了影响低温烧结铁氧体材料烧结性能的关键因素；然后分别采用氧化物法和溶胶-凝胶法进行了ZL120型低温烧结NiCuZn铁氧体材料的研制，通过对材料配方设计、掺杂方案以及制备工艺途径的对比实验和优化改进，研制出了高性能的低温烧结铁氧体材料，在此基础上，借助HFSS和ADS软件进行了片式电感、电容以及LC滤波器的的结构设计和性能仿真；最后，采用研制的低温烧结NiCuZn铁氧体材料并基于优化的片式器件设计结构，在LTCC工艺线上进行了片式电感和LC组合滤波器的实际研制，取得了较为满意的效果，为LTCF无源集成铁氧体材料及器件技术的研究奠定了很好的理论和实践基础。
在低温烧结NiCuZn铁氧体材料研制过程中，本文首先研究了主配方中CuO含量对材料烧结特性、微观形貌以及电磁性能的影响，确定当主配方中CuO含量为10mol％时能较好的兼顾材料低温烧结和高电磁性能的目标要求。然后通过对比实验研究了V_2O_5、SiO_2、Bi_2O_3等低熔氧化物掺杂对NiCuZn材料烧结特性和电磁性能的影响。随后，在V_2O_5和Bi_2O_3掺杂的基础上，复合掺入WO_3和CO_2O_3以进一步提升材料的品质因数。最终确定当掺杂组合方式为1wt％Bi_2O_3+0．2wt％Co_2O_3时能获得最佳的材料电磁性能，满足ZL120型低温烧结NiCuZn铁氧体材料的研制目标要求。为了和氧化物法低温烧结铁氧体研制工艺途径加以对比，本论文还采取溶胶-凝胶法进行了ZL120型低温烧结NiCuZn铁氧体的试制研究。通过实验发现，借助溶胶-凝胶法制备超细铁氧体微粉的高表面自由能，同样可以显著的促进材料的低温烧结并获得较好的电磁性能。由于材料制备过程中未进行任何低熔氧化物的掺杂，因此材料的烧结密度和磁导率都稍低于氧化物法掺杂制备的样品，但却能够获得更高的品质因数。
在进行LTCF无源片式器件研究过程中，本论文首先借助Ansoft-HFSS和Agilent-ADS软件对LTCC电感、电容进行三维建模和电磁场仿真。研究了片式电感模型中各个结构参数对电感性能的影响，并推导出了在特定片式电感结构参数下，其电感量与绕匝数之间的计算关系为L_(eff)=116．25×N~(1．67)nH。随后，在片式电感和电容的研究上，进行了一款LTCC复合片式器件一抗EMI滤波器的结构设计和性能仿真。最后，基于本文研制的低温烧结NiCuZn铁氧体材料，在电子科大LTCC工艺线上进行了片式电感和抗EMI滤波器的实际研制。经验证，实际制备的片式电感的感量比仿真预测值偏低一些，这主要是由于片式电感磁芯的磁导率与标样环有一定差异的缘故；而研制的0805型片式EMI滤波器的插损特性与仿真预测值也比较接近，满足了设计目标的要求。
The technology of LTCF (Low Temperature Co-fired Ferrite) materials and elements can satisfy the requirements of miniaturization, low weight and high integration developments of modern electronic systems and become the major and key technology for passive integration.
This paper focused the theoretical investigations on low temperature co-fired ferrite and correlative elements. Firstly, the sintering and transfering kinetics of the ferrite were analyzed to give directions to density the ferrite under low sintering temperature. Then the mixed-oxide method and sol-gel method were adopted to produce the ZL120 NiCuZn ferrite. In this process, effects of compositions, procedure methods and additives on sintering behaviors and magnetic properties of the ferrite had been investigated. Then, the HFSS and ADS softwares had been adopted to optimize the structure of the multilayer chip inductor, multilayer chip capacitor and multilayer chip filter. By using the produced NiCuZn ferrite and the LTCC technical line, we developed high performance multilayer chip inductors and multilayer chip filters.
In the process of the ferrite research, the influences of compositions on the sintering behaviors, microstructures and magnetic properties of the ferrite were first investigated. It was confirmed that 10mol% CuO content was appropriate to give attention to both low-fired characteristic and good magnetic properties of the NiCuZn ferrite. Then the influences of V_2O_5, SiO_2 and Bi_2O_3 additives on the densification behaviors and magnetic properties of the ferrite were studied. Subsequently, on the base of V_2O_5 and Bi_2O_3 additives, WO_3 and Co_2O_3 additives were also added to further improve Q-factor. Finally, the optimal additives were chosen as 1wt%Bi_2O_3 + 0.2wt%Co_2O_3 to obtain the ZL120 NiCuZn ferrite. To compare with the mixed-oxide method, then the sol-gel method was adopted to produce the ZL120 NiCuZn ferrite. It was found that nanocrystalline ferrite particles enhanced densification of the samples obviously due to high surface free energy. Furthermore, higher Q-factor could be obtained due to no sintering aids added.In the process of the LTCC elements research, the Ansoft-HFSS and Agilent-ADS softwares were adopted to design, emulate and optimize the multilayer chip inductor and capacitor firstly. Effect of model parameters on the properties of the inductor were studied, and the calculated formula between inductance (L_(eff)) and circles (N) was deducted, which was L_(eff)=116.25×N~(1.67)nH. Subsequently, based on the investigations of multilayer chip inductor and capacitor, we designed and emulated a kind of anti-EMI LTCC filter. Finally, the prepared ZL120 NiCuZn ferrite was chosen to produce the LTCC chip inductor and filter by adopting LTCC technical line. It was confirmed that the produced inductance value was lower than the forecast, which was mainly due to debasement of the permeability. The insertion loss of the LTCC filter was close to the forecast and meet the request.
本论文主要针对LTCF无源集成铁氧体材料和器件展开研究，首先从烧结热力学理论和传质动力学理论角度分析了影响低温烧结铁氧体材料烧结性能的关键因素；然后分别采用氧化物法和溶胶-凝胶法进行了ZL120型低温烧结NiCuZn铁氧体材料的研制，通过对材料配方设计、掺杂方案以及制备工艺途径的对比实验和优化改进，研制出了高性能的低温烧结铁氧体材料，在此基础上，借助HFSS和ADS软件进行了片式电感、电容以及LC滤波器的的结构设计和性能仿真；最后，采用研制的低温烧结NiCuZn铁氧体材料并基于优化的片式器件设计结构，在LTCC工艺线上进行了片式电感和LC组合滤波器的实际研制，取得了较为满意的效果，为LTCF无源集成铁氧体材料及器件技术的研究奠定了很好的理论和实践基础。
在低温烧结NiCuZn铁氧体材料研制过程中，本文首先研究了主配方中CuO含量对材料烧结特性、微观形貌以及电磁性能的影响，确定当主配方中CuO含量为10mol％时能较好的兼顾材料低温烧结和高电磁性能的目标要求。然后通过对比实验研究了V_2O_5、SiO_2、Bi_2O_3等低熔氧化物掺杂对NiCuZn材料烧结特性和电磁性能的影响。随后，在V_2O_5和Bi_2O_3掺杂的基础上，复合掺入WO_3和CO_2O_3以进一步提升材料的品质因数。最终确定当掺杂组合方式为1wt％Bi_2O_3+0．2wt％Co_2O_3时能获得最佳的材料电磁性能，满足ZL120型低温烧结NiCuZn铁氧体材料的研制目标要求。为了和氧化物法低温烧结铁氧体研制工艺途径加以对比，本论文还采取溶胶-凝胶法进行了ZL120型低温烧结NiCuZn铁氧体的试制研究。通过实验发现，借助溶胶-凝胶法制备超细铁氧体微粉的高表面自由能，同样可以显著的促进材料的低温烧结并获得较好的电磁性能。由于材料制备过程中未进行任何低熔氧化物的掺杂，因此材料的烧结密度和磁导率都稍低于氧化物法掺杂制备的样品，但却能够获得更高的品质因数。
在进行LTCF无源片式器件研究过程中，本论文首先借助Ansoft-HFSS和Agilent-ADS软件对LTCC电感、电容进行三维建模和电磁场仿真。研究了片式电感模型中各个结构参数对电感性能的影响，并推导出了在特定片式电感结构参数下，其电感量与绕匝数之间的计算关系为L_(eff)=116．25×N~(1．67)nH。随后，在片式电感和电容的研究上，进行了一款LTCC复合片式器件一抗EMI滤波器的结构设计和性能仿真。最后，基于本文研制的低温烧结NiCuZn铁氧体材料，在电子科大LTCC工艺线上进行了片式电感和抗EMI滤波器的实际研制。经验证，实际制备的片式电感的感量比仿真预测值偏低一些，这主要是由于片式电感磁芯的磁导率与标样环有一定差异的缘故；而研制的0805型片式EMI滤波器的插损特性与仿真预测值也比较接近，满足了设计目标的要求。
The technology of LTCF (Low Temperature Co-fired Ferrite) materials and elements can satisfy the requirements of miniaturization, low weight and high integration developments of modern electronic systems and become the major and key technology for passive integration.
This paper focused the theoretical investigations on low temperature co-fired ferrite and correlative elements. Firstly, the sintering and transfering kinetics of the ferrite were analyzed to give directions to density the ferrite under low sintering temperature. Then the mixed-oxide method and sol-gel method were adopted to produce the ZL120 NiCuZn ferrite. In this process, effects of compositions, procedure methods and additives on sintering behaviors and magnetic properties of the ferrite had been investigated. Then, the HFSS and ADS softwares had been adopted to optimize the structure of the multilayer chip inductor, multilayer chip capacitor and multilayer chip filter. By using the produced NiCuZn ferrite and the LTCC technical line, we developed high performance multilayer chip inductors and multilayer chip filters.
In the process of the ferrite research, the influences of compositions on the sintering behaviors, microstructures and magnetic properties of the ferrite were first investigated. It was confirmed that 10mol% CuO content was appropriate to give attention to both low-fired characteristic and good magnetic properties of the NiCuZn ferrite. Then the influences of V_2O_5, SiO_2 and Bi_2O_3 additives on the densification behaviors and magnetic properties of the ferrite were studied. Subsequently, on the base of V_2O_5 and Bi_2O_3 additives, WO_3 and Co_2O_3 additives were also added to further improve Q-factor. Finally, the optimal additives were chosen as 1wt%Bi_2O_3 + 0.2wt%Co_2O_3 to obtain the ZL120 NiCuZn ferrite. To compare with the mixed-oxide method, then the sol-gel method was adopted to produce the ZL120 NiCuZn ferrite. It was found that nanocrystalline ferrite particles enhanced densification of the samples obviously due to high surface free energy. Furthermore, higher Q-factor could be obtained due to no sintering aids added.In the process of the LTCC elements research, the Ansoft-HFSS and Agilent-ADS softwares were adopted to design, emulate and optimize the multilayer chip inductor and capacitor firstly. Effect of model parameters on the properties of the inductor were studied, and the calculated formula between inductance (L_(eff)) and circles (N) was deducted, which was L_(eff)=116.25×N~(1.67)nH. Subsequently, based on the investigations of multilayer chip inductor and capacitor, we designed and emulated a kind of anti-EMI LTCC filter. Finally, the prepared ZL120 NiCuZn ferrite was chosen to produce the LTCC chip inductor and filter by adopting LTCC technical line. It was confirmed that the produced inductance value was lower than the forecast, which was mainly due to debasement of the permeability. The insertion loss of the LTCC filter was close to the forecast and meet the request.
引文
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