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新型化学镀法制备木质电磁屏蔽材料的研究
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摘要
木材化学镀是木材功能性改良的一种重要手段,在保留木材优异特性基础上赋予其良好的导电及电磁屏蔽性能,拓展了木材的应用领域。目前,木材化学镀尚存在镀铜还原剂的有毒性、活化工艺成本过高及镀层颜色单一等问题。本研究针对以上问题,开展新型木材化学镀制备电磁屏蔽材料的相关研究。
     以桦木、水曲柳为基材,以表面电阻率及金属沉积率为主要指标探讨最佳施镀效果。主要包括四部分内容:(1)探讨以离子钯活化、乙醛酸为还原剂的全新的镀铜镀液及施镀条件;(2)研究活化与施镀一浴完成的新型非钯活化木材表面化学镀铜的镀液体系及条件;(3)通过彩化处理,赋予镀层丰富的颜色,探索彩化工艺条件及颜色形成机理;(4)以XPS、SEM-EDS、XRD对镀层成分、形貌和结构进行表征,并对导电性、电磁屏蔽性能、色度、光泽度、润湿性、结合强度进行测定。
     研究得出的结论归纳如下:
     (1)乙醛酸为还原剂的木材化学镀铜,离子钯活化最佳条件为壳聚糖8g/L,处理时间8min,壳聚糖吸附氯化钯时间8min,2g/L次亚磷酸钠处理时间8min;适合桦木的镀液及条件为:硫酸铜20g/L,EDTA-2Na40g/L,乙醛酸7.5g/L,联吡啶0.01g/L,添加剂L为0.015g/L, pH值12,温度55℃,施镀时间30min;适合水曲柳的镀液及条件为:硫酸铜12g/L, EDTA·2Na40g/L,乙醛酸10.5g/L,联吡啶0.01G/L,添加剂L为0.01g/L, pH值12,温度50℃,施镀时间30min。
     EDS和XPS结果表明镀层由单质铜组成,与乙醛酸还原机理吻合,XRD分析表明镀层铜为晶态结构,SEM观察发现镀铜单板表面镀覆均匀并具有金属光泽。桦木、水曲柳镀铜单板电磁屏蔽效能在9kHz~1.5GHz频段分别达到55dB和50dB以上;镀层的结合强度分别超过1.08Mpa和1.49Mpa;涂饰使单板的导电性和电磁屏蔽效能略有下降,最低值仍大于44dB,完全满足实际应用需要;经化学镀铜的单板表面由亲水性变为疏水性;施镀后单板颜色在CIEL*a*b*色空间的分布中,a*值变化最为显著;在孟塞尔色系统中桦木和水曲柳单板颜色标注分别为9.8R6.9/10.6和9.8R7.1/10.1,为明度、饱和度较高的橙红色。镀铜桦木和水曲柳单板表面光泽度参数GZL、GZT分别为7.75%、5.21%、和6.15%、3.38%,较素材有所提高。
     (2)非钯活化木材化学镀铜,适合桦木的镀液及条件:NaBH4处理液浓度3g/L,处理时间8min;硫酸铜20g/L、硫酸镍0.55g/L,乙醛酸8.5g/L, EDTA·2Na39g/L,联吡啶0.014g/L,添加剂L0.011g/L, pH值12.25,温度60℃,施镀时间50min;适合水曲柳的镀液及条件:NaBH4处理液3g/L,处理时间10min,硫酸铜18g/L,硫酸镍0.5g/L,乙醛酸8.5g/L, EDTA·2Na39g/L,联吡啶0.008g/L,添加剂L0.011g/L, pH值12.25,温度60℃,施镀时间50min。
     EDS和XPS分析表明,镀层内部为单质铜;XRD结果显示铜镀层为面心立方结构,无Ni的化合物和Cu-Ni合金的形成。桦木、水曲柳单板电磁屏蔽效能在频率9kHz~1.5GHz范围内分别达到60dB及50dB以上;镀层与木材结合强度超过1.22Mpa和1.03Mpa;涂饰使单板导电性和电磁屏蔽效能略有下降,但仍分别大于49dB和37dB,超过实际应用所需标准;镀铜使单板表面具有较好的疏水性;桦木、水曲柳镀铜单板颜色标注分别为9.8R6.2/9.8和9.7R5.9/9.5,颜色为较饱满的橙红色;镀铜单板表面光泽度参数GZL.GZT分别为5.33%、4.35%、水曲柳为3.35%、2.56%,较素材有小幅下降,光泽柔和。
     (3)在彩化过程中,钼酸铵0.25g/L~0.35g/L.次亚磷酸钠0.8g/L~1.0g/L范围内,浓度变化对镀层表面电阻率无明显影响,随着二者浓度的增加,单板表面颜色逐渐变暗,颜色向红色、蓝色过渡较为明显;温度对彩化后镀镍单板表面电阻率没有明显影响,温度升高对彩化反应有一定促进作用,单板明度降低;彩化过程中期,单板整体颜色最暗,饱和度最低,约25min之后颜色饱和度逐渐增大,颜色较为稳定,呈现无明显规律的彩虹颜色。
     XPS和XRD分析结果表明,镍镀层表面经彩化处理生成钼的氧化物膜使镀层产生不同颜色,钼的氧化物未形成结晶,镀层中的Ni仍为晶态结构,SEM表明彩化后单板表面依然被镀层完全覆盖,光泽比彩化前稍有减弱。彩化使单板电磁屏蔽效能下降至40dB左右;涂饰后电磁屏蔽效能下降,最低值仍达到35dB以上;彩化后镀层结合力良好,结合强度均超过2.06MPa;彩化处理使镀镍单板表面的疏水性提高;彩化使单板颜色由中等明度的中性色变为不规律的彩虹颜色,几乎不具有重现性且光泽度下降,光泽各向异性程度降低;涂饰使单板颜色变暗,整体色彩变得柔和。
     通过研究新型木材化学镀制备电磁屏蔽材料及其性能,解决了目前木材化学镀中的镀液组成、活化工艺、镀层颜色等方面存在的相关问题,所得材料具备环境友好、颜色丰富、性能良好等特性,对木材化学镀的工业化生产及实际应用提供了理论依据与实践指导。
Electroless plating on wood surface is an important method for wood functional modification, which can endow wood perfect electro-conductivity and electromagnetic shielding based on maintaining its own special properties. It can enlarge the application field for wood. In present, there exist some problems for electroless plating on wood, such as toxic reducing agent in copper plating on wood, high cost of activation process, and monotonous color of the coatings. In order to overcome those problems, novel electroless plating on wood were conducted for preparing electromagnetic shielding wood-based material.
     The birch and ash veneers were used as the substrate to investigate the suitable plating conditions according to surface resistivity and metal deposition. Four parts were carried out as follows:1) investigating the components of the plating solution and plating conditions for electroless copper plating by using glyoxylic acid as reductant under Pd2+activation;2) discussing the components of the plating solution and plating conditions for electroless copper plating under Pd-free activation that the activation and plating are combined in one bath;3) Endowing colorful surface to the coatings by coloring process for studying the conditions and the coloring mechanism;4) XPS, SEM-DES and XRD analysis were used to characterize the coating component, morphology and structure, respectively. The electro-conductivity, electromagnetic shielding performance, shade of the color, gloss, wettability, and adhesion strength were measured.
     The conclusions were summarized as below:
     (1) In the process of electroless copper plating by using glyoxylic acid as reductant, the suitable activation conditions are8g/L of chitosan treating for8min, Pd2+adsorption for8min and reduce in2g/L of sodium hypophosphite solution for8min. The plating solution composition and conditions for birch veneer are as follows:CuSO420g/L, EDTA·2Na40g/L, glyoxylic acid7.5g/L, Dipyridyl O.Olg/L, additive L0.015g/L, pH value12,55℃for30min. Those for ash veneer are as follows:CuSO412g/L, EDTA·2Na40g/L, glyoxylic acid10.5g/L, Dipyridyl O.Olg/L, additive L O.OlOg/L, pH value12,50℃for30min.
     The EDS and XPS results showed that the coating consists of native copper, which accords with the reducing mechanism of glyoxylic acid. The XRD analysis indicated that the coating is crystalline. SEM observation showed that the coatings with metallic luster covered the surface of wood uniformly. The electromagnetic shielding effectiveness (ESE) of plated birch and ash veneers are55dB and50dB in the frequencies from9kHz to1.5GHz, respectively. The adhesion strength is1.08Mpa and1.49Mpa. Surface decoration made the ESE decrease to44dB, which can still meet the practical application. The surface changed from hydrophilic to hydrophobic after electroless copper plating. In CIEL*a*b*color system, the change a*value of veneers before and after plated is significant. In Munsell system, the color code are9.8R6.9/10.6and9.8R7.1/10.1, indicating that orange-red with high lightness and saturation. The GZL and GZT parameters in gloss measurement of copper plated birch and ash veneers are7.75%,5.21%and6.15%,3.38%, respectively. They are higher than those of pristine wood veneers.
     (2) In the process of electroless copper plating by using Pd free activation, the pretreatment for birch veneer is that the veneers were immersed in3g/L of NaBH4solution for8min. The plating solution composition and conditions for birch veneer are as follows:CuSO420g/L, NiSO40.55g/L, glyoxylic acid8.5g/L, EDTA·2Na39g/L, Dipyridyl0.014g/L, additive L0.011g/L, pH value12.25,60℃for50min. Those for ash veneer are as follows:the pretreatment in3g/L of NaBH4solution for10min, CUSO418g/L, NiSO40.50g/L, glyoxylic acid8.5g/L, EDTA·2Na39g/L, Dipyridyl0.008g/L, additive L0.011g/L, pH value12.25,60℃for50min.
     The EDS, XPS and XRD results showed that the coating consists of native copper with the face-centre cubic structure, which no Ni and N-Cu alloy mixed. The ESE of plated birch and ash veneers are60dB and50dB in the frequencies from9kHz to1.5GHz, respectively. The adhesion strength is more than1.22Mpa and1.03Mpa. Surface decoration made the ESE decrease to49dB and37dB, which can still meet the practical application. The plated veneers have good hydrophobic property. The color codes are9.8R6.9/10.6and9.8R7.1/10.1for plated birch and ash veneers, which indicated full orange-red color. The GZL and GZT parameters in gloss measurement of copper plated birch and ash veneers are5.33%,4.35%and3.35%, 2.56%, respectively. They are lower than those of pristine wood veneers. The sheen is mild.
     (3) In the coloring process, the concentration of ammonium molybdate (0.25-0.35g/L) and sodium hypophosphite (0.8-1.Og/L) had no obvious effects on the surface resistivity of the colored veneer. The color of the veneer became darker and transited to red or blue. The temperature didn't affect the surface resistivity of the colored veneer. However, temperature increase could promote the coloring reaction in some extents. In the middle of the color process, the color and the saturation of the veneer was the darkest and lowest. After25min of coloring process, the saturation gradually increased and the color was tending towards stable iridescence.
     The XPS and XRD results indicated that molybdenum oxide membrane formed and made the coating colorful after coloring process. Molybdenum oxide did not form crystalline structure. But nickel in the coating was still in crystalline style. It was observed by SEM photographs that the veneer surface was still covered by the coating with lower sheen. Coloring process made the ESE decrease, but it was still higher than40dB. Surface decoration made the ESE decrease to35dB, which can still reach the application standard. The adhesion strength is more than2.06Mpa. Coloring treatment made the coating more hydrophobic. The color changed from neutral color with moderate intensity to irregular iridescence before and after coloring process, which showed bad reproducibility. The sheen decreased and the anisotropic property faded down. Decoration made the colored veneer darker and the whole shade became pastel.
     The study of preparing wood-based electromagnetic shielding material and the properties by using novel electoless plating has resolved the key problems in the solution composition, activation conditions and coating colors. The obtained materials are environment friendly, colorful and with good properties, which offered the theory base and practical instruction for commercial produce and application.
引文
[1]成俊卿.木材学.北京:中国林业出版社,1985:186-251
    [2]李坚.木材科学.北京:高等教育出版社,2002:19 84-177
    [3]李坚.生物质复合材料学.北京:科学出版社,2008:40-84
    [4]邬义明.植物纤维化学.中国轻工业出版社,1995:173
    [5]王立娟,李坚.木材化学镀镍工艺学基础.科学出版社,2007(1):43-46
    [6]刘一星,于海鹏,张显权.木质环境的科学评价华中农业大学学报,2003,22(5):499-504.
    [7]李坚,木材科学研究.科学出版社,2009:3-49
    [8]Nakamura M, Masuda M, Imamiehi K. Description of Visual Characteristics of Wood Influencing some Psychological Images. Mokuzai Gakkaishi(Journal of the Japan Wood Research Soeiety.),1996,42(12):1177-1187
    [11]钟克煌,李中怡.屏蔽电磁波干扰的涂料.化工新型材料,1989,17(3):33-35
    [12]杜仕国等.导电高分子复合材料的电磁屏蔽效能分析,玻璃钢/复合材料.2000(11):19-2128
    [13]Eisuke Hanada et al. A Practical Procedure to Prevent Electromagnetic Interference with Electronic Medical Equipment. Journal of Medical Systems.2002,26(1):61-65
    [14]Feldstein M.D. Composite Electroless Nickel Coating for the Aerospace and Airline Industries. Plating and Surface Finishing.1998,85(11):248-252
    [15]张卫东,陶振英.锦州师范学院学报(自然科学版),2001,22(3):59-61
    [16]司琼,董发勤.掺石墨和羟基铁涂料的低频电磁屏蔽性能研究.功能材料,2006,37(6):883-886
    [17]梁韶华,导电高分子材料在电磁屏蔽的效能分析.钦州学院学报,2006,21(6):55-58
    [18]陈贻瑞,王建.基础材料与新材料.天津大学出版社,1999,239-240
    [19]汝强,胡社军等.电磁屏蔽理论及屏蔽材料的制备.包装工程,2004,25(5):21-23
    [20]宋月贤,韦玮,正元锁,徐传镶.用于电磁屏蔽与吸波技术的聚苯胺导电聚合物的研究进展.化工新型材料,2001,28(9):3-7
    [21]Kiyotaka Shibata. Electromagnetic Shielding Properties of Woodceramics Made from Wastepaper. Journal of Porous Materials,1997,4:269-275
    [22]Song Yung Wang, ChungPin Hung. Electromagnetic Shielding Efficiency of the Electric Field of Charcoal from Six Wood Species. J. Wood. Sci,2003,49:450-454
    [23]汝强,胡社军等.电磁屏蔽理论及屏蔽材料的制备.包装工程,2004,25(5):21-23
    [24]Hiromu KAJITA. Recent Trends of Wood-based. CompositePanels[J].木材保存(日),1998,24(6):2-17
    [25]棍田熙.木质ボードの最近の发展.木材学会志,1990,36(8):595-601
    [26]张双保,周宁,赵立.木质复合材料研究.北京木材工业,1997(3):28-33
    [27]富村洋一.Manufacture of Medium Density Fiberboard. Containing Carbon Fibers in the Core Layer[J].木材学会谂,1987,33(8):645-649
    [28]张双保,杨小军.木质复合材料的研究现状与前景[J].建筑人造板,2001(2):3-6
    [29]IvanMakoviny. Contribution to The Electrically Conductive Particleboards Proposal. Drevarskyvyskum,1996,41(4):11-22
    [31]唐尺健司.Electromagnetic Shielding Woody Materials with Carbon[J].木材工业(日),1992,47(7):312-318
    [32]李坚,李桂玲.金属化木材.中国木材,1994,6:19-20
    [33]李坚.走向21世纪的木质复合材料.世界林业研究,1995(3):35-39
    [34]皮锦红,王章忠.木材—金属复合材料的研究现状.南京工程学院学报(自然科学版),2006,4(2):17-21
    [35]朱家琪,罗朝晖,黄泽恩.金属网与木单板的复合.木材工业,2001,15(3):5-7
    [36]朴钟莹,徐守安.Performance Improvement of Medium Density Fiberboard by Combining with Various Nonwood. Materials[J].韩国林业研究院研究报告,1993,47:35-45
    [37]张显权,刘一星.不锈钢纤维/木纤维复合中纤板的研究团.木材工业,2005,19(2):12-16
    [38]Lambuth Alan L. Electrically Conductive Particleboard. Proceedings of The 23rd. International Particleboard/Composite Materials Symposium,1989,117-128
    [39]Shuichi Kawai, Shigehisa Ishihara. Carbon overlaid. Partieleboard as an Electromagnetic Shield and Fiber Resistive Material. International Timber Engineering Conference, 1990:74-79
    [40]刘贤淼.木基电磁屏蔽功能复合材料(叠层型)的工艺与性能,中国林业科学研究院硕士论文,2005:119-121
    [42]周兆,曹建春,汤佩钊等.铝箔覆面刨花板.木材工业,2000,14(1):32-34
    [43]Zenjiro Osawa, Kazunaga Kobayashi. Thermal Stability of Shieding Effectiveness of Electromagnetic Interference of Composites. Journal of Materials Science(Historical Archive),1987,22(12):4381-4387
    [44]H Oka, H Hayakawa. Laminated Impregnated Magnetic Wood Manufacturing Methods and Magnetic Characteristics from DC to 135GHz Band. IEEE Transaetions on Magneties,2002,38(5):3327-3328
    [45]H Oka, A Hojo, H Osada, et al. Manufacturing Methods and Magnetic Characteristies of Magnetic Wood. Journal of Magnetism and Magnetic Materials,2004,272:2332-2334
    [46]H Oka, A Hojo, K Seki, et al. Wood Construction and Magnetic Characteristics of Impregnated Type Magnetic Wood. Journal of Magnetism and Magnetic Materials, 2002,239(1-3):617-619
    [47]邱帖轶.木质电磁屏蔽材料的研究,中国林业科学研究院硕士学位论文,2008
    [48]C. Nagasawa, Y. Kumagai and K. Urabe. Electromagnetic Shielding Effectiveness of Particleboard Containing Nickel-Metalized Wood-Particles in the Core Layer. Journal of Wood Science,1990,36(7):531-537
    [49]C.Nagasawa, Y. Kumagaiand K. Urabe. Electroconductivity and Electromagnetic-Shield ing Effectiveness of Nickel-Plated Veneer. Journal of Wood Science,1991,37(2):158-163
    [50]C. Nagasawa, Y. Kumagai, N. Koshizaki and T. Kanbe. Changes in Electromagnetic Shielding Properties of Particleboards Made of Nickel-Plated Wood Particles. Journal of Wood Science,1992,38(3):256-63
    [51]C. Nagasawa, Y. Kumagai, K. Urabe and S. Shinagawa. Electromagnetic Shielding Particleboard with Nickel-Plated Wood Particles. Journal of Porous Materials,1999,6(3): 247-254
    [52]沈宁一.表面处理工艺手册.上海科技出版社,1991:238
    [53]沈伟.化学镀镍的工业应用.材料保护,1995(9):4-7
    [54]A. Brenner, G. Riddell. Deposition of Nickel and Cobalt by Chemical Reduction[J]. Journal of Research of the National Bureau of Standards,1947,39:385-389
    [55]李宁.化学镀实用技术.化学工业出版社,2004:1-2
    [56]胡文彬,刘磊,仵亚婷.难镀基材的化学镀镍技术.化学工业出版社,2003:3-6
    [57]李能斌,罗韦因,刘钧泉,徐金来.化学镀铜原理、应用及研究展望.电镀与涂饰,2005,24(10):46-50
    [58]王立娟,李坚.木材化学镀镍工艺学基础.科学出版社,2007,1743-46
    [59]Gutzeit G. Reaction Mechanism of Chemical Deposition of Nickel Plating.1959,46(1 1):1275
    [60]黄洁,刘祥萱,吴春,非金属表面化学镀活化方法的研究现状.电镀与涂饰,2008,27(12):14-16
    [61]时刻,黄英,李鹏,廖梓.非金属材料化学镀的应用新进展.玻璃钢/复合材料,2005,2:45
    [62]刘建国,陈存华,郑家燊.非金属材料化学镀工艺中基体表面活化方法的研究.表面技术,2002,31(3):5-8
    [63]Chen Y J, Cao M S, Xu Q, et al. Electroless Nickel Plating on Silicon Carbide Nano part icles. Surface and Coatings Technology,2003,172 (1):90-94
    [64]Qinghua Tian, Xueyi Guo. Electroless Copper Plating on Microcellular Polyurethane Foam. Transactions of Nonferrous Metals Society of China.2010,20:283-287
    [65]Rajendra K A, Yenamandra S, Gunasekaran R A, et al. Electroless Copper Deposition on Silicon with Titanium Seed Layer. Materials Chemistry and Physics,2006,98(1):95-102
    [66]Yutaka Tsuru, Kouji Mochinaga, Yashichi Ooyagi, et al. Application of Vapor-Deposited Carbon and Zinc as Asubstitute for Palladium Catalyst in the Electrolessplating of Nickel[J]. Surface and Coatings Technology,2003:169-170116-119
    [67]Jayanta Mukhopadhyay, Madhumita Banerjee, Rajendra N Basu. Influence of Sorption Kinetics for Zirconia Sensitization in Solid Oxide Fuel Cell Functional Anode Prepared by Electroless Technique. Journal of Power Sources,2008,175(2):749-759
    [68]Touyeras F, Hihn J Y, Delalande S, et al. Ultrasound Influence on the Activation Step before Electroless Coating. Ultrasonics Sonochemistry,2003,10(6):363-368
    [69]Libo Li, Maozhong An. Electroless Nickel-Phosphorus Plating on SiCp/Al Composite from Acid Bath with Nickel Activation. Journal of Alloy and Compounds,2008,461:8 5-91
    [70]于雄,张鹏,姚振宇.非胶体钯活化PET塑料化学镀铜的研究.涂饰与电镀,2007,(6):29-32
    [71]刘峥,肖顺华,林原斌.ABS塑料表面化学镀镍无钯活化工艺研究.材料保护,2006,39(11):29-32
    [72]谷新,王周成,林昌健.陶瓷表面化学镀的前处理工艺新进展.材料保护,2003,36(9):1-4
    [73]肖蔚鸿.非金属材料表面金属化的方法.矿产保护与利用,2006,6(3):28-31
    [74]Schramm, Oliver et al. Comparing Porous and Dense Membranes for the Application in Membrane Reactors. Chemical Engineering Science,1999,54(10):1447-1453
    [75]Tarozaite, R et al. Composition. Microstructure and Magnetic Properties of Electroless-Platedthin Co-P Films. Surface and Coatings Technology,1999,115(1):57-65
    [76]Domenech S. C. et al. Electroless Plating of Nickel-Phosphorous on Surface-Modified Poly(Ethylene Terephthalate) Films. Applied Surface Science,2003,220(1):238-250
    [77]Charbonnier, M. and Romand, M. Polymer Pretreatments for Enhanced Adhesion of Metal Deposited by the Electroless Process. International of Adhesion and Adhesives, 2003,23(4):277-285
    [78]Zhang Shaoxian, Cheng Chuanmin. Process for Electroless Plating a Metal on Non-Cond uctive Materials[J]. Journal of Cleaner Production,1996,4(1):78-79
    [79]Deonath, P. K. Rohatgi. Cast Aluminium Alloy Composites Containing Copper-Coated Ground Mica Particles. Journal of Materials Science,1981,16(6):1599-1606
    [80]Charles R, Shipley Jr. Method of Electroless Depositionon a Substrate and Catalyst Solut ion Therefore. US:3011920.1961-12-05
    [81]Charbonnier M, Romand M. Polymer Pretreatments for Enhanced Adhesion of Metals Deposited by the Electroless Process. International Journal of Adhesion&Adhesives,200 3,23(4):277-285
    [82]Huang C Y, Mo W W. The Effect of Attached Fragments on Dense Layer of Electroless Ni-P Deposition on the Electromagnetic Interference Shielding Effectiveness of Carbon Fibre/Acrylonitrile-Butadiene-Styrene Composites. Surfaceand Coating Technology,200 2,154(1):55-62
    [83]A. K. Garg, L. C. De Jonghe. Metal-Coated Colloidal Particles. Journal of Materials Science,1993,28(13):3427-3432
    [84]J. Li, L. Wang and H. Liu. A New Process for Preparing Conducting Wood Veneers by Electroless Nickel Plating. Surface and Coatings Technology,2010,204(8):1200-1205
    [85]O. A. Harizanov, P. L. Stefchev and A. Iossifova. Metal Coated Alumina Powder for Metalloceramics. Materials Letters,1998,33(5-6):297-299
    [86]G. Stremsdoerfer, Y. Wang, D. Nguyen, P. Clechet, J. R. Martin. Electroless Ni as a Refractory Ohmic Contact for N-InP. Journal of the Electrochemical Society,1993,14 0(7):2022-2028
    [87]韩萍毅,张书鸿.金色材质在宾馆室内装饰中的设计探讨.家具与室内装饰,2011,9:64-65
    [88]李坚,段新芳,刘一星.木材表面的功能性改良.东北林业大学学报,1995,23(2):95-101
    [89]C. Nagasawa, Y. Kumagai, Electromagnetic Shielding Particlesboards with Nickel-Plated Wood Particle. Journal of Wood Science,1989,35(12):1092-1099
    [90]C. Nagasawa, H. Umehara, N. Koshizaki, K. Urabe, Y. Kumagai and T. Kanbe. Effects of Wood Species on Electroconductivity and Electromagnetic Shielding Properties of Electr-olessly Plated Sliced Veneer with Nickel. Journal of Wood Science,1994,40(10):109 2-1099
    [91]黄金田.木材化学镀镍及木质电磁屏蔽材料的制备.北京林业大学博士学位论文,2004
    [92]黄金田,赵广杰.工艺参数对木材化学镀镍金属沉积速率的影响.木材工业,2006,20(1):15-17
    [93]黄金田.镀液组成对木材化学镀镍金属沉积速率的影响.内蒙古农业大学学报,2 005,36(3):57-60
    [94]黄金田,赵广杰.化学镀镍单板的导电性和电磁屏蔽效能.林产工业,2006,33(1):14-17
    [95]王立娟,李坚,刘一星.杨木单板表面化学镀镀前活化工艺.林业科技,2004,32(3):46-48
    [96]L. J. Wang, J. Li and Y. X. Liu. Surface Characteristics of Electroless Nickel Plated Electromagnetic Shielding Wood Veneer. Journal of Forestry Research,2005,16(3): 233-236
    [97]王立娟,李坚,刘一星.化学镀法制备电磁屏蔽木材-Ni-P复合材料研究.材料科学与工艺,2006,14(3):296-299 304
    [98]Lijuan Wang, Jian Li, Yixing Liu. Preparation of Electromagnetic Shielding Woo d-Metal Composite by Electroless Nickel Plating. Journal of Forestry Research,20 06,17(1):53-56
    [99]王立娟,李坚,刘一星.木材单板表面化学镀镍.精细化工,2006,23(3):230-233237
    [100]王立娟,李坚.桦木单板化学镀镍过程的FTIR和XPS分析.林业科学,2006,42(3):7-12
    [101]王立娟,李坚,连爱珍.木材化学镀镍老化镀液的再生与回用.东北林业大学学报,2005,33(3):47-48 58
    [102]王立娟,李坚.超声波辅助桦木单板表面化学镀Ni-P合金的研究.林业科学,2007,43(11):112-116
    [103]李坚,王立娟.水曲柳单板表面化学镀Ni-Cu-P三元合金.林业科学,2007,43(11):89-92
    [104]Jian Li, Lijuan Wang, Haibing Liu. A New Process for Preparing Conducting Wood Ve neers by Electroless Nickel Plating. Surface&Coatings Technology,2010,204:120 0-1205
    [105]Lijuan Wang, Jian Li, Haibing Liu. A Simple Process for Electroless Plating Nickel-Ph osphorus Film on Wood Veneer. Wood Science&Technology,2011,45:161-167
    [106]Haibing Liu, Lijuan Wang. Electroless Nickel Deposition on Fraxinus Mandshurica Ve neer Modified with APTHS for EMI Shielding. BioResources,2010,5(4):2040-2050
    [107]Haibing Liu, Jian Li, Lijuan Wang. Electroless Nickel Plating on APTHS Modified W ood Veneer for EMI Shielding. Applied Surface Science,2010,254(4):1325-1330
    [108]Haibing Liu, Lijuan Wang. Electroless Nickel Plating on Chitosan-Modified Wood Ve neer. BioResources,2011,6(2):2035-2044
    [109]高岗强,黄金田.木材化学镀镍的镍活化工艺对镀层均匀度的影响因素分析.内蒙古农业大学学报,2007,28(1):96-99
    [110]高岗强.木材化学镀镍的活化工艺研究.内蒙古农业大学硕士论文,2007
    [111]蒋柏泉,公振宇,胡淑芬,欧阳小平.稀土元素镱对木质化学镀镍-磷电磁屏蔽材料的影响.电镀与涂饰,2010,29(7):23-26
    [112]胥永.木材化学镀镍作电磁屏蔽材料的制备研究.南昌大学硕士论文,2007
    [113]姜春扬.彩色化学镀工艺及机理研究.江苏:江苏大学,2006
    [114]屈志坚,黄根良.彩色化学镀镍磷合金镀层研究.表面技术,2005,6(3)
    [115]周果.木材非电解镀铜工艺及其镀层表征.北京林业大学硕士论文,2005
    [116]贾晋,曹寿林等.不同还原剂对木材化学镀铜镀液稳定性的影响研究.内蒙古农业大学学报,2011,32(3):263-266
    [117]商俊博.木质电磁屏蔽材料的化学镀制备工艺研究.北京林业大学硕士论文,2009
    [118]朱江.化学镀铜木材轻质电磁屏蔽复合材料的研究.内蒙古农业大学硕士论文,2009
    [119]王立娟,李坚,刘一星.水曲柳单板化学镀铜制备电磁屏蔽复合材料的研究.材料工程,2008,(4):56-60
    [120]Darken J. Paper B6-2 Presented at Printed Circuit World Convention V, Glasgow, U. K,1990,June:1215
    [121]Shacham-Diamond Y Y. Electrochemica And Solid State Letter,2000,3(6):279-282
    [122]吴丽琼,杨防祖.乙醛酸化学镀铜的电化学研究.电化学,2005,11(4):402-406
    [123]申丹丹.乙醛酸化学镀铜工艺与机理研究.厦门大学硕士论文,2007
    [124]李卫明.环保型非甲醛化学镀铜技术.材料研究与应用,2008,2(4)390-393
    [125]HonmaH, KobayashiT. Electroless copper desposition presence using glyoxylic acid as a reducing agent. J. Electrochem. Soc.,1994,141 (3):730-733
    [126]王立娟,李桂玲,李坚.镀镍桦木单板的物理性能分析.东北林业大学学报,2007,35(10):28-29 63
    [127]孙斌.木材化学镀镍镀层形貌及成分研究.表面技术,2008,37(1):45-47
    [128]周杲,赵广杰.木材表面化学镀处理技术.木材工业,2005,19(3):8-11
    [129]GJB2604-96,军用电磁波屏蔽涂料通用规范
    [130]肖鹏远,焦晓宁.电磁屏蔽原理及其电磁屏蔽材料制造方法的研究.非织造布,2010,18(5):14-19
    [131]李恒德,肖纪美.材料表面与界面.清华大学出版社,1990:143.
    [132]张锐.现代材料分析方法.化学工业出版社,2007:178-179
    [133]黄新民,解挺,材料分析测试方法.北京:国防工业出版社2006:140-141
    [134]俞宏坤.X射线光电子能谱(XPS).《上海计量测试》,2003,30(4):45-47
    [135]周上祺.X射线衍射分析原理方法.应用重庆:重庆大学出版社,1991:28-34
    [136]黄华,郭灵虹.晶态聚合物结构的X射线衍射分析及其进展.化学研究与应 用,1998,10(2):118-123
    [137]田宏志,张秀华等.D/MAX-ⅢB型X-射线衍射仪在耐火材料物相分析中的应用工程与试验.2008(4):32-35
    [138]German R M, Guzowski M M, Wright D C. Color and Colorstability as Alloy Design Criteria. J Met,1980,32(3):20-27
    [139]Maiorenko V M. Developing copper alloy with the re-quired color properties. Sov J Non-Ferrous Met,1985,26(8):94-97
    [140]刘一星,李坚,徐子才等.我国110个树种木材表面视觉物理量的综合统计分析.林业科学,1995,31(4):353-359
    [141]张翔,申宗圻.木材材色的定量表征.林业科学,1990,26(4):344-352
    [143]陈潇俐.红木类木材表面特性的研究.南京林业大学硕士学位论文,2006
    [144]XingR,LiuS,GuoZ,YuH,ZhongZ,JIX,LiP. Relevance of Molecular Weight of Chitosan-2-hydroxyProPyl Trimethyl Ammonium Chloride and their Antioxidant activities. EuroPean Journal of Medicinal Chemistry,2008,43:336-340
    [145]俞丹壳.壳聚糖对金属把的吸附机理研究及在电磁屏蔽用导电织物制备中的应用东华大学,博士学位论文,2011
    [146]Lim, V. W. L., Kang, E. T. Neoh, K. G. Electroless Plating of Palladium and Copper on Polypyrrole Films. Synthetic Metals 2001,123:107-115
    [147]YinXiang Lu, Improvement of Copper Plating Adhesion on Silane Modified PET Film by Ultrasonic-assisted Electroless Deposition. Applied Surface Science 2010,256:3554-3558
    [148]Lili Sun, JianLi, Lijuan Wang. Electromagnetic interference shielding material from electroless copper plating on birch veneer. Wood Sci. Technol.,2012,46:1061-1071
    [149]Lijuan Wang, Lili Sun, Jian Li. Electroless copper plating on fraxinus mandshurica veneer using glyoxylic acid as reducing agent. BioResources,2011,6(3):3493-3504
    [150]Barthlott W,Neinhuis C.The purity of Sacred Lotus or Escape from Contamination in Biological Surfaces.Planta,1997,202:1-8
    [152]于海鹏,刘一星,刘镇波,等.基于改进的视觉物理量预测木材的环境学品质.东北林业大学学报,2004,32(6):39-41

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