面向聚合物微流控器件的超声波精密联接技术研究
摘要
聚合物材料以其种类繁多、价格低廉、易加工等优点,愈加广泛地应用于生化MEMS器件的制造,聚合物MEMS器件的封装成为生化MEMS制造中的关键技术。目前应用于聚合物微装配的联接方法主要有胶粘接、热键合、溶剂键合、激光键合等,以上方法均在某些方面存在着各自的局限性。超声波联接技术具有高效率、局部加热、无需引入其它物质等优点,近年来在MEMS领域的应用展示出较大的潜力,但目前应用于MEMS领域的超声波联接技术基本沿袭了应用于大尺寸零件的超声波塑料焊接技术,在能量精确控制及界面熔接质量优化方面尚无深入研究,因此本文针对微流控器件的精密封装,以精确控制聚合物界面熔接质量为目标,在聚合物界面熔合机理、超声波精密联接方法及界面熔接质量优化等方面对超声波联接技术展开研究。
首先从微观角度分析了聚合物界面的熔接机理,应用分子动力学方法模拟了聚合物界面间高分子链的扩散及相互缠绕行为,研究了压强和温度因素对以上过程的影响,在模拟中通过计算模型的体系形变、扩散系数、界面间的扩散深度和界面结合能等参量,分析了聚合物联接过程中高分子链的运动趋势,进而研究了压强和温度两个因素对器件形变、熔接层尺寸、熔接强度等特征的影响,对后续超声波精密联接方法的研究奠定了理论基础。
针对微流控器件的封接研制了超声波精密联接装置,选择高频率、低振幅超声换能器,以降低超声波能量下微器件的结构形变及对局部低强度结构的破坏性。基于以上装置,提出了基于聚合物力学状态反馈的超声波精密联接方法,其原理在于以界面聚合物力学状态的变化监测聚合物材料的玻璃化转变行为,并作为控制超声波能量的信号。在聚合物力学状态检测方面分别设计了基于压力传递效率检测和基于超声传播效率检测两种方法,在基于压力传递效率检测方法基础上扩展设计了基于压力自适应的超声波精密联接方法,在实验中验证了基于上述方法可以实现界面熔接质量较为精确的控制。
为进一步提高熔接质量,结合大尺寸零件超声波塑料焊接技术中的导能筋结构,提出了针对超声波精密联接的微导能阵列,通过在待联接表面制作微米级尺寸的导能结构阵列来减小界面接触面积,将超声波能量集中引导于导能点阵结构,并为粘性聚合物的流延提供空间,起到优化界面熔接质量的作用。采用热压成形工艺及硅模具在基片表面制作微导能阵列,并通过实验分析了结构尺寸和分布尺寸对界面熔接质量的影响,实验结果表明制作合适配合尺寸的微导能阵列可以提高超声波能量利用效率及界面熔接质量的可控性。
设计了压电驱动式微泵,应用紫外光刻工艺制作了SU-8微止回阀,应用超声波精密联接技术进行了泵体的组装,并将阀片密封其中,在封装过程中保证了易碎阀片的结构不受损坏,在实验中测试了微泵液体泵送流量对应驱动频率和电压的关系。
With the advantages of great variety, low price and easy for fabrication et al, polymer was widely employed in biochemical MEMS. So the package of polymer micro devices became key technique in MEMS. The bonding methods used in micro assembly includes adhesive bonding, thermal bonding, solvent bonding, laser bonding, etc, which have limits in some respects. Ultrasonic bonding technique has the advantages of high efficiency, local heating and no foreign materials introduced, which indicates great potential in micro assembly. The ultrasonic bonding technique used in MEMS now is almost the same to the plastic ultrasonic welding for bulk devices and it has no deep studies in precise control of energy and optimization of interfacial fusion quality. So in this paper ultrasonic bonding was studied in polymer fusion mechanism of polymer interface, ultrasonic precise bonding method and optimization of intercial fusion quality to realize the precise fusion bonding for microfluidic devices.
Fusion mechanism of polymer interface was studied in micro scale firstly. Molecular dynamics simulation was employed to simulate the diffusion and entanglement of macromolecular chains between polymer interfaces. System deformation, diffusion coefficient, diffusion depth and binding energy were calculated to analyse the movement tendancy of macromolecular chains during polymer fusion bonding. The influences from factors of pressure and temperature to the features of fusion bonding including device deformation, size of fusion layer, bonding strength, etc were studied. It provided theoretical foundation for the research of ultrasonic precise bonding method.
Ultrasonic precise bonding equipment was established for microfluidic devices. High frequency, low amplitude ultrasonic transducer was employed to decrease the deformation of micro devices and also weaken the destruct to the microstructures in low strength. Based on the equipment ultrasonic precise bonding method with the feedback of polymer mechanical behavior was proposed. The mechanism was that the glass transition behavior of polymer components was detected by the changing of mechanical behavior and this information was made as the signal to control ultrasonic energy. Based on this idea two methods including measuring the pressure transfer efficiency and the ultrasound propagation efficiency were designed for ultrasonic precise bonding. Based on the feedback of pressure transfer efficiency an extended adaptive pressure ultrasonic precise bonding method was also designed. In experiments it was verified that the interfacial fusion degree could be controlled by the new ultrasonic bonding methods
To improve the interfacial fusion quality further, according to the energy directors used in plastic ultrasonic welding for bulk devices micro energy director array was proposed for ultrasonic precise bonding of microfluidic devices. Energy director structures in micrometer size were fabricated on the bonding surface to concentrate ultrasonic energy to small area and provide spaces for the spread of polymer components in viscous state, which could improve the forming quality. The micro energy director array was fabricated by hot embossing. The influence from the factors of structure size and distribution size to fusion degree was studied in experiments. Results indicated that fabricating micro energy director array in proper size on the bonding surface could improve the utilization of ultrasonic energy and make the bonding process more controllable.
Piezoelectric micro pump was designed with SU-8 micro valve fabricated by ultraviolet lithography. Ultrasonic precise bonding was applied in the packaging of pump and sealing of micro valve. In the bonding process the micro valve structure in low strength was verified in good condition. The flow velocities of liquid pumping corresponding to the frequency of piezoelectric elements were measured in experiments.
首先从微观角度分析了聚合物界面的熔接机理,应用分子动力学方法模拟了聚合物界面间高分子链的扩散及相互缠绕行为,研究了压强和温度因素对以上过程的影响,在模拟中通过计算模型的体系形变、扩散系数、界面间的扩散深度和界面结合能等参量,分析了聚合物联接过程中高分子链的运动趋势,进而研究了压强和温度两个因素对器件形变、熔接层尺寸、熔接强度等特征的影响,对后续超声波精密联接方法的研究奠定了理论基础。
针对微流控器件的封接研制了超声波精密联接装置,选择高频率、低振幅超声换能器,以降低超声波能量下微器件的结构形变及对局部低强度结构的破坏性。基于以上装置,提出了基于聚合物力学状态反馈的超声波精密联接方法,其原理在于以界面聚合物力学状态的变化监测聚合物材料的玻璃化转变行为,并作为控制超声波能量的信号。在聚合物力学状态检测方面分别设计了基于压力传递效率检测和基于超声传播效率检测两种方法,在基于压力传递效率检测方法基础上扩展设计了基于压力自适应的超声波精密联接方法,在实验中验证了基于上述方法可以实现界面熔接质量较为精确的控制。
为进一步提高熔接质量,结合大尺寸零件超声波塑料焊接技术中的导能筋结构,提出了针对超声波精密联接的微导能阵列,通过在待联接表面制作微米级尺寸的导能结构阵列来减小界面接触面积,将超声波能量集中引导于导能点阵结构,并为粘性聚合物的流延提供空间,起到优化界面熔接质量的作用。采用热压成形工艺及硅模具在基片表面制作微导能阵列,并通过实验分析了结构尺寸和分布尺寸对界面熔接质量的影响,实验结果表明制作合适配合尺寸的微导能阵列可以提高超声波能量利用效率及界面熔接质量的可控性。
设计了压电驱动式微泵,应用紫外光刻工艺制作了SU-8微止回阀,应用超声波精密联接技术进行了泵体的组装,并将阀片密封其中,在封装过程中保证了易碎阀片的结构不受损坏,在实验中测试了微泵液体泵送流量对应驱动频率和电压的关系。
With the advantages of great variety, low price and easy for fabrication et al, polymer was widely employed in biochemical MEMS. So the package of polymer micro devices became key technique in MEMS. The bonding methods used in micro assembly includes adhesive bonding, thermal bonding, solvent bonding, laser bonding, etc, which have limits in some respects. Ultrasonic bonding technique has the advantages of high efficiency, local heating and no foreign materials introduced, which indicates great potential in micro assembly. The ultrasonic bonding technique used in MEMS now is almost the same to the plastic ultrasonic welding for bulk devices and it has no deep studies in precise control of energy and optimization of interfacial fusion quality. So in this paper ultrasonic bonding was studied in polymer fusion mechanism of polymer interface, ultrasonic precise bonding method and optimization of intercial fusion quality to realize the precise fusion bonding for microfluidic devices.
Fusion mechanism of polymer interface was studied in micro scale firstly. Molecular dynamics simulation was employed to simulate the diffusion and entanglement of macromolecular chains between polymer interfaces. System deformation, diffusion coefficient, diffusion depth and binding energy were calculated to analyse the movement tendancy of macromolecular chains during polymer fusion bonding. The influences from factors of pressure and temperature to the features of fusion bonding including device deformation, size of fusion layer, bonding strength, etc were studied. It provided theoretical foundation for the research of ultrasonic precise bonding method.
Ultrasonic precise bonding equipment was established for microfluidic devices. High frequency, low amplitude ultrasonic transducer was employed to decrease the deformation of micro devices and also weaken the destruct to the microstructures in low strength. Based on the equipment ultrasonic precise bonding method with the feedback of polymer mechanical behavior was proposed. The mechanism was that the glass transition behavior of polymer components was detected by the changing of mechanical behavior and this information was made as the signal to control ultrasonic energy. Based on this idea two methods including measuring the pressure transfer efficiency and the ultrasound propagation efficiency were designed for ultrasonic precise bonding. Based on the feedback of pressure transfer efficiency an extended adaptive pressure ultrasonic precise bonding method was also designed. In experiments it was verified that the interfacial fusion degree could be controlled by the new ultrasonic bonding methods
To improve the interfacial fusion quality further, according to the energy directors used in plastic ultrasonic welding for bulk devices micro energy director array was proposed for ultrasonic precise bonding of microfluidic devices. Energy director structures in micrometer size were fabricated on the bonding surface to concentrate ultrasonic energy to small area and provide spaces for the spread of polymer components in viscous state, which could improve the forming quality. The micro energy director array was fabricated by hot embossing. The influence from the factors of structure size and distribution size to fusion degree was studied in experiments. Results indicated that fabricating micro energy director array in proper size on the bonding surface could improve the utilization of ultrasonic energy and make the bonding process more controllable.
Piezoelectric micro pump was designed with SU-8 micro valve fabricated by ultraviolet lithography. Ultrasonic precise bonding was applied in the packaging of pump and sealing of micro valve. In the bonding process the micro valve structure in low strength was verified in good condition. The flow velocities of liquid pumping corresponding to the frequency of piezoelectric elements were measured in experiments.
引文
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