面向完整传输路径的BGA焊点信号完整性分析及优化
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摘要
建立了基于BGA(ball grid array)焊点的完整传输路径的HFSS(high frequency simulator structure)电磁仿真模型,基于该模型对完整传输路径在高频条件下的信号完整性问题进行了分析,得到了其回波损耗仿真结果,以及焊点最大径向尺寸、焊点高度尺寸、焊盘直径尺寸对回波损耗的影响.并以焊点最大径向尺寸、焊点高度尺寸、焊盘直径尺寸为设计参数,以完整传输路径6 GHz下的回波损耗作为目标值,设计17组试验仿真计算,采用响应曲面法对仿真计算所得的17组完整传输路径回波损耗与BGA焊点形态参数间关系进行拟合,结合遗传算法对拟合函数进行优化,得到完整传输路径回波损耗最小的BGA焊点组合参数为焊点最大径向尺寸1.05 mm,焊点高度0.75 mm,焊盘直径0.65 mm,并对最优组合参数仿真验证,最优组合仿真结果优于17组试验仿真结果,实现了完整传输路径中BGA焊点的结构优化.
The simulation model of complete transmission path based on BGA solder joint was built by HFSS software, the return loss of complete transmission path were obtained based on the model. The impacts of signal frequency, solder joint maximum radial size, pad diameter and solder joint height on return loss were also studied. Taking the maximum size of the solder joint, solder joint height, the diameter of pad size as design parameters, the return loss as the target value, design and calculation of 17 sets of experiments using computational simulation. 17 sets of simulation of complete transmission path loss and the relationship between the parameters of BGA solder joint shape fitting by the response surface method, combined with genetic algorithm for fitting function optimization. BGA solder joint parameters with minimum return loss in full transmission path is the maximum size of 1.05 mm solder joint, height of solder joint is0.75 mm, the diameter of pad is 0.65 mm, and the optimal combination of parameters of the simulation, the optimal combination of simulation results. The result of optimal combination is better than 17 sets of experimental results, and the optimization of the solder joint structure in the whole transmission path is realized.
The simulation model of complete transmission path based on BGA solder joint was built by HFSS software, the return loss of complete transmission path were obtained based on the model. The impacts of signal frequency, solder joint maximum radial size, pad diameter and solder joint height on return loss were also studied. Taking the maximum size of the solder joint, solder joint height, the diameter of pad size as design parameters, the return loss as the target value, design and calculation of 17 sets of experiments using computational simulation. 17 sets of simulation of complete transmission path loss and the relationship between the parameters of BGA solder joint shape fitting by the response surface method, combined with genetic algorithm for fitting function optimization. BGA solder joint parameters with minimum return loss in full transmission path is the maximum size of 1.05 mm solder joint, height of solder joint is0.75 mm, the diameter of pad is 0.65 mm, and the optimal combination of parameters of the simulation, the optimal combination of simulation results. The result of optimal combination is better than 17 sets of experimental results, and the optimization of the solder joint structure in the whole transmission path is realized.
引文
[1]李小荣.高速数模混合电路信号完整性分析[D].杭州:杭州电子科技大学,2010.
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[2]黄根信,黄春跃,路良坤,等.基于HFSS的内存芯片的BGA焊点串抗仿真分析[J].焊接学报,2018,39(6):43-46.Huang Genxin,Huang Chunyue,Lu Liangkun,et al.Analysis of cross talk of the BGA solder joint on memory chip based on HFSS[J].Transactions of the China Welding Institution,2018,39(6):43-46.
[3]Ndip I,John W,Reich H.A novel approach for RF/microwave,odeling and optimization of BGA packages[J].Research in Microelectronics and Electronics,2005,32(12):233-236.
[4]Ndip N,W John,Reich H.Effects of discontinuities and technological fluctuations on the RF performance of BGA packages[C]//IEEE 55th Electronics Components and Technology Conference(ECTC 2005).Institute of Electrical and Electronics Engineers Computer Society,2005:1769-1775.
[5]Ivan Ndip,Herbert Reichl,Stephan Guttowski.A novel methodology for defining the boundaries of geometrical discontinuities in electronic packages[J].IEEE Conference on Ph.D.Research in Microelectronics and Electronics(PRIME 2006),June 11-15,2006,0Otranto(Lecce).Piscataway:Inst.of Elec.and Elec.Eng.Computer Society,193-196.
[6]傅厦龙,胡夏夏.基于响应面和遗传算法的工艺参数优化[J].高分子材料科学与工程学报,2014,30(4):123-126.Fu Xialong,Hu Xiaxia.Optimization of process parameters based on response surface and genetic algorithm[J].Journal of Polymer Materials Science and Engineering,2014,30(4):123-126.
[7]邵良滨,光互连模块关键位置焊后对准偏移与耦合效率关系研究[D].桂林:桂林电子科技大学,2016.
[8]玄光男,程润伟.遗传算法与工程设计[M].北京:科学出版社,2000.