高黏度流体微量喷射与控制技术研究
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摘要
流体点胶技术已经成为微电子封装中的一个关键技术之一,流体点胶是以一种受控的方式对流体进行精确分配的过程。流体点胶技术逐渐由接触式点胶向非接触式点胶转变,这种转变是不可避免的,正如打印机市场上针式打印机向喷墨式打印机转化类似。与传统的针头式点胶技术相比,喷射技术具有速度快、分配效果好及不受空间限制等优点,为流体点胶工艺提供高速、高质量和低成本。喷射技术是快速而精确地对微电子封装中所使用的流体材料进行分配的最佳方式。本实验室采用机械式喷射点胶技术,开发了一套喷射点胶系统实验平台。
首先,阐述了现有的各种喷射点胶技术原理,分析比较了它们的优缺点和应用范围,发现机械式喷射点胶技术能够满足现有的微电子封装的所使用各种流体材料点胶的工艺要求。因此,针对机械式喷射点胶技术进行了相关的理论分析。根据机械式喷射点胶技术的原理,设计并制作了喷射点胶阀。主要针对喷嘴结构设计和点胶阀驱动机构的选择进行了分析。喷射点胶阀是整个喷射点胶系统的核心,它的精度和性能对流体点胶的精度和质量有很大的影响。
然后,根据微电子封装中对点胶工艺的要求,设计出喷射点胶系统的总体结构。喷射点胶系统由喷射点胶阀、运动平台、温度控制子系统、气动子系统、电磁阀驱动电路、控制系统、系统控制软件组成。详细描述了喷射点胶系统各个组成部分的设计思路与实现方法,完成整个喷射点胶系统的组装和调试工作。
最后,本文还对喷射点胶系统控制参数和性能进行了一定的研究。通过改变控制参数进行了相关的喷射点胶实验,并且对实验结果进行了分析与处理。针对点胶实验中出现的一些故障给出了可能原因和解决方案。还对阵列式点胶方式做了相关的分析和实验。由于受到机械加工水平的限制,制作的喷嘴小孔直径为0.4mm,使得点胶实验获得的最小胶点直径为0.7mm。喷射点胶阀的最高工作频率为30Hz。通过点胶实验证明了本实验室开发的喷射点胶系统的可行性,已经为进一步的研究工作打下良好的基础。
Fluid dispensing technology has become one of the key technologies of microelectronics packaging. Fluid dispensing is a process to dispensing the fluid accurately in a controlled manner. There is an evolution in the fluid dispensing technology for applying fluids from contact methods to non-contact methods, change is inevitable. This transition is as similar in our niche market as the transition from contact printing to inkjet printing for computer printers. Jetting technology is fast, effective, no limited by space and offers many advantages over traditional needle dispensing to deliver speed, quality, low cost of ownership. Jetting is the best way to dispense many fluids quickly and accurately. Mechanical jetting technology of high viscosity is being used to develop a system of adhesive jetting dispensing experimental platform in our lab.
First, various principles of jetting dispensing technologies were introduced, their virtues and application fields were analyzed, it was found that mechanical jetting technology can satisfy the demand of fluid dispensing process. Related theoretical method for mechanical jetting technology was analyzed. Based on the principle of mechanical jetting technology, jetting dispensing valve was designed. Structural design for nozzle and proper choose drive for dispensing valve were described. Jetting dispensing valve is key element of the jetting dispensing system, the precision and performance of the valve will affect the precision and quality of fluid dispensing.
Then, According to the demand of dispensing technology in microelectronics packaging, a jetting dispensing system was developed. The system is consist of dispensing valve, motion stage, temperature control subsystem, pneumatic subsystem, driving circuit for electromagnetic valve, control system and system control software. The design and implementation of the overall structure and the various components of the system were described in the thesis in detail.
Finally, the parameters and performance of the jetting dispensing system were researched. Adhesive jetting dispensing experiments were conducted with changing control parameters. The reasons and solutions for the troubles appeared in the experiment were given out. The analysis and experiment for adhesive jetting dispensing in array manner were conducted. Due to the limitation of manufacturing technology, the nozzle was fabricated and the diameter of the hole in the nozzle was 0.4mm, the jetting dispensing valve can work at rates of up to 30 Hz. The feasibility of the jetting dispensing system was proved by adhesive jetting dispensing experiment and fundament has been built for the further research.
首先,阐述了现有的各种喷射点胶技术原理,分析比较了它们的优缺点和应用范围,发现机械式喷射点胶技术能够满足现有的微电子封装的所使用各种流体材料点胶的工艺要求。因此,针对机械式喷射点胶技术进行了相关的理论分析。根据机械式喷射点胶技术的原理,设计并制作了喷射点胶阀。主要针对喷嘴结构设计和点胶阀驱动机构的选择进行了分析。喷射点胶阀是整个喷射点胶系统的核心,它的精度和性能对流体点胶的精度和质量有很大的影响。
然后,根据微电子封装中对点胶工艺的要求,设计出喷射点胶系统的总体结构。喷射点胶系统由喷射点胶阀、运动平台、温度控制子系统、气动子系统、电磁阀驱动电路、控制系统、系统控制软件组成。详细描述了喷射点胶系统各个组成部分的设计思路与实现方法,完成整个喷射点胶系统的组装和调试工作。
最后,本文还对喷射点胶系统控制参数和性能进行了一定的研究。通过改变控制参数进行了相关的喷射点胶实验,并且对实验结果进行了分析与处理。针对点胶实验中出现的一些故障给出了可能原因和解决方案。还对阵列式点胶方式做了相关的分析和实验。由于受到机械加工水平的限制,制作的喷嘴小孔直径为0.4mm,使得点胶实验获得的最小胶点直径为0.7mm。喷射点胶阀的最高工作频率为30Hz。通过点胶实验证明了本实验室开发的喷射点胶系统的可行性,已经为进一步的研究工作打下良好的基础。
Fluid dispensing technology has become one of the key technologies of microelectronics packaging. Fluid dispensing is a process to dispensing the fluid accurately in a controlled manner. There is an evolution in the fluid dispensing technology for applying fluids from contact methods to non-contact methods, change is inevitable. This transition is as similar in our niche market as the transition from contact printing to inkjet printing for computer printers. Jetting technology is fast, effective, no limited by space and offers many advantages over traditional needle dispensing to deliver speed, quality, low cost of ownership. Jetting is the best way to dispense many fluids quickly and accurately. Mechanical jetting technology of high viscosity is being used to develop a system of adhesive jetting dispensing experimental platform in our lab.
First, various principles of jetting dispensing technologies were introduced, their virtues and application fields were analyzed, it was found that mechanical jetting technology can satisfy the demand of fluid dispensing process. Related theoretical method for mechanical jetting technology was analyzed. Based on the principle of mechanical jetting technology, jetting dispensing valve was designed. Structural design for nozzle and proper choose drive for dispensing valve were described. Jetting dispensing valve is key element of the jetting dispensing system, the precision and performance of the valve will affect the precision and quality of fluid dispensing.
Then, According to the demand of dispensing technology in microelectronics packaging, a jetting dispensing system was developed. The system is consist of dispensing valve, motion stage, temperature control subsystem, pneumatic subsystem, driving circuit for electromagnetic valve, control system and system control software. The design and implementation of the overall structure and the various components of the system were described in the thesis in detail.
Finally, the parameters and performance of the jetting dispensing system were researched. Adhesive jetting dispensing experiments were conducted with changing control parameters. The reasons and solutions for the troubles appeared in the experiment were given out. The analysis and experiment for adhesive jetting dispensing in array manner were conducted. Due to the limitation of manufacturing technology, the nozzle was fabricated and the diameter of the hole in the nozzle was 0.4mm, the jetting dispensing valve can work at rates of up to 30 Hz. The feasibility of the jetting dispensing system was proved by adhesive jetting dispensing experiment and fundament has been built for the further research.
引文
[1] Alec J. Babiarz, Jetting small dots of high viscosity fluids for packaging applications, Semiconductor International. 2006.8.
[2] Nguon B (Don), Design and characterization of a precision fluid dispensing valve, Int J Adv Manuf Technol. 2004,24: 251–260
[3] National Electronics Manufacturing Initiative (NEMI), Inc. National Electronics Manufacturing Technology Roadmaps, December 1998:175
[4]李枚.微电子封装技术的发展与展望.半导体杂志,2000,25(2):32-36
[5] Norris M. Dispensing Technology. Surface Mount Technology, 1996, 3:56-58
[6] A.J. Babiarz. Encapsulation and Underfilling Techniques for Advanced IC Packaging. Asymtek Technical Report,1997
[7] A.F. Piracci,“SMA Dispensing Trends,”Surface mount Technology, Jan 2001 ASR-0102117 Rev. A
[8] Li Jianping, Deng Guiling. Technology development and basic theory study of fluid dispensing -a review. IEEE.2004
[9] Dixon D, Kazalski J, Murch F, et al. Practical issues concerning dispensing pump technologies. Circuits Assembly, August 1997, pp 36–40
[10] Issues for the Practical Production Use of Dispensing Technologies.http://www.uic.com/ wcms.nsf/index/Material_Dispensing_114.html
[11] Time_Pressure_Dispensing.www.uic.com/info/forms.nsf/wpredirect?OpenForm&Time_Pressure_Dispensing.PDF
[12] Steven J. Adamson, David Wang. A change in dispensing technology– jetting takes off. Semiconductor technology vol.29.No.3
[13] D.J. Hayes, D.B. Wallace, M.T. Boldman. Picoliter Solder Droplet Dispensing, Proceedings, ISHM '92,San Francisco, Calif.October.1992.316-321
[14] D. Rose, Micro-dispensing technologies in drug discovery, Drug Discovery Today, 1999.vol.4:411–419
[15] Jonas Bergkvist, Tobias Lilliehorn, Johan Nilsson. Miniaturized Flow throughMicro-dispenser With Piezo-ceramic Tripod Actuation. Journal of microelectro mechanical systems. vol.14, No.1.february 2005
[16] Williams. P. Surface Mount Council, Surface Mount Technology - Status of the Technology and Industry Activities and Action Plan, August 1999.
[17] R. Bush. Matching Fluid Dispensers to Materials for Electronics Applications. Electronic packaging&production,1995,37:56-62
[18] Ruben Burga, Art Tausek. Control of Adhesive Dispensing Parameters During Transition from Research to Production Environments.2003 Electronics Packaging Technology Conference
[19] Bosch V D, DeBarros T. Step-by-step SMT: Adhesives/Epoxies & Dispensing. SMT, 1997, 5: 102-107.
[20] Ness, C.Q. and Lewis, A.R., Adhesives/Epoxies & Dispensing, SMT, Supplement, Pathways to SMT, July 1999:28-32
[21]章梓雄,董曾南.粘性流体力学.北京:清华大学出版社.1998.10~20
[22] Chen X B, G. Schoenau, Zhang W J. Issues on dispensing in surface mount technology (SMT). International Conference on Advanced Manufacturing Technology, Xi'an, China, 1999
[23] Piracci, Anthony F. Practical Production Applications for Jetting Technology, APEX 2000 Conference Proceedings
[24] Steven I. Zoltan. Pulsed droplet ejecting system. U.S Patent 3683212, 1972
[25] Alan Lewis, Steve Adamson. Fluid Dispensing Capabilities for Assembly of MEMS. Asymtek, USA
[26] Horatio Quinones, Alec Babiarz, Lian Fang. Jetting Technology: A Way of the Future in Dispensing. Asymtek Headquarters. USA
[27] Lewis. A, Reighard. M. and Suriawidjaja, F. Noncontact Dispensing Achieves Practical Results. SMT, May 1999:66-67
[28] Reighard, M. Non-Contact SMA Jetting: Reliability and Performance Enter the Manufacturing Environment, NEPCON West 1999 Proceedings.
[29] Horatio Quinones, Alec Babiarz, Christian Deck. Fluid Jetting for Next Generation Packages. Asymtek Headquarters. USA
[30] A.J. Babiarz. Die encapsulation and flip chip underfilling processes for area array packaging of advanced integrated circuits. Asymtek Technical Report, 1997
[31] A. Lewis et al. Conductive adhesive dispensing process considerations, in Proc. Nat. Electron. Packaging.Prod.Conf.,1990,30:26-766
[32] Raj N. Master et al,“Novel Jet Fluxing Application for Advanced Flip Chip and BGA/CGA Packages”proceedings of 50th Electronic Component and Technology Conference, 2000, pp 1185-1188
[33] Lee C (2000) Ultra-high speed dispensing enhance production throughput. Adv Packag
[34] D.Dixon, J.Kazalski, F.Murch. Practical Issues Concerning Dispensing Pump Technologies. Circuits Assembly, 1997,6:36-40
[35] Bob Hoffman. Jetting - a new paradigm in dispensing of light emitting diode products. Asymtek. Carlsbad CA.USA
[36] H.X. Li, S.K. Tso, H. Deng. A Conceptual Approach to Integrate Design and Control for the Epoxy Dispensing Process. Int. J. Adv. Manufact.Technol.,2001,17:677-682
[37] Kropp P. Problems with high speed adhesive dispensing. 7th International SAMPE Electronics Conference, 1994,20(23):487-493
[38] Sven Wedekin.精密微量滴胶. http://www.smtinline.com/chinese/micro- dispensin -g-ch.htm
[39] James C. Smith, James W. Messerly, stow et al. Non-contact liquid material dispenser having a bellows valve assembly and method for ejecting liquid material onto a substrate. U.S Patent 6267266 B1,2001
[40] Alec J. Babiarz, Alan R. Lewis, Yosuke sagami et al. system for jetting phosphor for optical displays. U.S Patent 0029724 A1,2006
[41] Ron Abernathy, J. Babiarz, Nicholas Anthony Barendt et al. viscous material non-contact jetting system. U.S Patent 0001869 A1,2005
[42] James W. Messerly, Laurence B. Saidman et al. Method and apparatus for dispensing small amount of liquid material. U.S Patent 6253957 B1,2001
[43] H.X. Li. Epoxy Dispensing Research. Department of Manufacturing engineering and Engineering Management of City University of Hong Kong,1998
[44] Carreau, P.J., Dekee, Chhabra et al. Rheology of Ploymeric Systems: Principles andApplications. Hanser, Munich, 1997
[45] A. Razban. Intelligent Control of an Automated Adhesive Dispensing Cell: [PhD Thesis]. Imperial College, London, UK, 1993
[46] John Gould. Adhesive in Electronics, Wolfson School of Mechanical and Manufacturing Engineering. Longhborough University, 2004
[47] A. Razban, B.L. Davies. Analytical Modeling of the Automated Dispensing of Adhesive Material. Journal of Adhesion Science Technology,1995,9:1435-1450
[48]赵翼翔.面向半导体封装的点胶系统建模、控制与实现:[博士学位论文].武汉:华中科技大学图书馆,2004
[49]沈正湘,微电子封装中点胶控制系统及其性能控制研究:[硕士学位论文].武汉:华中科技大学图书馆,2005
[50] Razban A. An automated system for dispensing adhesives. International Journal of Adhesion and Adhesives, 1991, 7: 28-33
[51]周润文,阮一平.加快电磁阀吸合与释放的线路.低压电器.4,1995
[52] David. A. Forsyth, Jean Ponce.计算机视觉.第1版.北京:电子工业出版社,2004.6
[53]孙恒.布胶机运动平台及其控制系统的研究.硕士学位论文.中南大学图书馆.2005.
[54]胡科峰.高速高精运动控制系统的软件技术研究.硕士学位论文.华中科技大学图书馆.2004.
[55]张斌,吉传稳,左燕生.具有多种电机控制模式的伺服驱动器的研究.电工电能新技术,1999,1:29-32
[56]邓星钟.机电传动控制.第三版.武汉:华中科技大学出版社.2001.20~23
[57]李松,徐海水,丁国芳.最新Visual C++6.0程序设计教程.北京:冶金工业出版社,2001.3~5
[2] Nguon B (Don), Design and characterization of a precision fluid dispensing valve, Int J Adv Manuf Technol. 2004,24: 251–260
[3] National Electronics Manufacturing Initiative (NEMI), Inc. National Electronics Manufacturing Technology Roadmaps, December 1998:175
[4]李枚.微电子封装技术的发展与展望.半导体杂志,2000,25(2):32-36
[5] Norris M. Dispensing Technology. Surface Mount Technology, 1996, 3:56-58
[6] A.J. Babiarz. Encapsulation and Underfilling Techniques for Advanced IC Packaging. Asymtek Technical Report,1997
[7] A.F. Piracci,“SMA Dispensing Trends,”Surface mount Technology, Jan 2001 ASR-0102117 Rev. A
[8] Li Jianping, Deng Guiling. Technology development and basic theory study of fluid dispensing -a review. IEEE.2004
[9] Dixon D, Kazalski J, Murch F, et al. Practical issues concerning dispensing pump technologies. Circuits Assembly, August 1997, pp 36–40
[10] Issues for the Practical Production Use of Dispensing Technologies.http://www.uic.com/ wcms.nsf/index/Material_Dispensing_114.html
[11] Time_Pressure_Dispensing.www.uic.com/info/forms.nsf/wpredirect?OpenForm&Time_Pressure_Dispensing.PDF
[12] Steven J. Adamson, David Wang. A change in dispensing technology– jetting takes off. Semiconductor technology vol.29.No.3
[13] D.J. Hayes, D.B. Wallace, M.T. Boldman. Picoliter Solder Droplet Dispensing, Proceedings, ISHM '92,San Francisco, Calif.October.1992.316-321
[14] D. Rose, Micro-dispensing technologies in drug discovery, Drug Discovery Today, 1999.vol.4:411–419
[15] Jonas Bergkvist, Tobias Lilliehorn, Johan Nilsson. Miniaturized Flow throughMicro-dispenser With Piezo-ceramic Tripod Actuation. Journal of microelectro mechanical systems. vol.14, No.1.february 2005
[16] Williams. P. Surface Mount Council, Surface Mount Technology - Status of the Technology and Industry Activities and Action Plan, August 1999.
[17] R. Bush. Matching Fluid Dispensers to Materials for Electronics Applications. Electronic packaging&production,1995,37:56-62
[18] Ruben Burga, Art Tausek. Control of Adhesive Dispensing Parameters During Transition from Research to Production Environments.2003 Electronics Packaging Technology Conference
[19] Bosch V D, DeBarros T. Step-by-step SMT: Adhesives/Epoxies & Dispensing. SMT, 1997, 5: 102-107.
[20] Ness, C.Q. and Lewis, A.R., Adhesives/Epoxies & Dispensing, SMT, Supplement, Pathways to SMT, July 1999:28-32
[21]章梓雄,董曾南.粘性流体力学.北京:清华大学出版社.1998.10~20
[22] Chen X B, G. Schoenau, Zhang W J. Issues on dispensing in surface mount technology (SMT). International Conference on Advanced Manufacturing Technology, Xi'an, China, 1999
[23] Piracci, Anthony F. Practical Production Applications for Jetting Technology, APEX 2000 Conference Proceedings
[24] Steven I. Zoltan. Pulsed droplet ejecting system. U.S Patent 3683212, 1972
[25] Alan Lewis, Steve Adamson. Fluid Dispensing Capabilities for Assembly of MEMS. Asymtek, USA
[26] Horatio Quinones, Alec Babiarz, Lian Fang. Jetting Technology: A Way of the Future in Dispensing. Asymtek Headquarters. USA
[27] Lewis. A, Reighard. M. and Suriawidjaja, F. Noncontact Dispensing Achieves Practical Results. SMT, May 1999:66-67
[28] Reighard, M. Non-Contact SMA Jetting: Reliability and Performance Enter the Manufacturing Environment, NEPCON West 1999 Proceedings.
[29] Horatio Quinones, Alec Babiarz, Christian Deck. Fluid Jetting for Next Generation Packages. Asymtek Headquarters. USA
[30] A.J. Babiarz. Die encapsulation and flip chip underfilling processes for area array packaging of advanced integrated circuits. Asymtek Technical Report, 1997
[31] A. Lewis et al. Conductive adhesive dispensing process considerations, in Proc. Nat. Electron. Packaging.Prod.Conf.,1990,30:26-766
[32] Raj N. Master et al,“Novel Jet Fluxing Application for Advanced Flip Chip and BGA/CGA Packages”proceedings of 50th Electronic Component and Technology Conference, 2000, pp 1185-1188
[33] Lee C (2000) Ultra-high speed dispensing enhance production throughput. Adv Packag
[34] D.Dixon, J.Kazalski, F.Murch. Practical Issues Concerning Dispensing Pump Technologies. Circuits Assembly, 1997,6:36-40
[35] Bob Hoffman. Jetting - a new paradigm in dispensing of light emitting diode products. Asymtek. Carlsbad CA.USA
[36] H.X. Li, S.K. Tso, H. Deng. A Conceptual Approach to Integrate Design and Control for the Epoxy Dispensing Process. Int. J. Adv. Manufact.Technol.,2001,17:677-682
[37] Kropp P. Problems with high speed adhesive dispensing. 7th International SAMPE Electronics Conference, 1994,20(23):487-493
[38] Sven Wedekin.精密微量滴胶. http://www.smtinline.com/chinese/micro- dispensin -g-ch.htm
[39] James C. Smith, James W. Messerly, stow et al. Non-contact liquid material dispenser having a bellows valve assembly and method for ejecting liquid material onto a substrate. U.S Patent 6267266 B1,2001
[40] Alec J. Babiarz, Alan R. Lewis, Yosuke sagami et al. system for jetting phosphor for optical displays. U.S Patent 0029724 A1,2006
[41] Ron Abernathy, J. Babiarz, Nicholas Anthony Barendt et al. viscous material non-contact jetting system. U.S Patent 0001869 A1,2005
[42] James W. Messerly, Laurence B. Saidman et al. Method and apparatus for dispensing small amount of liquid material. U.S Patent 6253957 B1,2001
[43] H.X. Li. Epoxy Dispensing Research. Department of Manufacturing engineering and Engineering Management of City University of Hong Kong,1998
[44] Carreau, P.J., Dekee, Chhabra et al. Rheology of Ploymeric Systems: Principles andApplications. Hanser, Munich, 1997
[45] A. Razban. Intelligent Control of an Automated Adhesive Dispensing Cell: [PhD Thesis]. Imperial College, London, UK, 1993
[46] John Gould. Adhesive in Electronics, Wolfson School of Mechanical and Manufacturing Engineering. Longhborough University, 2004
[47] A. Razban, B.L. Davies. Analytical Modeling of the Automated Dispensing of Adhesive Material. Journal of Adhesion Science Technology,1995,9:1435-1450
[48]赵翼翔.面向半导体封装的点胶系统建模、控制与实现:[博士学位论文].武汉:华中科技大学图书馆,2004
[49]沈正湘,微电子封装中点胶控制系统及其性能控制研究:[硕士学位论文].武汉:华中科技大学图书馆,2005
[50] Razban A. An automated system for dispensing adhesives. International Journal of Adhesion and Adhesives, 1991, 7: 28-33
[51]周润文,阮一平.加快电磁阀吸合与释放的线路.低压电器.4,1995
[52] David. A. Forsyth, Jean Ponce.计算机视觉.第1版.北京:电子工业出版社,2004.6
[53]孙恒.布胶机运动平台及其控制系统的研究.硕士学位论文.中南大学图书馆.2005.
[54]胡科峰.高速高精运动控制系统的软件技术研究.硕士学位论文.华中科技大学图书馆.2004.
[55]张斌,吉传稳,左燕生.具有多种电机控制模式的伺服驱动器的研究.电工电能新技术,1999,1:29-32
[56]邓星钟.机电传动控制.第三版.武汉:华中科技大学出版社.2001.20~23
[57]李松,徐海水,丁国芳.最新Visual C++6.0程序设计教程.北京:冶金工业出版社,2001.3~5