活动模板微小群孔电解加工技术研究
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摘要
电解加工(Electrochemical Machining,ECM)是利用金属在电解液中可以发生阳极溶解的原理,将工件加工成形的一种技术。在电解加工过程中,工件阳极金属不断失去电子成为离子进入到溶液当中,工件材料的减少过程是以离子形式进行的,由于金属离子的尺寸非常微小,因此这种微溶解去除方式使得电解加工在金属微细制造领域有着广泛的应用前景。
本文以航空航天领域中使用的微小群孔结构为研究对象,采用阴极模板双面电解加工微小群孔结构,分析了该种加工方法的特点,研究了阴极模板双面电解加工微小群孔的一些关键问题,所完成的主要工作如下:
1、建立了双面照相电解电场数学模型,并对阳极工件表面进行了有限元电场分析,结果表明:加工区域电场分布呈中间弱两侧强的态势,绝缘层厚度愈厚,电场分布愈均匀,群孔锥度愈小;阴极孔径愈大,群孔锥度愈小。
2、设计了电解液循环系统和电解加工夹具,制作了镀有铬层的阴极模板。
3、以群孔圆度误差、群孔尺寸均匀性以及群孔平均锥度作为评判群孔加工精度的标准,研究了夹紧凸起间距、流道深度、绝缘层厚度、脉冲占空比、电解液压力等工艺参数对群孔加工精度的影响,结果表明:采用小的夹紧凸起间距、小的占空比以及高的电解液压力、适当的流道深度和绝缘层厚度,均能提高群孔加工的尺寸均匀性以及群孔平均锥度;在同等试验参数下,阴极孔径越大,加工出的群孔尺寸均匀性越好、平均锥度越小。
4、提出了采用弹性材料制作夹紧凸起的方法,加工出的多孔径微小群孔具有更高的加工精度。
Electrochemical Machining (ECM) is a processing technology, in which the metallic workpiece as anode is produced based on anodic dissolution in electrolyte. It appears to be a very promising metallic micro-manufacturing technology, because the process could machine the material ion by ion.
Methods of machining multiple micro-holes are described in the dissertation. The method to produce micro-holes by electrochemical machining with reused template is proposed. Key techniques of machining group holes are mainly investigated. The works have been done as follows:
1. Mathematical model of the Photographic ECM electric field has been established. Electric field distribution on the anode surface has been analyzed by using finite element method (FEM).The results show that the electric field distribution of the processing region is weak in the center while strong on both sides. The thicker the insulating layer is, the more uniformity of the electric field is and the smaller taper the holes are. With the same size insulating layer, the greater the cathode aperture is, the smaller taper the holes are.
2. An ECM system for electrolyte circulation has been established. The fixtures of ECM and chrome-plated layer cathode template have been designed and produced.
3. The roundness error, size uniformity, and average taper of multiple micro-holes have been used to characterize hole’s machining accuracy. The effects of protruding space, duty cycle, electrolyte pressure, flow channel depth, and insulation thickness on machining accuracy have been investigated. Results indicate that the machining accuracy could be improved with smaller protruding space, smaller duty cycle and higher electrolyte pressure. Appropriate flow channel depth and insulation thickness are also necessary. Under the same experimental parameters, the greater the cathode aperture is, the better the processing accuracy is.
4. The Flexible protuberances have been introduced to enhance the adherence between the workpiece and the fixture. The experimental results show that the machining accuracy of multi-diameter micro holes could be obtained with elastic clamping.
本文以航空航天领域中使用的微小群孔结构为研究对象,采用阴极模板双面电解加工微小群孔结构,分析了该种加工方法的特点,研究了阴极模板双面电解加工微小群孔的一些关键问题,所完成的主要工作如下:
1、建立了双面照相电解电场数学模型,并对阳极工件表面进行了有限元电场分析,结果表明:加工区域电场分布呈中间弱两侧强的态势,绝缘层厚度愈厚,电场分布愈均匀,群孔锥度愈小;阴极孔径愈大,群孔锥度愈小。
2、设计了电解液循环系统和电解加工夹具,制作了镀有铬层的阴极模板。
3、以群孔圆度误差、群孔尺寸均匀性以及群孔平均锥度作为评判群孔加工精度的标准,研究了夹紧凸起间距、流道深度、绝缘层厚度、脉冲占空比、电解液压力等工艺参数对群孔加工精度的影响,结果表明:采用小的夹紧凸起间距、小的占空比以及高的电解液压力、适当的流道深度和绝缘层厚度,均能提高群孔加工的尺寸均匀性以及群孔平均锥度;在同等试验参数下,阴极孔径越大,加工出的群孔尺寸均匀性越好、平均锥度越小。
4、提出了采用弹性材料制作夹紧凸起的方法,加工出的多孔径微小群孔具有更高的加工精度。
Electrochemical Machining (ECM) is a processing technology, in which the metallic workpiece as anode is produced based on anodic dissolution in electrolyte. It appears to be a very promising metallic micro-manufacturing technology, because the process could machine the material ion by ion.
Methods of machining multiple micro-holes are described in the dissertation. The method to produce micro-holes by electrochemical machining with reused template is proposed. Key techniques of machining group holes are mainly investigated. The works have been done as follows:
1. Mathematical model of the Photographic ECM electric field has been established. Electric field distribution on the anode surface has been analyzed by using finite element method (FEM).The results show that the electric field distribution of the processing region is weak in the center while strong on both sides. The thicker the insulating layer is, the more uniformity of the electric field is and the smaller taper the holes are. With the same size insulating layer, the greater the cathode aperture is, the smaller taper the holes are.
2. An ECM system for electrolyte circulation has been established. The fixtures of ECM and chrome-plated layer cathode template have been designed and produced.
3. The roundness error, size uniformity, and average taper of multiple micro-holes have been used to characterize hole’s machining accuracy. The effects of protruding space, duty cycle, electrolyte pressure, flow channel depth, and insulation thickness on machining accuracy have been investigated. Results indicate that the machining accuracy could be improved with smaller protruding space, smaller duty cycle and higher electrolyte pressure. Appropriate flow channel depth and insulation thickness are also necessary. Under the same experimental parameters, the greater the cathode aperture is, the better the processing accuracy is.
4. The Flexible protuberances have been introduced to enhance the adherence between the workpiece and the fixture. The experimental results show that the machining accuracy of multi-diameter micro holes could be obtained with elastic clamping.
引文
[1]王建业,徐家文.电解加工原理及应用[M].北京:国防工业出版社, 2001.
[2]朱荻.国外电解加工的研究进展[J].电加工与模具,2000,(1):11-16.
[3]朱荻.微米与纳米级加工技术[J].航空制造技术,2002,(6):23-25,39.
[4]朱荻.纳米技术与特种加工[J].电加工与模具,2002,(2):1-5.
[5]苑伟政,马炳和.微机械与微细加工技术[M].西安:西北工业大学出版社,2000.
[6] B.Bhattacharyya, M.Malapati, J.Munda.Experimental study on electrochemical micromachining [J].Journal of Materials Processing Technology, 2005, (169):485-492.
[7]卢维美.电子束纳米加工技术研究现状[J].微细加工技术,1998,(2):1-9.
[8]孙雅洲,梁迎春,程凯.微米和中间尺度机械制造[J].机械工程学报,2004,40(5):1-6.
[9]章吉良,杨春生等.微机电系统及其相关技术[M].上海:上海交通大学出版社,1999.
[10]罗均,谢少荣,龚振邦.面向MEMS的微细加工技术[J].电加工与模具,2001,(5):1-6.
[11]李德胜,王东红,孙金玮,等.MEMS技术及其应用[M].哈尔滨:哈尔滨工业大学出版社,2002.
[12]孔祥东,张玉林,宋会英,等.微机电系统的微细加工技术[J].微纳电子技术,2004,(11):32~38.
[13] E.W.Becker, W.Ehrfeld, P.Hagmann,et al.Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography,galvanoforming,and plastic moulding(LIGA process)[J].Microelectronic Engineering,1986,(4):35-56.
[14]H.Gukel,T.R.Christenson,K.J.Skrobis,etal.Deep X-rayand UV lithographics for micromechanics[A].Solid-state sensor and Actuator Workshop[C].Hilton Head,SC,USA,IEEE,1990:118-122.
[15]朱荻,张朝阳等.微细电化学加工技术的研究与发展[A].见:中国机械工程学会编. 2005年中国机械工程学会年会论文集[C].重庆:中国机械工程学会, 2005: 46~54.
[16] D.Noda,M.Tanaka,K.Shimada,etal.Fabrication of large area diffraction grating using LIGA process[J].Microsyst Technol,2008,(14):1311-1315.
[17] W.Ehrfeld.Electrochemistry and Microsystems[J].Electrochimica Acta,2003,(48):2857~2868.
[18]赵健.综论超精密加工技术的发展[J].机械研究与应用,2008,(10):6-8.
[19] Y.Yamagata,S.Mihara,N.Nishioki,T.Higuchi.A New Fabrication Method for Micro Mctuators with Miezoelectric Thin Film using Precision Cutting Technique[Z].Proceedings of IEEE Micro Electro Mechanical Systems, San Diego,1996.
[20] J.Kozak, K.P.Rajurkar. Selected problems of micro-electrochemical machining [J]. Journal of Materials Processing Technology. 2004, (149): 426–431.
[21]王明环,朱荻,徐惠宇.提高微细电解加工精度的研究[J].电加工与模具,2005,(3):30-33.
[22] Y.Wang, D.A.Silva,Y.Q.Yu.New approach to enhance the accuracy of ECM high-precision short pulses ECM[J].Journal of Materials Processing Technology,2004,(149):382-383.
[23] D.A.Silva, H.Altena,Mcgeough J.Influence of electrolyte concentration on copying accuracy of precision-ECM.Annals of the CIRP,2003,52(1):165-168.
[24] A.Ruszai, M.Zybura, R.Zurek.Some aspects of the electrochemical machining process supported by electrode ultrasonic vibrations optimization.Proceeedings of the Institution of Mechanical Engineers,Part B:Journal of Engineering Manufacture,2003,217(10):1365-1371.
[25] D.Zhu, H.Y.Xu.Improvement of electrochemical machining accuracy by using dual pole tool[J].Journal of Materials Processing Technology,2002,(129):15-18.
[26]徐惠宇,朱荻.微细群缝的精密电解加工研究[J].中国机械工程,2004,15(21):1912~1915.
[27] K.Chikamori. Possibilities of Electrochemical Micromachining [J].Int. J. Japan Soc. Pre. Eng., 1998, 32(1): 37-38.
[28] R. F?rster, A. Schoth, W. Menz. Micro-ECM for production of microsystems with a high aspect ratio[J]. Microsystem Technologies , 2005,(11):246–249.
[29] A.Timothy. Fofonoff, M.M.Sylvain, G.H.Nicholas, P.John.Donoghue. Microelectrode Array Fabrication by Electrical Discharge Machining and Chemical Etching [J]. IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, 2004, Vol.51 (6): 10-14.
[30] K.Takahata,Y.B.Gianchandani.Batch Mode Micro-EDM for High-density and High-thoughput micromachining[J]. Journal of Microelectromechanical Systems, 2002, 11 (4): 72-75.
[31]张勇,赵航,张广玉,等.微细电火花加工系统及其工艺技术[J].中国机械工程,2008,19(5):526-530.
[32]张辽远.现代加工技术[M].北京:机械工业出版社,2002.
[33]潘开林,陈子辰,傅键中.激光微细加工技术及其在MEMS微制造中的应用[J].制造技术与机床, 2002, (3): 15-19.
[34]贾宝贤,王振龙,赵万生.基于特种加工的微小孔加工技术[J].电加工与模具,2005,(2):1-5.
[35]马星辉,高国富,赵波,等.精密微小孔加工技术进展[J].电加工与模具,2008,(5):13-18.
[36] K.Takahata,Y.B.Gianchandani.Batch Mode Micro-Electro-Dicharge Machining[J].Journal of microelectromechanical systems,2002,11(2):102-110.
[37]施文轩,张明岐.电射流加工工艺研究和发展发展[J].电加工与模具,2001,(1):36-39.
[38] B. Bhattacharyya, J. Munda, M. Malapati. Advancement in electrochemical micro-Machining[J]. International Journal of Machine Tools & Manufacture, 2004, 44: 1577–1589.
[39] M.Datta.Electrochemical Micromachining in Electrochemical Technology: Innovations and New Developments[M]. Tokyo, 1996.
[40] M.Datta.Fabrication of an Array of Precision Nozzles by Through-Mask Electro chemical Micromachining [J]. Journal of Electrochemical Society, 1995, 142 (11): 655-669.
[41]吴仲达,朱耀武,吴万伟译.理论电化学[M].北京:高等教育出版社, 1981.
[42]朱荻,王明环,明平美,等.微细电化学加工技术[J].纳米技术与精密工程, 2005, 3(2): 151-155.
[43]徐惠宇.微细电解加工系统及其相关工艺的研究[D].南京:南京航空航天大学, 2004.
[44] B. Bhattacharyya, S. Mitra, A. K. Boro. Electrochemical machining: new possibilities for micromachining [J]. Robotics and Computer Integrated Manufacturing, 2002, 18: 283-289.
[45]刘晋春,赵家齐,赵万生.特种加工[M](第三版).北京:机械工业出版,2000.
[46]唐兴伦,范群波. ANSYS工程应用教程—热与电磁学篇[M].北京:中国铁道出版社, 2003.
[47]刘建,朱荻,曲宁松,等.金属薄板微小群孔掩膜电解加工技术研究[J].电加工与模具,2008,(3):37-39,63.
[48]蔺海荣.材料力学[M].北京:国防工业出版社,2001.
[2]朱荻.国外电解加工的研究进展[J].电加工与模具,2000,(1):11-16.
[3]朱荻.微米与纳米级加工技术[J].航空制造技术,2002,(6):23-25,39.
[4]朱荻.纳米技术与特种加工[J].电加工与模具,2002,(2):1-5.
[5]苑伟政,马炳和.微机械与微细加工技术[M].西安:西北工业大学出版社,2000.
[6] B.Bhattacharyya, M.Malapati, J.Munda.Experimental study on electrochemical micromachining [J].Journal of Materials Processing Technology, 2005, (169):485-492.
[7]卢维美.电子束纳米加工技术研究现状[J].微细加工技术,1998,(2):1-9.
[8]孙雅洲,梁迎春,程凯.微米和中间尺度机械制造[J].机械工程学报,2004,40(5):1-6.
[9]章吉良,杨春生等.微机电系统及其相关技术[M].上海:上海交通大学出版社,1999.
[10]罗均,谢少荣,龚振邦.面向MEMS的微细加工技术[J].电加工与模具,2001,(5):1-6.
[11]李德胜,王东红,孙金玮,等.MEMS技术及其应用[M].哈尔滨:哈尔滨工业大学出版社,2002.
[12]孔祥东,张玉林,宋会英,等.微机电系统的微细加工技术[J].微纳电子技术,2004,(11):32~38.
[13] E.W.Becker, W.Ehrfeld, P.Hagmann,et al.Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography,galvanoforming,and plastic moulding(LIGA process)[J].Microelectronic Engineering,1986,(4):35-56.
[14]H.Gukel,T.R.Christenson,K.J.Skrobis,etal.Deep X-rayand UV lithographics for micromechanics[A].Solid-state sensor and Actuator Workshop[C].Hilton Head,SC,USA,IEEE,1990:118-122.
[15]朱荻,张朝阳等.微细电化学加工技术的研究与发展[A].见:中国机械工程学会编. 2005年中国机械工程学会年会论文集[C].重庆:中国机械工程学会, 2005: 46~54.
[16] D.Noda,M.Tanaka,K.Shimada,etal.Fabrication of large area diffraction grating using LIGA process[J].Microsyst Technol,2008,(14):1311-1315.
[17] W.Ehrfeld.Electrochemistry and Microsystems[J].Electrochimica Acta,2003,(48):2857~2868.
[18]赵健.综论超精密加工技术的发展[J].机械研究与应用,2008,(10):6-8.
[19] Y.Yamagata,S.Mihara,N.Nishioki,T.Higuchi.A New Fabrication Method for Micro Mctuators with Miezoelectric Thin Film using Precision Cutting Technique[Z].Proceedings of IEEE Micro Electro Mechanical Systems, San Diego,1996.
[20] J.Kozak, K.P.Rajurkar. Selected problems of micro-electrochemical machining [J]. Journal of Materials Processing Technology. 2004, (149): 426–431.
[21]王明环,朱荻,徐惠宇.提高微细电解加工精度的研究[J].电加工与模具,2005,(3):30-33.
[22] Y.Wang, D.A.Silva,Y.Q.Yu.New approach to enhance the accuracy of ECM high-precision short pulses ECM[J].Journal of Materials Processing Technology,2004,(149):382-383.
[23] D.A.Silva, H.Altena,Mcgeough J.Influence of electrolyte concentration on copying accuracy of precision-ECM.Annals of the CIRP,2003,52(1):165-168.
[24] A.Ruszai, M.Zybura, R.Zurek.Some aspects of the electrochemical machining process supported by electrode ultrasonic vibrations optimization.Proceeedings of the Institution of Mechanical Engineers,Part B:Journal of Engineering Manufacture,2003,217(10):1365-1371.
[25] D.Zhu, H.Y.Xu.Improvement of electrochemical machining accuracy by using dual pole tool[J].Journal of Materials Processing Technology,2002,(129):15-18.
[26]徐惠宇,朱荻.微细群缝的精密电解加工研究[J].中国机械工程,2004,15(21):1912~1915.
[27] K.Chikamori. Possibilities of Electrochemical Micromachining [J].Int. J. Japan Soc. Pre. Eng., 1998, 32(1): 37-38.
[28] R. F?rster, A. Schoth, W. Menz. Micro-ECM for production of microsystems with a high aspect ratio[J]. Microsystem Technologies , 2005,(11):246–249.
[29] A.Timothy. Fofonoff, M.M.Sylvain, G.H.Nicholas, P.John.Donoghue. Microelectrode Array Fabrication by Electrical Discharge Machining and Chemical Etching [J]. IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, 2004, Vol.51 (6): 10-14.
[30] K.Takahata,Y.B.Gianchandani.Batch Mode Micro-EDM for High-density and High-thoughput micromachining[J]. Journal of Microelectromechanical Systems, 2002, 11 (4): 72-75.
[31]张勇,赵航,张广玉,等.微细电火花加工系统及其工艺技术[J].中国机械工程,2008,19(5):526-530.
[32]张辽远.现代加工技术[M].北京:机械工业出版社,2002.
[33]潘开林,陈子辰,傅键中.激光微细加工技术及其在MEMS微制造中的应用[J].制造技术与机床, 2002, (3): 15-19.
[34]贾宝贤,王振龙,赵万生.基于特种加工的微小孔加工技术[J].电加工与模具,2005,(2):1-5.
[35]马星辉,高国富,赵波,等.精密微小孔加工技术进展[J].电加工与模具,2008,(5):13-18.
[36] K.Takahata,Y.B.Gianchandani.Batch Mode Micro-Electro-Dicharge Machining[J].Journal of microelectromechanical systems,2002,11(2):102-110.
[37]施文轩,张明岐.电射流加工工艺研究和发展发展[J].电加工与模具,2001,(1):36-39.
[38] B. Bhattacharyya, J. Munda, M. Malapati. Advancement in electrochemical micro-Machining[J]. International Journal of Machine Tools & Manufacture, 2004, 44: 1577–1589.
[39] M.Datta.Electrochemical Micromachining in Electrochemical Technology: Innovations and New Developments[M]. Tokyo, 1996.
[40] M.Datta.Fabrication of an Array of Precision Nozzles by Through-Mask Electro chemical Micromachining [J]. Journal of Electrochemical Society, 1995, 142 (11): 655-669.
[41]吴仲达,朱耀武,吴万伟译.理论电化学[M].北京:高等教育出版社, 1981.
[42]朱荻,王明环,明平美,等.微细电化学加工技术[J].纳米技术与精密工程, 2005, 3(2): 151-155.
[43]徐惠宇.微细电解加工系统及其相关工艺的研究[D].南京:南京航空航天大学, 2004.
[44] B. Bhattacharyya, S. Mitra, A. K. Boro. Electrochemical machining: new possibilities for micromachining [J]. Robotics and Computer Integrated Manufacturing, 2002, 18: 283-289.
[45]刘晋春,赵家齐,赵万生.特种加工[M](第三版).北京:机械工业出版,2000.
[46]唐兴伦,范群波. ANSYS工程应用教程—热与电磁学篇[M].北京:中国铁道出版社, 2003.
[47]刘建,朱荻,曲宁松,等.金属薄板微小群孔掩膜电解加工技术研究[J].电加工与模具,2008,(3):37-39,63.
[48]蔺海荣.材料力学[M].北京:国防工业出版社,2001.