基于LTCC技术的建模与应用研究
摘要
随着无线通信事业的飞速发展,射频工程师和封装工程师面临着电子产品向更高密度,更高稳定性和更多功能性发展的挑战。低温共烧陶瓷(LTCC)技术是解决这个问题的方案之一。
本文主要介绍了LTCC技术的特点,LTCC无源元件的建模流程。基于电容的物理结构特点,提出了一个可重构的高频电容模型,并给出其模型参数的计算公式,双层电容等效电路模型可以准确到4GHz,四层电容等效电路模型可以准确到2GHz。根据S参数建立了修正Π平面螺旋电感高频等效电路模型及模型参数提取方法,采用三维电磁场仿真软件HFSS分析了不同线宽、不同间距、不同圈数情况下的电感有效值、耦合电容、趋肤效应电阻及Q值,利用ADS建立了相应的模型库。仿真结果表明,其模型可准确到7Ghz。利用已经建立的电容、电感模型,建立了全新的LTCC多层滤波器的设计流程,并成功地设计了4GHz的低通滤波器。
RF engineers and packaging engineers are facing the challenges to make electronic products with high density, high stability and high functionality. Low Temperature Co-fired Ceramics(LTCC)technology is a technique to solve this problem.
In this thesis, the characteristics of LTCC technology and modeling flow of LTCC process passive components are introduced. Based on the capacitor physical structure, a reconfigurable high frequency capacitor model is established and the formulas to calculate the model parameters are given. The model indicates that two-layer model of the equivalent circuit can be accurate at 4GHz, and the four-layer model accurate at 2GHz. By using S parameter, the modified-Πequivalent circuit of plane spiral inductor and the method of parameters extraction are established. The effective value of inductor, the coupling capacitor, the high-resistors and quality factor Q are analyzed with HFSS software under different conditions such as different line widths, spaces and loops. A corresponding model library which equivalent circuit can be accurate at 7GHz for LTCC plane spiral inductor is established to ADS software. A new filter design process which successfully applied to 4GHz low-pass filter is established by using the proposed capacitor and inductor model.
本文主要介绍了LTCC技术的特点,LTCC无源元件的建模流程。基于电容的物理结构特点,提出了一个可重构的高频电容模型,并给出其模型参数的计算公式,双层电容等效电路模型可以准确到4GHz,四层电容等效电路模型可以准确到2GHz。根据S参数建立了修正Π平面螺旋电感高频等效电路模型及模型参数提取方法,采用三维电磁场仿真软件HFSS分析了不同线宽、不同间距、不同圈数情况下的电感有效值、耦合电容、趋肤效应电阻及Q值,利用ADS建立了相应的模型库。仿真结果表明,其模型可准确到7Ghz。利用已经建立的电容、电感模型,建立了全新的LTCC多层滤波器的设计流程,并成功地设计了4GHz的低通滤波器。
RF engineers and packaging engineers are facing the challenges to make electronic products with high density, high stability and high functionality. Low Temperature Co-fired Ceramics(LTCC)technology is a technique to solve this problem.
In this thesis, the characteristics of LTCC technology and modeling flow of LTCC process passive components are introduced. Based on the capacitor physical structure, a reconfigurable high frequency capacitor model is established and the formulas to calculate the model parameters are given. The model indicates that two-layer model of the equivalent circuit can be accurate at 4GHz, and the four-layer model accurate at 2GHz. By using S parameter, the modified-Πequivalent circuit of plane spiral inductor and the method of parameters extraction are established. The effective value of inductor, the coupling capacitor, the high-resistors and quality factor Q are analyzed with HFSS software under different conditions such as different line widths, spaces and loops. A corresponding model library which equivalent circuit can be accurate at 7GHz for LTCC plane spiral inductor is established to ADS software. A new filter design process which successfully applied to 4GHz low-pass filter is established by using the proposed capacitor and inductor model.
引文
[1] 杨邦朝,张经国.多芯片组件技术及其应用.电子科技大学出版社.2001,8 p1-2
[2] 王悦辉,周济等 . 低温共烧陶瓷无源集成技术及其应用 . 材料导报,2005,19(9):p83-90
[3] Martin. Opperman.Multichip modules (MCMs) For Micro-And Millimeter-Wave Applications- a Challenge.International Conference on Multichip Modules and High Density Packaging.1998. p279 –284
[4] J.B.Tang and K.Wu. Design technique of broadband planar interconnects for co-layer multi-chip module (MCM) of microwave.Asia-Pacific Microwave Conference Proceedings,APMC. 1999. p116-119.
[5] P.Pruna, PennYan. Microwave Characterization Of Low Temperature Cofired Ceramic.Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces.1998. 12(6):p134-137.
[6] Anh-Vu H.Pham, Vikram Krishnamurthy, D.Bates,etc. Development of integral passive components for multilayer organic MCMs at millimeter wave frequencie. IEEE Transactions on Advanced Packaging,2002. 19(3):p98-101.
[7] B. G. Choi,M. G. Stubbsr,etc. A Ka-band narrow bandpass filter using LTCC technology. Microwave and Wireless Components Letters,IEEE. 2003.13(9).p388 –389.
[8] Vasily Kondratyev, Markku Lahti, Tuomo Jaakola .On the design of ltcc filter for millimeter-waves. IEEE MTT-S International Microwave Symposium Digest. v3. 2003: p1771-1773.
[9] Yong Chul Lee, Chul Soon Park. A new millimeter-wave stripline resonator with embedded air cavities in ltcc multilayer structure. IEEE MTT-S International Microwave Symposium Digest. v3.2003:p2027-2030.
[10] Ayman El-Tager,Joey Bray,and Langis Roy.High-Q LTCC resonators for millimeter wave applications. IEEE MTT-S International Microwave Symposium Digest.v3.2003: p2257-2260.
[11] R.Kulke,W.Simon,M.Rittweger,etc. Integration techniques for MMICs and chip devices in LTCC multichip modules for radio frequencies. International Symposium on Microelectronic.September 2000. p642-647.
[12] R.Kulke,W.Simon,etc. Point-to-Multipoint transceiver in LTCC for 26GHz.International Symposium on Microelectronic(IMAPS). 2002.
[13] K.Maruhashi,K.Ohata,H.Shimawaki,etc .Small-size 72-GHz-band transceiver modules utilizing IF self-heterodyne transmission technology. IEEE MTT-S International Microwave Symposium Digest. v2. 2003:p1045-1048.
[14] 严 伟 , 洪 伟 , 薛 羽 . 低 温 共 烧 陶 瓷 微 波 多 芯 片 组 件 . 电 子 学 报 . 2002,5,30(5):p711-714.
[15] 王 钧 , 施 建 俊 , 李 征 凡 . 微 波 MCM 电 路 的 设 计 与 制 作 . 电 讯 技术.1998.12(6):p17-19
[16]. 刘 永 宁 . 微 波 多 层 电 路 与 低 温 共 烧 陶 瓷 (LTCC). 现 代 雷 达 .2000.06 22(6):p83-86
[17]. 姜伟卓,严伟,谢廉忠 .LTCC 多层微波互连基板布局布线设计及制造技术.电子科技大学硕士论文术.2000 年.
[18]. 夏雷.8 毫米 MCM 接收前端研究.硕士学位论文.2004.
[19]. 张斌. 毫米波接收前端多芯片组件(MCM)技术研究.硕士学位论文.2003
[20] 龙乐. 系统封装技术及发展. 电子封装, 2004,4(2): p15-19
[21] Alex Beiley et al., Miniature Filter for Digital Receiver, IEEE MTT-S Digest Part, 1992 (2):p999-1002
[22] Tim Mobley, Tony Donisi, etc. Filter Design Flow and Implementation in LTCC. PartnersIn Design Worldwide Technical Workshops Presentation 16. Ansoft corporation and DupontElectronic Technologies, 2001.
[23] 信息产业部电子 43 所情报中心“杜邦生瓷带线路设计指南”。混合微电子技术,2000,11(2),p11～25
[24] Gerard Vanrietvelde.a new challenge for ceramic thick film technology. Microwave and mm-meter wave applications,2002,32(12):p21-32
[25] Varian K,Walton D,A2-Bit RF MEM SPHASE Shifter in a Thick-Film BGA Ceramic Package. 2002 IEEE Trans 2002 12(9),p 321-323
[26] Golonka L J. New application of LTCC technology. in Proc.28th int. Spring Seminar on electronics, 2005: p148-152
[27] David K Sakamoto. T/R Modules for Automated Assembly and Test Using Flip Chip and LTCC Packaging. ARFTG Conference Digest-Fall, Dec. 1992 :p 57-78
[28] Davis M F,Sutono A,Lim K,Laskar J,et al. RF-microwave multi-layer integrated passives sing fully organic System on Package (SOP) technology. IEEE MTT-S Int. Microwave Symp,Dig. 2001: p1731-1734
[29] Sutono A,Chen Y J,Laskar J. High-Q LTCC-Based Passive Library for Wireless System-on-Package(SOP) Module Development. IEEE Trans Microwave TheoryAnd Tech, 2001,49(10):1715-1724
[30] 熊锦康 . 微带线与不同层间带状线在 LTCC 设计中相互转换 2006. 9.24(3):p12-14
[31] Olivei Alfredo. Optimized Miniature Thin-Film Planar Inductors, Compatible With Integrated Circuits. IEEE Transactions on Parts,Materials and Packaging, 1969,5(2): p71-88
[32] Ggoldfarb M E. and Pucel Robert A, Modeling Via Hole Ground in Microstrip. IEEE Microwave and Guided Wave Letters, 1991,5(6): p35-137
[33] 王子宇.射频电路设计-理论与应用,电子工业出版社,2005.5
[34] Olivei Alfredo. Optimized Miniature Thin-Film Planar Inductors, Compatible With Integrated Circuits. IEEE Transactions on Parts, Materials and Packaging, 1969,5(2): p71-88
[35] Ggoldfarb M E. and Pucel Robert A, Modeling Via Hole Ground in Microstrip. IEEE Microwave and Guided Wave Letters, 1991,5(6): p135-137
[36] 甘本拔,吴万春.现代微波滤波器的结构与设计,北京:科学出版社 1973 年
[37] Design of LTCC RF Modules for Communication Systems. Empowering Profitability Worldwide Workshop, Ansoft Corporation.2002.7:p1-87
[38] Tim Mobley,Glenn Oliver.Filter Design Flow and Implementation in LTCC. Parters in Design Worldwide Technical Workshops Presentation 16, Ansoft Corporation 2002.7:p1-43
[39] 费元春,苏广川,宽带雷达信号产生技术,北京:国防工业出版社 2001 年
[40] F.E.Vilet,A.de Boer, Fully-Integrated Core chip for X-Band modules. TNO Physics and Phased-Array T/R Electronics Laboratory. IEEE MTT-S Digest, 2004:p1753-1756
[2] 王悦辉,周济等 . 低温共烧陶瓷无源集成技术及其应用 . 材料导报,2005,19(9):p83-90
[3] Martin. Opperman.Multichip modules (MCMs) For Micro-And Millimeter-Wave Applications- a Challenge.International Conference on Multichip Modules and High Density Packaging.1998. p279 –284
[4] J.B.Tang and K.Wu. Design technique of broadband planar interconnects for co-layer multi-chip module (MCM) of microwave.Asia-Pacific Microwave Conference Proceedings,APMC. 1999. p116-119.
[5] P.Pruna, PennYan. Microwave Characterization Of Low Temperature Cofired Ceramic.Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces.1998. 12(6):p134-137.
[6] Anh-Vu H.Pham, Vikram Krishnamurthy, D.Bates,etc. Development of integral passive components for multilayer organic MCMs at millimeter wave frequencie. IEEE Transactions on Advanced Packaging,2002. 19(3):p98-101.
[7] B. G. Choi,M. G. Stubbsr,etc. A Ka-band narrow bandpass filter using LTCC technology. Microwave and Wireless Components Letters,IEEE. 2003.13(9).p388 –389.
[8] Vasily Kondratyev, Markku Lahti, Tuomo Jaakola .On the design of ltcc filter for millimeter-waves. IEEE MTT-S International Microwave Symposium Digest. v3. 2003: p1771-1773.
[9] Yong Chul Lee, Chul Soon Park. A new millimeter-wave stripline resonator with embedded air cavities in ltcc multilayer structure. IEEE MTT-S International Microwave Symposium Digest. v3.2003:p2027-2030.
[10] Ayman El-Tager,Joey Bray,and Langis Roy.High-Q LTCC resonators for millimeter wave applications. IEEE MTT-S International Microwave Symposium Digest.v3.2003: p2257-2260.
[11] R.Kulke,W.Simon,M.Rittweger,etc. Integration techniques for MMICs and chip devices in LTCC multichip modules for radio frequencies. International Symposium on Microelectronic.September 2000. p642-647.
[12] R.Kulke,W.Simon,etc. Point-to-Multipoint transceiver in LTCC for 26GHz.International Symposium on Microelectronic(IMAPS). 2002.
[13] K.Maruhashi,K.Ohata,H.Shimawaki,etc .Small-size 72-GHz-band transceiver modules utilizing IF self-heterodyne transmission technology. IEEE MTT-S International Microwave Symposium Digest. v2. 2003:p1045-1048.
[14] 严 伟 , 洪 伟 , 薛 羽 . 低 温 共 烧 陶 瓷 微 波 多 芯 片 组 件 . 电 子 学 报 . 2002,5,30(5):p711-714.
[15] 王 钧 , 施 建 俊 , 李 征 凡 . 微 波 MCM 电 路 的 设 计 与 制 作 . 电 讯 技术.1998.12(6):p17-19
[16]. 刘 永 宁 . 微 波 多 层 电 路 与 低 温 共 烧 陶 瓷 (LTCC). 现 代 雷 达 .2000.06 22(6):p83-86
[17]. 姜伟卓,严伟,谢廉忠 .LTCC 多层微波互连基板布局布线设计及制造技术.电子科技大学硕士论文术.2000 年.
[18]. 夏雷.8 毫米 MCM 接收前端研究.硕士学位论文.2004.
[19]. 张斌. 毫米波接收前端多芯片组件(MCM)技术研究.硕士学位论文.2003
[20] 龙乐. 系统封装技术及发展. 电子封装, 2004,4(2): p15-19
[21] Alex Beiley et al., Miniature Filter for Digital Receiver, IEEE MTT-S Digest Part, 1992 (2):p999-1002
[22] Tim Mobley, Tony Donisi, etc. Filter Design Flow and Implementation in LTCC. PartnersIn Design Worldwide Technical Workshops Presentation 16. Ansoft corporation and DupontElectronic Technologies, 2001.
[23] 信息产业部电子 43 所情报中心“杜邦生瓷带线路设计指南”。混合微电子技术,2000,11(2),p11～25
[24] Gerard Vanrietvelde.a new challenge for ceramic thick film technology. Microwave and mm-meter wave applications,2002,32(12):p21-32
[25] Varian K,Walton D,A2-Bit RF MEM SPHASE Shifter in a Thick-Film BGA Ceramic Package. 2002 IEEE Trans 2002 12(9),p 321-323
[26] Golonka L J. New application of LTCC technology. in Proc.28th int. Spring Seminar on electronics, 2005: p148-152
[27] David K Sakamoto. T/R Modules for Automated Assembly and Test Using Flip Chip and LTCC Packaging. ARFTG Conference Digest-Fall, Dec. 1992 :p 57-78
[28] Davis M F,Sutono A,Lim K,Laskar J,et al. RF-microwave multi-layer integrated passives sing fully organic System on Package (SOP) technology. IEEE MTT-S Int. Microwave Symp,Dig. 2001: p1731-1734
[29] Sutono A,Chen Y J,Laskar J. High-Q LTCC-Based Passive Library for Wireless System-on-Package(SOP) Module Development. IEEE Trans Microwave TheoryAnd Tech, 2001,49(10):1715-1724
[30] 熊锦康 . 微带线与不同层间带状线在 LTCC 设计中相互转换 2006. 9.24(3):p12-14
[31] Olivei Alfredo. Optimized Miniature Thin-Film Planar Inductors, Compatible With Integrated Circuits. IEEE Transactions on Parts,Materials and Packaging, 1969,5(2): p71-88
[32] Ggoldfarb M E. and Pucel Robert A, Modeling Via Hole Ground in Microstrip. IEEE Microwave and Guided Wave Letters, 1991,5(6): p35-137
[33] 王子宇.射频电路设计-理论与应用,电子工业出版社,2005.5
[34] Olivei Alfredo. Optimized Miniature Thin-Film Planar Inductors, Compatible With Integrated Circuits. IEEE Transactions on Parts, Materials and Packaging, 1969,5(2): p71-88
[35] Ggoldfarb M E. and Pucel Robert A, Modeling Via Hole Ground in Microstrip. IEEE Microwave and Guided Wave Letters, 1991,5(6): p135-137
[36] 甘本拔,吴万春.现代微波滤波器的结构与设计,北京:科学出版社 1973 年
[37] Design of LTCC RF Modules for Communication Systems. Empowering Profitability Worldwide Workshop, Ansoft Corporation.2002.7:p1-87
[38] Tim Mobley,Glenn Oliver.Filter Design Flow and Implementation in LTCC. Parters in Design Worldwide Technical Workshops Presentation 16, Ansoft Corporation 2002.7:p1-43
[39] 费元春,苏广川,宽带雷达信号产生技术,北京:国防工业出版社 2001 年
[40] F.E.Vilet,A.de Boer, Fully-Integrated Core chip for X-Band modules. TNO Physics and Phased-Array T/R Electronics Laboratory. IEEE MTT-S Digest, 2004:p1753-1756
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