UV-LIGA与微细电加工组合制造金属阵列网板技术研究
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摘要
随着MEMS技术及微细加工技术的发展,金属微细阵列网板得到了越来越广泛的应用,如电子显微镜的透光栅网、喷墨打印机的喷板、纺织机械行业的喷丝板和印花网、航空、化工、食品等行业的精细过滤网、粒子筛分网等等。如何实现微细阵列网板的高效、低成本制造一直是国内外学术界和产业界持续关注的研究课题。
本文主要针对Micro/Meso尺度金属阵列网板的加工,提出了UV-LIGA与微细电加工技术组合制造微细阵列网板技术,该技术既结合了UV-LIGA技术成本低廉、易于批量生产,微细电火花可控性好和微细电解无工具损耗等各种加工手段的优点,又避开了UV-LIGA只能制造铜、镍及其合金等几种金属,微细电火花存在工具损耗、具有再铸层,微细电解工具电极制造困难等缺点,是一种高效、低廉的新型加工手段。最后对过电铸缩孔工艺制作超小尺寸微细阵列网板技术进行了探讨。本文的主要内容包括以下几个方面。
(1)提出金属基底上超厚(1mm)SU-8胶模制造方法。实验研究了基于金属基底的超厚SU-8光刻胶紫外光刻工艺的各个环节,包括倒胶方式、前烘温度与时间、曝光剂量、后烘温度与时间、显影方式及时间等。在正交试验的基础上选取优化的工艺组合,并用实验验证了其正确性。利用优化的工艺措施,制备出了厚度达1mm,最大高径比达20的高尺寸精度、轮廓清晰、表面质量好、无明显缺陷、与基底结合力强的超厚胶模。
(2)针对交联SU-8胶去胶困难的问题,分别对阴性胶结构和阳性胶结构提出了有效的去胶方法。阴性胶结构在电铸前先通过掩膜电解的方法制作微坑作为桩基,在微坑上电铸可以有效增强电铸金属与金属基底的结合力,从而保证去胶时电铸金属微结构不被剥离。对阳性胶结构,电铸后通过高温灰化的方式去除交联的SU-8胶。
(3)给出了两种制造金属阵列微细电极的技术。电解辅助UV-LIGA法制造金属阵列电极技术和UV-LIGA与微细电火花加工组合制造大高径比微细阵列电极技术。电解辅助UV-LIGA法即在电铸前先通过掩膜电解的方法制作微坑提高电铸结合力,建立了超厚胶掩膜电解电场模型,对微坑的成型过程进行了仿真。选取合适的电解加工参数,最终获得了完整的微细阵列电极。UV-LIGA与微细电火花加工组合制造法既克服了UV-LIGA制作凸起微细阵列电极时去胶困难的问题,又解决了微细电火花电极制作困难的缺点,通过优化微细电火花加工条件,一次套料加工出长度达1.5mm,高径比达17.65的阵列电极。
(4)利用制作的微细阵列电极作为工具在100μm厚的不锈钢片上进行微细电解加工。分析了电解液组成、电极进给速度、加工电参数等对微孔电解加工精度和加工稳定性的影响。结果显示,通过采用脉冲电解加工电源、低浓度的电解液、低加工电压等措施,微细电解加工的加工精度、加工稳定性等都得到了明显的提高。根据分析优化后的参数,以制备出的阵列电极为工具阴极进行微细群孔的电解加工实验。通过对阵列电极进行绝缘处理,电解加工出了异形孔阵列结构。
(5)提出过电铸缩孔工艺制造超小孔(<10μm)阵列结构。建立了过电铸缩孔工艺的电场模型,对电沉积过程进行了模拟仿真,将数值分析结果用于指导实验。最终制备了直径4μm的超小孔阵列。实验表明,过电铸缩孔技术是一种高效、低廉、可批量生产的制作超小孔的技术手段。
As the improve of the MEMS and mciro-fabrication technology, micro-screen has been used in a wide range of applications, such as grid mesh, inkjet plate, spinneret plate, filter screens and test sieves et al. How to fabricate the micro screens by a low cost and high effciency way is a big challenge to the academia and industry.
For fabricating Micro/Meso metal micro screens, the combination of UV-LIGA with micro electro-machining is presented in this paper, and relative researches have been carried out. The dissertation consists of five sections, including:
(1) The parameters of UV lithography process including coating method, pre-bake temperature & time, exposure dose, post bake temperature & time and development time et al. have been studied to pattern SU-8 photoresist on a metal substrate. Using orthogonal array technique, an optimization experiment is performed to characterize the processing of SU-8 photoresist. Using the optimized process parameters, SU-8 moulds up to 1mm thick of different shapes with high definition, good topography, fewer defects and excellent adhesion with metal substrate have been produced successfully.
(2) Two methods are advanced to solve the SU-8 removal problem. For the negative resist mould, before the electroforming process, a through-mask electrochemical micromachining (through-mask EMM) procedure was carried out to make micro roots on the substrate, the micro roots could improve the adhesion of micro electrode array electroformed on the substrate, so the electrode array could not be peeled after the resist removed. For the positive resist mould, after electroformed, the cross-linked SU-8 resist can be burned directed.
(3) Two processes are adopted to fabricate the metal electrode array: The micro ECM aided UV-LIGA technology and the combination of UV-LIGA with the Micro electro-discharge machining (Micro-EDM) process. The micro ECM aided UV-LIGA technology was using the through-mask EMM to make micro roots to improve the adhesion of micro electrode array electroformed on the substrate, a mathematical model is presented to simulate the through-mask EMM process by finite element method (FEM), through the optimized parameter of the through-mask EMM, the ultra-thick cross-linked SU-8 resist is completely removed without destroying the electroformed microstructures. The combination of UV-LIGA with the Micro-EDM process both solved the problem of resist removal and the difficulty of micro-EDM electrode fabrication, using the optimized parameter of micro-EDM, electrode array of 1.5mm long and aspect ratio up to 17.65 was fabricated.
(4) Using the fabricated electrode arrays to machine micro screens on the 100μm thick stainless steel. The effects of various parameters on the machining accuracy and stability are investigated, including electrolyte, electrode feeding speed,electrical parameters, et al.. Results indicate that pulse current, low concentration electrolyte, low voltage could attribute good performance of micro ECM. Machining accuracy and stability could be improved. After the electrode arrays are insulated, micro hole arrays of profiled holes are machined.
(5) The over-plating method is introduced to fabricate the super micro hole array (size less than 10μm). A mathematical model is presented to simulate the over-plating process by finite element method (FEM). Finally, the micro hole array of diameter 4μm was fabricated by the over-plating technology. The result indicates that over-plating is a simple, low cost method to fabricate micro hole array, and it’s suitable to batch production.
本文主要针对Micro/Meso尺度金属阵列网板的加工,提出了UV-LIGA与微细电加工技术组合制造微细阵列网板技术,该技术既结合了UV-LIGA技术成本低廉、易于批量生产,微细电火花可控性好和微细电解无工具损耗等各种加工手段的优点,又避开了UV-LIGA只能制造铜、镍及其合金等几种金属,微细电火花存在工具损耗、具有再铸层,微细电解工具电极制造困难等缺点,是一种高效、低廉的新型加工手段。最后对过电铸缩孔工艺制作超小尺寸微细阵列网板技术进行了探讨。本文的主要内容包括以下几个方面。
(1)提出金属基底上超厚(1mm)SU-8胶模制造方法。实验研究了基于金属基底的超厚SU-8光刻胶紫外光刻工艺的各个环节,包括倒胶方式、前烘温度与时间、曝光剂量、后烘温度与时间、显影方式及时间等。在正交试验的基础上选取优化的工艺组合,并用实验验证了其正确性。利用优化的工艺措施,制备出了厚度达1mm,最大高径比达20的高尺寸精度、轮廓清晰、表面质量好、无明显缺陷、与基底结合力强的超厚胶模。
(2)针对交联SU-8胶去胶困难的问题,分别对阴性胶结构和阳性胶结构提出了有效的去胶方法。阴性胶结构在电铸前先通过掩膜电解的方法制作微坑作为桩基,在微坑上电铸可以有效增强电铸金属与金属基底的结合力,从而保证去胶时电铸金属微结构不被剥离。对阳性胶结构,电铸后通过高温灰化的方式去除交联的SU-8胶。
(3)给出了两种制造金属阵列微细电极的技术。电解辅助UV-LIGA法制造金属阵列电极技术和UV-LIGA与微细电火花加工组合制造大高径比微细阵列电极技术。电解辅助UV-LIGA法即在电铸前先通过掩膜电解的方法制作微坑提高电铸结合力,建立了超厚胶掩膜电解电场模型,对微坑的成型过程进行了仿真。选取合适的电解加工参数,最终获得了完整的微细阵列电极。UV-LIGA与微细电火花加工组合制造法既克服了UV-LIGA制作凸起微细阵列电极时去胶困难的问题,又解决了微细电火花电极制作困难的缺点,通过优化微细电火花加工条件,一次套料加工出长度达1.5mm,高径比达17.65的阵列电极。
(4)利用制作的微细阵列电极作为工具在100μm厚的不锈钢片上进行微细电解加工。分析了电解液组成、电极进给速度、加工电参数等对微孔电解加工精度和加工稳定性的影响。结果显示,通过采用脉冲电解加工电源、低浓度的电解液、低加工电压等措施,微细电解加工的加工精度、加工稳定性等都得到了明显的提高。根据分析优化后的参数,以制备出的阵列电极为工具阴极进行微细群孔的电解加工实验。通过对阵列电极进行绝缘处理,电解加工出了异形孔阵列结构。
(5)提出过电铸缩孔工艺制造超小孔(<10μm)阵列结构。建立了过电铸缩孔工艺的电场模型,对电沉积过程进行了模拟仿真,将数值分析结果用于指导实验。最终制备了直径4μm的超小孔阵列。实验表明,过电铸缩孔技术是一种高效、低廉、可批量生产的制作超小孔的技术手段。
As the improve of the MEMS and mciro-fabrication technology, micro-screen has been used in a wide range of applications, such as grid mesh, inkjet plate, spinneret plate, filter screens and test sieves et al. How to fabricate the micro screens by a low cost and high effciency way is a big challenge to the academia and industry.
For fabricating Micro/Meso metal micro screens, the combination of UV-LIGA with micro electro-machining is presented in this paper, and relative researches have been carried out. The dissertation consists of five sections, including:
(1) The parameters of UV lithography process including coating method, pre-bake temperature & time, exposure dose, post bake temperature & time and development time et al. have been studied to pattern SU-8 photoresist on a metal substrate. Using orthogonal array technique, an optimization experiment is performed to characterize the processing of SU-8 photoresist. Using the optimized process parameters, SU-8 moulds up to 1mm thick of different shapes with high definition, good topography, fewer defects and excellent adhesion with metal substrate have been produced successfully.
(2) Two methods are advanced to solve the SU-8 removal problem. For the negative resist mould, before the electroforming process, a through-mask electrochemical micromachining (through-mask EMM) procedure was carried out to make micro roots on the substrate, the micro roots could improve the adhesion of micro electrode array electroformed on the substrate, so the electrode array could not be peeled after the resist removed. For the positive resist mould, after electroformed, the cross-linked SU-8 resist can be burned directed.
(3) Two processes are adopted to fabricate the metal electrode array: The micro ECM aided UV-LIGA technology and the combination of UV-LIGA with the Micro electro-discharge machining (Micro-EDM) process. The micro ECM aided UV-LIGA technology was using the through-mask EMM to make micro roots to improve the adhesion of micro electrode array electroformed on the substrate, a mathematical model is presented to simulate the through-mask EMM process by finite element method (FEM), through the optimized parameter of the through-mask EMM, the ultra-thick cross-linked SU-8 resist is completely removed without destroying the electroformed microstructures. The combination of UV-LIGA with the Micro-EDM process both solved the problem of resist removal and the difficulty of micro-EDM electrode fabrication, using the optimized parameter of micro-EDM, electrode array of 1.5mm long and aspect ratio up to 17.65 was fabricated.
(4) Using the fabricated electrode arrays to machine micro screens on the 100μm thick stainless steel. The effects of various parameters on the machining accuracy and stability are investigated, including electrolyte, electrode feeding speed,electrical parameters, et al.. Results indicate that pulse current, low concentration electrolyte, low voltage could attribute good performance of micro ECM. Machining accuracy and stability could be improved. After the electrode arrays are insulated, micro hole arrays of profiled holes are machined.
(5) The over-plating method is introduced to fabricate the super micro hole array (size less than 10μm). A mathematical model is presented to simulate the over-plating process by finite element method (FEM). Finally, the micro hole array of diameter 4μm was fabricated by the over-plating technology. The result indicates that over-plating is a simple, low cost method to fabricate micro hole array, and it’s suitable to batch production.
引文
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