纳米薄膜屈曲三维形貌测量技术研究
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摘要
本文对纳米尺度薄膜屈曲的三维形貌进行了测量研究。近年来,在航天业、模具业之中,高精度获得自由曲面的参数成为了产品设计的关键。在众多的新技术中,3D外形轮廓测量一直是机械制造行业中的一个重要的研究方向。尽管较大尺寸的物体三维形貌测量技术已经成熟,由于微纳尺度的物体在形貌测量上和算法上具有其自身的特殊性,因此,微纳尺寸物体形貌测量技术的研究开发对于未来的工业普遍推广将有重要意义。
本文致力于对沉积在有机玻璃基底上的厚度为150nm的钛薄膜材料在残余应力和外加轴向荷载作用下产生屈曲的形貌观察与测量。使用一台光学显微镜观测膜层表面的屈曲过程和形貌。为了测量物距改变,本文设计了微区三维形貌测量方法,包括光楔步进水平位移方法和微机械垂直位移方法。其中,光楔步进水平方法是使用光楔先使物体形成虚像,然后通过改变虚像像距间接改变物距,并且开发了光楔水平传动装置;微机械垂直位移方法是使用应变片悬臂梁机构和千分表通过等步测定显微镜镜头的垂直位移来直接改变物距。
本文开发了基于调焦评价函数理论、高斯插值、数字图像相关理论的针对纳米尺度薄膜屈曲离面位移的测量方法。文中给出了由调焦评价函数理论和高斯插值求解相关的公式推导,并与数字图像相关方法相结合编制了相应的程序,然后应用到实际的三维形貌测量。本文选用了不同的调焦评价函数,对测量结果进行了研究比较,得出了误差分析,对不同调焦评价函数的性质和适用条件提出了相关意见和看法。本文对当150nm厚度的薄膜产生的屈曲处于微米量级的三维形貌进行了测量研究。
综上所述,本文对于纳米尺度薄膜屈曲的三维形貌测量进行了研究,文中的实验创新及算法理论探索对于纳米尺度物体三维形貌测量的科研工作具有相当的帮助。
The paper studies on the 3D appearance of thin film buckling on nano-scalelevel. Recently, parameters for getting free surface with high-precision become keyfactors in product design of aerospace or die industry. Among all the advancedtechniques, measuring 3D appearance is always a vital realm in researches. Althoughmeasurements on relatively larger-size objects’3D appearance have become mature,the particular circumstances in measuring appearance on nano-scale process seemsserves as an obstacle. Hence, researches on this dimension has significant advantagesfor future industry promotion.
Using an optic microscope, this research focuses on observing and measuringthe appearance of buckling engendered by 150nm Ti-film material precipitated in thefoundation base of organic glass under the mixed influence from remnant stress andapplied axial load. The researcher designs particular approaches for measuring micro3D appearance, including optic wedge on stepping horizontal displacement approachand micro mechanic vertical displacement approach. In the previous approach, byusing optic wedge to render false image for an object first, the researcher changesdistance by manipulating distance of the false image and develops gear-driveequipment on optic wedge level. While in the latter one, foil-gage cantileverframework and micrometer are both used to change distance through stepsmeasurementonverticaldisplacementofmicroscrope’slens.
The research promotes the measurement on displacement of thin film bucklingon nano-scale level, which is based on focusing-evaluation-function theory, Gaussianinterpolation and other theories related to digital image. By proffering relevantformula mentioned above and bydeveloping program with digital-image method, thispaper also applies such theories to practices in measuring 3D appearance. After thecompare on different measuring results and data from different focusing evaluationfunctions, researcher establishes an error analysis and his own opinions on the natureof such functions,in addition to their different applied conditions.
Admittedly, limitation on experiment equipment and other research conditions renderobstacles, and thusly we only focus on the measurement on the 3D appearance ofbuckling engendered by 15 nm -thick thin film. As to the measurement ondisplacement of buckling less than 1μm,this research could hardly be applied equally or successfully. The key factor for obtaining more precise data is to limit the stepschanges of distance less than 1μm,which is,unfortunately, unattainable.
To sum up, this research make promotion in measurement on 3D appearance ofthin film buckling on nano-scale level.The innovation in experiment approach and theexploration in arithmetic theories on this sphere would help future scientificresearches on similar dimension.
本文致力于对沉积在有机玻璃基底上的厚度为150nm的钛薄膜材料在残余应力和外加轴向荷载作用下产生屈曲的形貌观察与测量。使用一台光学显微镜观测膜层表面的屈曲过程和形貌。为了测量物距改变,本文设计了微区三维形貌测量方法,包括光楔步进水平位移方法和微机械垂直位移方法。其中,光楔步进水平方法是使用光楔先使物体形成虚像,然后通过改变虚像像距间接改变物距,并且开发了光楔水平传动装置;微机械垂直位移方法是使用应变片悬臂梁机构和千分表通过等步测定显微镜镜头的垂直位移来直接改变物距。
本文开发了基于调焦评价函数理论、高斯插值、数字图像相关理论的针对纳米尺度薄膜屈曲离面位移的测量方法。文中给出了由调焦评价函数理论和高斯插值求解相关的公式推导,并与数字图像相关方法相结合编制了相应的程序,然后应用到实际的三维形貌测量。本文选用了不同的调焦评价函数,对测量结果进行了研究比较,得出了误差分析,对不同调焦评价函数的性质和适用条件提出了相关意见和看法。本文对当150nm厚度的薄膜产生的屈曲处于微米量级的三维形貌进行了测量研究。
综上所述,本文对于纳米尺度薄膜屈曲的三维形貌测量进行了研究,文中的实验创新及算法理论探索对于纳米尺度物体三维形貌测量的科研工作具有相当的帮助。
The paper studies on the 3D appearance of thin film buckling on nano-scalelevel. Recently, parameters for getting free surface with high-precision become keyfactors in product design of aerospace or die industry. Among all the advancedtechniques, measuring 3D appearance is always a vital realm in researches. Althoughmeasurements on relatively larger-size objects’3D appearance have become mature,the particular circumstances in measuring appearance on nano-scale process seemsserves as an obstacle. Hence, researches on this dimension has significant advantagesfor future industry promotion.
Using an optic microscope, this research focuses on observing and measuringthe appearance of buckling engendered by 150nm Ti-film material precipitated in thefoundation base of organic glass under the mixed influence from remnant stress andapplied axial load. The researcher designs particular approaches for measuring micro3D appearance, including optic wedge on stepping horizontal displacement approachand micro mechanic vertical displacement approach. In the previous approach, byusing optic wedge to render false image for an object first, the researcher changesdistance by manipulating distance of the false image and develops gear-driveequipment on optic wedge level. While in the latter one, foil-gage cantileverframework and micrometer are both used to change distance through stepsmeasurementonverticaldisplacementofmicroscrope’slens.
The research promotes the measurement on displacement of thin film bucklingon nano-scale level, which is based on focusing-evaluation-function theory, Gaussianinterpolation and other theories related to digital image. By proffering relevantformula mentioned above and bydeveloping program with digital-image method, thispaper also applies such theories to practices in measuring 3D appearance. After thecompare on different measuring results and data from different focusing evaluationfunctions, researcher establishes an error analysis and his own opinions on the natureof such functions,in addition to their different applied conditions.
Admittedly, limitation on experiment equipment and other research conditions renderobstacles, and thusly we only focus on the measurement on the 3D appearance ofbuckling engendered by 15 nm -thick thin film. As to the measurement ondisplacement of buckling less than 1μm,this research could hardly be applied equally or successfully. The key factor for obtaining more precise data is to limit the stepschanges of distance less than 1μm,which is,unfortunately, unattainable.
To sum up, this research make promotion in measurement on 3D appearance ofthin film buckling on nano-scale level.The innovation in experiment approach and theexploration in arithmetic theories on this sphere would help future scientificresearches on similar dimension.
引文
[1]陈晓容，光学非接触三维形貌测量技术新进展，光学精密工程，2002，10（5），528～531
[2]邾继贵，便携式激光扫描三维形貌测量系统，机械工程学报，2005，41（2），166～169
[3]Vinay P.Namboodiri，On defocus,diffusion and depth estimation，Science Direct，2007，28，311~319
[4]袁操今，采用短相干光数字全息术实现反射型微小物体的三维形貌测量，物理学报，2007，56（1），218～222
[5]胡春光，复杂微结构三维形貌测量方法的研究，光电子激光。2006，17（1），98～101
[6]Katia Genovese，A comprehensive ESPI based system for combined measurementof shape and deformation of electronic components，Optics and Lasers inEngineering，2004，42，543～562
[7]D.Vogel，Micro- and nanomaterials characterization by image correlation methods，Sensors and Actuators，2002，99，165～171
[8]Hiroshi Ishiwata，A new method of three-dimensional measurement by differentialinterference contrast microscope，Science Direct，2006，260，117～126
[9]Xunqing shi，In-Situ Micro-Digital Image Speckle Correlation Technique forCharacterization of Materials’Properties and Verification of Numerical Models，IEEE Transactions on Components and Packaging Technologies，2004，27（4），659～667
[10]Soon-Yong Park，An image-based calibration technique of spatial domaindepth-from-defocus，Science Direct，2006，27，1318～1324
[11]Leszek Salbut，The optical measurement station for complex testing ofmicroelements，Optics and Lasers in Engineering，2001，36，255～240
[12]Giuseppe Schirripa Spagnolo，Digital speckle correlation for on-line real-timemeasurement，Optics Communications，1996，132，24~28
[13]Wang JS, Evans AG, Measurement and analysis of buckling and bucklingpropagation in compressed oxide layers on superalloy substrates,ActaMater,1998,46(14),4993~5005
[14]Hutchinson JW, He MY, The influence of imperfections on the nucleation andpropagation of buckling driven delaminations,Mech Phys Solids, 2000,48,709~734
[15]Lee A, Clemens BM,Stress induced delamination methods for the study ofadhesion of Pt thin films to Si,Acta Mater,2004,52,2081~2093
[16]Parry G, Colin J,Effect of substrate compliance on the global unilateralpost-buckling of coatings: AFM observations and finite element calculations, ActaMaterialia 2005, 53,441~447
[17]Moon, MW, Chung JW,An experimental study of the influence of imperfectionson the buckling of compressed thin films,Acta Mater,2002,50,1219~1227
[18]Jensen H, Sheinman I,Straight-sided, buckling-driven delamination of thin filmsat high stress levels, International Journal of Fracture,2001,110,371~385
[19]Hutchinson JW, Suo, Z. Mixed mode cracking in layered materials. Adv ApplMech. 1992; 29: 63~191
[20]Audoly B. Mode-dependent toughness and the delamination of compressed thinfilms, Journal of the Mechanics and Physics of Solids 2000, 48: 2315~2332
[21]Cotterell B, Chen Z, Buckling and cracking of thin films on compliant substratesunder Compression, Int J of Fract. 2000,104: 169~179.
[22]Eymery JP, Denanot MF. Blisters in as-deposited films of bcc stainless steel. SurfCoat Tech. 1996,80: 251~254
[23]屈玉福，基于单目视觉的自由曲面三维坐标测量方法，仪器仪表学报，2006，27（10），1318～1321
[24]鲍歌堂，图像测量技术中几种自动调焦算法的对比分析，上海交通大学学报，2005，39（1），121～128
[25]Djemel Ziou and Francois Deschenes，Depth from Defocus Estimation in SpatialDomain，Computer Vision and Image Understanding，2001，81，143～165
[26]T.E.Gureyev，Image deblurring by means of defocus，Optics Communications，2004，240，81～88
[27]任四刚，基于灰度差分法的自动调焦技术，光电工程，2003，30（2），53～55
[28]H.L.Chen，Fabrication of sub-wavelength antireflective structures in solar cells byutilizing modified illumination and defocus techniques in optical lithography，ScienceDirect，2007，84，750～754
[29]胡涛，大范围自动调焦快速搜索算法，光电子激光，2006，17（4），464～467
[30]L.J.Allen，Phase retrieval from series of images obtained by defocus variation，Optics Communications，2001，65～75
[31]Asticio Vargas，Invariant pattern recognition against defocus based on subbanddecomposition of the filter，Optics Communications，2000，185，33～40
[32]刘向东，基于弥散斑单基站定距的可行性分析，红外技术，2004，26（5），52～54
[33]Mikel R.Miller，Analysis of flip-chip packages using high resolution moiréinterferometry，Electronic Components and Technology Conference，1999，979～986
[34]W.D.van Driel，Prediction and verification of process induced warpage ofelectronic packages，Microelectronics Reliability，2003，43，765～774
[35]Hidetoshi Utsuro，Theoretical background of defocus image modulationprocessing based on three dimensional optical transfer functions，Optik，2001，112（2），67～75
[36]John H.L.Pang，Application of Digital Speckle Correlation to Micro-deformationMeasurement of A Flip Chip Assembly，Electronic Components and TechnologyConference，2003，926～932
[37]杨再华，微操纵系统自动调焦方法的研究，计算机测量与控制，2005，13（1），30～32
[38]王华，光学离焦三维传感技术的现状与进展，激光杂志，2003，24（3），1～4
[39]许静玲，基于图像处理的自动调焦算法的探讨，工程论坛，2005，8，4～7
[40]Shigeru Murata，Particle depth measurement based on depth-from-defocus，Optics& Laser Technology，1999，31，95～102
[41]B.Wattrisse，Analysis of Strain Localization during Tensile Tests by Digital ImageCorrelation，Experimental Mechanics，2001，41（1），29～39
[42]光楔加工检测及测量误差分析，2002，28（6），570～574
[43]Tae-Sang Park，An experimental technique for the strain measurement of smallstructures using pattern recognition，Science Direct，2004，115，15～22
[44]Cheng Liu，On the Minimum Size of Representative Volume Element: AnExperimental Investigation，Experimental Mechanics，2005，45（3），238～248
[45]H.Lu，Surface Deformation Measurements of a Cylindrical Specimen by DigitalImage Correlation，Experimental Mechanics，1997，37，433～439
[46]Ichirou Yamaguchi，Speckle displacement and decorrelation in the diffraction andimage fields for small object deformation，Optica Acta，1981，28（10），1359～1376
[47]H.Lu，Deformation Measurements by Digital Image Correlation:Implementationof a seconf-order Displacement，Experimental Mechanics，2000，40，393～400
[48]屈玉福，调焦评价函数灵敏度的影响因素分析，光学学报，2005，25（7），902～906
[49]段瑞玲，基于图像处理的微装配自动调焦系统，光学精密工程，2006，14（3），468～472
[50]S.R.McNeill，Measurement of Surface Profile Using Digital Image Correlation，1997，37（1），13～20
[51]D.Amodio，Digital Speckle Correlation for Strain Measurement by ImageAnalysis，Experimental Mechanics，2003，43（4），396～402
[52]闫玮，基于PZT微驱动的激光直写自动调焦系统动态特性分析，2006，28（2），56～60
[53]田中哲郎，压电陶瓷材料，科学出版社，1982
[54]张福学，压电晶体力和加速度传感器，四川科学技术出版社，1985，
[2]邾继贵，便携式激光扫描三维形貌测量系统，机械工程学报，2005，41（2），166～169
[3]Vinay P.Namboodiri，On defocus,diffusion and depth estimation，Science Direct，2007，28，311~319
[4]袁操今，采用短相干光数字全息术实现反射型微小物体的三维形貌测量，物理学报，2007，56（1），218～222
[5]胡春光，复杂微结构三维形貌测量方法的研究，光电子激光。2006，17（1），98～101
[6]Katia Genovese，A comprehensive ESPI based system for combined measurementof shape and deformation of electronic components，Optics and Lasers inEngineering，2004，42，543～562
[7]D.Vogel，Micro- and nanomaterials characterization by image correlation methods，Sensors and Actuators，2002，99，165～171
[8]Hiroshi Ishiwata，A new method of three-dimensional measurement by differentialinterference contrast microscope，Science Direct，2006，260，117～126
[9]Xunqing shi，In-Situ Micro-Digital Image Speckle Correlation Technique forCharacterization of Materials’Properties and Verification of Numerical Models，IEEE Transactions on Components and Packaging Technologies，2004，27（4），659～667
[10]Soon-Yong Park，An image-based calibration technique of spatial domaindepth-from-defocus，Science Direct，2006，27，1318～1324
[11]Leszek Salbut，The optical measurement station for complex testing ofmicroelements，Optics and Lasers in Engineering，2001，36，255～240
[12]Giuseppe Schirripa Spagnolo，Digital speckle correlation for on-line real-timemeasurement，Optics Communications，1996，132，24~28
[13]Wang JS, Evans AG, Measurement and analysis of buckling and bucklingpropagation in compressed oxide layers on superalloy substrates,ActaMater,1998,46(14),4993~5005
[14]Hutchinson JW, He MY, The influence of imperfections on the nucleation andpropagation of buckling driven delaminations,Mech Phys Solids, 2000,48,709~734
[15]Lee A, Clemens BM,Stress induced delamination methods for the study ofadhesion of Pt thin films to Si,Acta Mater,2004,52,2081~2093
[16]Parry G, Colin J,Effect of substrate compliance on the global unilateralpost-buckling of coatings: AFM observations and finite element calculations, ActaMaterialia 2005, 53,441~447
[17]Moon, MW, Chung JW,An experimental study of the influence of imperfectionson the buckling of compressed thin films,Acta Mater,2002,50,1219~1227
[18]Jensen H, Sheinman I,Straight-sided, buckling-driven delamination of thin filmsat high stress levels, International Journal of Fracture,2001,110,371~385
[19]Hutchinson JW, Suo, Z. Mixed mode cracking in layered materials. Adv ApplMech. 1992; 29: 63~191
[20]Audoly B. Mode-dependent toughness and the delamination of compressed thinfilms, Journal of the Mechanics and Physics of Solids 2000, 48: 2315~2332
[21]Cotterell B, Chen Z, Buckling and cracking of thin films on compliant substratesunder Compression, Int J of Fract. 2000,104: 169~179.
[22]Eymery JP, Denanot MF. Blisters in as-deposited films of bcc stainless steel. SurfCoat Tech. 1996,80: 251~254
[23]屈玉福，基于单目视觉的自由曲面三维坐标测量方法，仪器仪表学报，2006，27（10），1318～1321
[24]鲍歌堂，图像测量技术中几种自动调焦算法的对比分析，上海交通大学学报，2005，39（1），121～128
[25]Djemel Ziou and Francois Deschenes，Depth from Defocus Estimation in SpatialDomain，Computer Vision and Image Understanding，2001，81，143～165
[26]T.E.Gureyev，Image deblurring by means of defocus，Optics Communications，2004，240，81～88
[27]任四刚，基于灰度差分法的自动调焦技术，光电工程，2003，30（2），53～55
[28]H.L.Chen，Fabrication of sub-wavelength antireflective structures in solar cells byutilizing modified illumination and defocus techniques in optical lithography，ScienceDirect，2007，84，750～754
[29]胡涛，大范围自动调焦快速搜索算法，光电子激光，2006，17（4），464～467
[30]L.J.Allen，Phase retrieval from series of images obtained by defocus variation，Optics Communications，2001，65～75
[31]Asticio Vargas，Invariant pattern recognition against defocus based on subbanddecomposition of the filter，Optics Communications，2000，185，33～40
[32]刘向东，基于弥散斑单基站定距的可行性分析，红外技术，2004，26（5），52～54
[33]Mikel R.Miller，Analysis of flip-chip packages using high resolution moiréinterferometry，Electronic Components and Technology Conference，1999，979～986
[34]W.D.van Driel，Prediction and verification of process induced warpage ofelectronic packages，Microelectronics Reliability，2003，43，765～774
[35]Hidetoshi Utsuro，Theoretical background of defocus image modulationprocessing based on three dimensional optical transfer functions，Optik，2001，112（2），67～75
[36]John H.L.Pang，Application of Digital Speckle Correlation to Micro-deformationMeasurement of A Flip Chip Assembly，Electronic Components and TechnologyConference，2003，926～932
[37]杨再华，微操纵系统自动调焦方法的研究，计算机测量与控制，2005，13（1），30～32
[38]王华，光学离焦三维传感技术的现状与进展，激光杂志，2003，24（3），1～4
[39]许静玲，基于图像处理的自动调焦算法的探讨，工程论坛，2005，8，4～7
[40]Shigeru Murata，Particle depth measurement based on depth-from-defocus，Optics& Laser Technology，1999，31，95～102
[41]B.Wattrisse，Analysis of Strain Localization during Tensile Tests by Digital ImageCorrelation，Experimental Mechanics，2001，41（1），29～39
[42]光楔加工检测及测量误差分析，2002，28（6），570～574
[43]Tae-Sang Park，An experimental technique for the strain measurement of smallstructures using pattern recognition，Science Direct，2004，115，15～22
[44]Cheng Liu，On the Minimum Size of Representative Volume Element: AnExperimental Investigation，Experimental Mechanics，2005，45（3），238～248
[45]H.Lu，Surface Deformation Measurements of a Cylindrical Specimen by DigitalImage Correlation，Experimental Mechanics，1997，37，433～439
[46]Ichirou Yamaguchi，Speckle displacement and decorrelation in the diffraction andimage fields for small object deformation，Optica Acta，1981，28（10），1359～1376
[47]H.Lu，Deformation Measurements by Digital Image Correlation:Implementationof a seconf-order Displacement，Experimental Mechanics，2000，40，393～400
[48]屈玉福，调焦评价函数灵敏度的影响因素分析，光学学报，2005，25（7），902～906
[49]段瑞玲，基于图像处理的微装配自动调焦系统，光学精密工程，2006，14（3），468～472
[50]S.R.McNeill，Measurement of Surface Profile Using Digital Image Correlation，1997，37（1），13～20
[51]D.Amodio，Digital Speckle Correlation for Strain Measurement by ImageAnalysis，Experimental Mechanics，2003，43（4），396～402
[52]闫玮，基于PZT微驱动的激光直写自动调焦系统动态特性分析，2006，28（2），56～60
[53]田中哲郎，压电陶瓷材料，科学出版社，1982
[54]张福学，压电晶体力和加速度传感器，四川科学技术出版社，1985，