QFP焊点可靠性及其翼形引线尺寸的优化模拟
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摘要
SMT焊点的可靠性问题是关系到电子产品能否广泛应用的关键问题。本文针对某型号产品对QFP元器件的特殊要求,利用有限元分析方法,通过改变引线几何尺寸、模拟焊点应力应变变化趋势等影响QFP元器件焊点可靠性的主要因素进行了系统的研究,并通过热循环试验对采用有限元计算得到的结果进行了验证。
研究建立了J形引线的二维有限元分析模型,计算结果表明:J形引线元器件焊后整体变形明显,焊点应力应变最大部位位于焊点根部,焊趾处次之,中心部位最小;J形引线焊点的根部应力集中区域比较广,为整个焊点最薄弱的部位,易发生疲劳破坏,计算结果与实际情况相吻合。
重点探讨了QFP翼形引线的可靠性问题,二维模拟结果显示:引线焊点最内侧底面部位应力集中明显,是整个焊点最脆弱的部分;工艺尺寸选择引线厚度0.15mm,引线高度0.65mm,与焊盘接触长度0.5mm,与陶瓷接触长度0.15mm时,二维结构最稳定。三维模拟结果显示:引线间距相同时,随着引线宽度的增加,焊点最大应力值逐渐增加,引线宽度相同时,随着引线间距的增加,焊点最大应力值并不完全呈下降趋势,存在一个焊点最大应力的最小值。优化模拟结果发现,引线宽度为0.15mm,中心间距0.2mm(实际存在间距0.05mm),可能是QFP元器件微型化发展的极限值。
在数值模拟的基础上,通过对QFP元器件的焊点抗拉试验与加速老化试验的研究发现:固定QFP元器件的引线间距时,随着引线宽度的增加,焊点的抗拉强度逐渐减小。固定引线宽度为0.22mm时,QFP-100元器件的抗拉强度最大,QFP-48元器件的抗拉强度次之,QFP-32元器件的抗拉强度最小,均与模拟计算结果相吻合。加速老化试验的结果表明:QFP元器件焊点失效的实际热循环次数(186次)与理论模拟结果(213次)基本吻合,随着热循环次数的增加,焊点抗拉强度逐渐降低,断裂方式由韧性断裂向脆性断裂转变。
研究结果为某型号产品组件优化提供了数据支持,对于电子行业QFP元器件的焊点寿命评价具有较好的理论指导意义。
The reliability of the SMT soldered joints is a crucial problem for the application of electronical product used in many fields. To meet the needs of the special requestments of QFP devices for the certain product, the FEM method was used to study the effects of lead geometry sizes, stress-strain distribution of the soldered joints and other factors on the reliability of QFP soldered joints, and the thermal cycling experiment was used to validate the FEM results.
With the help of 2-D FEM model of J-lead, the simulated results indicate that the distortion of the whole J-lead device was obvious; the stress and strain of the J-lead soldered heel was bigger than the other place of the soldered joints and the stress distributed a wide area, where was the weakest place of the whole soldered joints, so it was easy to lose efficacy. The stress and strain in the J-lead soldered toe was less than that in the heel of the soldered joint, the stress and strain in the center place of J-lead soldered joints was smallest and the simulated results were concordant with the experimental results.
The reliability was mainly researched for the gull wing lead of QFP devices. The 2-D analysis results indicate that the inboard of the soldered joints was the weakest position, where the stress was hardly concentrated, so it was easily to be destroyed. When the lead thickness is 0.15mm, the lead height is 0.65 mm, the touch length between ceramic and lead is 0.15mm and the touch length between solder pad and lead is 0.5mm, the 2-D structure will be the most stable. The 3-D analysis results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn’t decrease straightly with the increasing of lead pitches, and but a minimum value exists in the curves of the maximum equivalent stress values. The simulated results also indicate that lead width of 0.15mm and lead pitch of 0.2mm maybe the limit value of lead pitches of QFP.
On the bases of the numerical simulation, the tensile tests and the accelerated aging tests of the soldered joints were made in this paper. The results indicate that when the lead pitch of QFP devices was fixed, with the increasing of the lead width, the tensile strength of the soldered joint was decreasing. When the lead width was 0.22mm, the tensile strength of the QFP-100 devices was the highest, the tensile strength of QFP-48 was lower and the tensile strength of QFP-32 is lowest, which were concordant with the experiment results. The accelerated aging tests show that the real life of 186 times was close to the theory result of 213 times and with the increasing of the thermal cycling times, the tensile strength of the soldered joints decreased gradually, and the fracture mechanism changed from tough fracture to brittle fracture.
The research results provided data support for some type military products and possess favorable guidance meaning for predicting the working life of soldered joints in electronic industry.
研究建立了J形引线的二维有限元分析模型,计算结果表明:J形引线元器件焊后整体变形明显,焊点应力应变最大部位位于焊点根部,焊趾处次之,中心部位最小;J形引线焊点的根部应力集中区域比较广,为整个焊点最薄弱的部位,易发生疲劳破坏,计算结果与实际情况相吻合。
重点探讨了QFP翼形引线的可靠性问题,二维模拟结果显示:引线焊点最内侧底面部位应力集中明显,是整个焊点最脆弱的部分;工艺尺寸选择引线厚度0.15mm,引线高度0.65mm,与焊盘接触长度0.5mm,与陶瓷接触长度0.15mm时,二维结构最稳定。三维模拟结果显示:引线间距相同时,随着引线宽度的增加,焊点最大应力值逐渐增加,引线宽度相同时,随着引线间距的增加,焊点最大应力值并不完全呈下降趋势,存在一个焊点最大应力的最小值。优化模拟结果发现,引线宽度为0.15mm,中心间距0.2mm(实际存在间距0.05mm),可能是QFP元器件微型化发展的极限值。
在数值模拟的基础上,通过对QFP元器件的焊点抗拉试验与加速老化试验的研究发现:固定QFP元器件的引线间距时,随着引线宽度的增加,焊点的抗拉强度逐渐减小。固定引线宽度为0.22mm时,QFP-100元器件的抗拉强度最大,QFP-48元器件的抗拉强度次之,QFP-32元器件的抗拉强度最小,均与模拟计算结果相吻合。加速老化试验的结果表明:QFP元器件焊点失效的实际热循环次数(186次)与理论模拟结果(213次)基本吻合,随着热循环次数的增加,焊点抗拉强度逐渐降低,断裂方式由韧性断裂向脆性断裂转变。
研究结果为某型号产品组件优化提供了数据支持,对于电子行业QFP元器件的焊点寿命评价具有较好的理论指导意义。
The reliability of the SMT soldered joints is a crucial problem for the application of electronical product used in many fields. To meet the needs of the special requestments of QFP devices for the certain product, the FEM method was used to study the effects of lead geometry sizes, stress-strain distribution of the soldered joints and other factors on the reliability of QFP soldered joints, and the thermal cycling experiment was used to validate the FEM results.
With the help of 2-D FEM model of J-lead, the simulated results indicate that the distortion of the whole J-lead device was obvious; the stress and strain of the J-lead soldered heel was bigger than the other place of the soldered joints and the stress distributed a wide area, where was the weakest place of the whole soldered joints, so it was easy to lose efficacy. The stress and strain in the J-lead soldered toe was less than that in the heel of the soldered joint, the stress and strain in the center place of J-lead soldered joints was smallest and the simulated results were concordant with the experimental results.
The reliability was mainly researched for the gull wing lead of QFP devices. The 2-D analysis results indicate that the inboard of the soldered joints was the weakest position, where the stress was hardly concentrated, so it was easily to be destroyed. When the lead thickness is 0.15mm, the lead height is 0.65 mm, the touch length between ceramic and lead is 0.15mm and the touch length between solder pad and lead is 0.5mm, the 2-D structure will be the most stable. The 3-D analysis results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn’t decrease straightly with the increasing of lead pitches, and but a minimum value exists in the curves of the maximum equivalent stress values. The simulated results also indicate that lead width of 0.15mm and lead pitch of 0.2mm maybe the limit value of lead pitches of QFP.
On the bases of the numerical simulation, the tensile tests and the accelerated aging tests of the soldered joints were made in this paper. The results indicate that when the lead pitch of QFP devices was fixed, with the increasing of the lead width, the tensile strength of the soldered joint was decreasing. When the lead width was 0.22mm, the tensile strength of the QFP-100 devices was the highest, the tensile strength of QFP-48 was lower and the tensile strength of QFP-32 is lowest, which were concordant with the experiment results. The accelerated aging tests show that the real life of 186 times was close to the theory result of 213 times and with the increasing of the thermal cycling times, the tensile strength of the soldered joints decreased gradually, and the fracture mechanism changed from tough fracture to brittle fracture.
The research results provided data support for some type military products and possess favorable guidance meaning for predicting the working life of soldered joints in electronic industry.
引文
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