Ti-6Al-4V与ZQSn10-10异种材料的扩散连接
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摘要
钛合金与铜合金异种材料的扩散连接对于提高钛合金的利用效率,节约有限的钛合金资源具有重要意义,是材料加工工程领域为建设节约型社会所作的一种努力,同时也为综合发挥两种合金各自优良的性能,提高制成品的适用性开辟了一条新的途径。但目前关于这方面的研究还很不充分。
课题来源于国家自然科学基金项目《钛合金与铜合金异种材料膨胀压差法扩散连接研究》(批准号:50375065)和现代焊接生产技术国家重点实验室基金项目《TC4/QAl10-3-1.5(TC4/ZQSn10-10)膨胀压差法扩散连接研究》,是以上项目的前期主要组成部分。
本文从材料的扩散连接性出发,研究异种材料Ti-6Al-4V和ZQSn10-10扩散连接;为钛合金与铜合金膨胀压差法提供依据。分别对钛合金与铜合金无中间层的直接扩散连接,和带有(Cu、Ni、Ag、Ta)中间层等条件下的扩散连接进行比较。研究连接界面结构和形成机理。观察连接界面处元素的扩散、微观组织,分析生成相的种类、分布、连接界面的层次结构、尺寸对性能的影响及热力学和动力学分析。接头残余应力分析和缓解措施的研究。接头残余应力的有限元分析,建立有限元模型,寻求避免连接界面出现裂纹并发展成撕裂的最佳扩散连接的后处理工艺。
From the viewpoint of diffusion-bondability of materials, the diffusion bonding between intermetallic compound Ti-6Al-4V/ZQSn10-10 with Cu and Ni interlayer was carride out .The effect of bonding parameters on tensile strength of jionts was discussed, the process in the growth of intermetallic compounds was discussed, and the finite element modeling of residual stresses in the diffusion bonding joints was also discussed.
Direct diffusion bonding of Ti-6Al-4V/ZQSn10-10 has been performed and the result indicates the best technique condition on P=10MPa, T=850℃, t=30min, and the tensile strength of 84MPa, above 28% that of the matrix Cu alloy. Base on the diffusion bonding theory, the composition proportion of the formed phases at the interface of Ti-6Al-4V/ZQSn10-10, and the rule of growth in intermetallics were analyzed. The form and growth can be divied into five processes. a) physics contact, b) the Ti(ss,Cu) was formed, c) the intermetallics compound of Cu3Ti and CuSn3Ti5 were formed, and some Pb particle was also presented, d) the growth of intermetallics compound, e) formed theβ-Ti,α- Ti and Ti(ss,Cu) structure at the interface in the depress temperature process.
Diffusion bonding of Ti-6Al-4V/ZQSn10-10 with Cu interlayer was carried out and the tension strength of joint was a little better than that of direct joint under th best technique condition of P=10MPa, T=850℃, t=30min. The diffusion bonding joint is composed of Cu3Ti2, CuTi, CuTi2,β-Ti,α- Ti and Ti(ss,Cu). The fracture appearance is mixed type fracture, the intension of joint was mostly brittle fracture figure, but some plastic fracture figure also has been found. Ni interlayer can increase evidently the tensile strength of Ti-6Al-4V/ ZQSn10-10 diffusion bonding joint and the tensile strength of joint can reach to 155MPa, under the technique condition of P=10MPa, T=830℃, t=30min, Which is 52% of the ZQSn10-10. The tensile strength of Ti-6Al-4V/Ni/ZQSn10-10 joint was depended on Ti-6Al-4V/Ni interface, and NiTi and Ni3Ti were found out on the
课题来源于国家自然科学基金项目《钛合金与铜合金异种材料膨胀压差法扩散连接研究》(批准号:50375065)和现代焊接生产技术国家重点实验室基金项目《TC4/QAl10-3-1.5(TC4/ZQSn10-10)膨胀压差法扩散连接研究》,是以上项目的前期主要组成部分。
本文从材料的扩散连接性出发,研究异种材料Ti-6Al-4V和ZQSn10-10扩散连接;为钛合金与铜合金膨胀压差法提供依据。分别对钛合金与铜合金无中间层的直接扩散连接,和带有(Cu、Ni、Ag、Ta)中间层等条件下的扩散连接进行比较。研究连接界面结构和形成机理。观察连接界面处元素的扩散、微观组织,分析生成相的种类、分布、连接界面的层次结构、尺寸对性能的影响及热力学和动力学分析。接头残余应力分析和缓解措施的研究。接头残余应力的有限元分析,建立有限元模型,寻求避免连接界面出现裂纹并发展成撕裂的最佳扩散连接的后处理工艺。
From the viewpoint of diffusion-bondability of materials, the diffusion bonding between intermetallic compound Ti-6Al-4V/ZQSn10-10 with Cu and Ni interlayer was carride out .The effect of bonding parameters on tensile strength of jionts was discussed, the process in the growth of intermetallic compounds was discussed, and the finite element modeling of residual stresses in the diffusion bonding joints was also discussed.
Direct diffusion bonding of Ti-6Al-4V/ZQSn10-10 has been performed and the result indicates the best technique condition on P=10MPa, T=850℃, t=30min, and the tensile strength of 84MPa, above 28% that of the matrix Cu alloy. Base on the diffusion bonding theory, the composition proportion of the formed phases at the interface of Ti-6Al-4V/ZQSn10-10, and the rule of growth in intermetallics were analyzed. The form and growth can be divied into five processes. a) physics contact, b) the Ti(ss,Cu) was formed, c) the intermetallics compound of Cu3Ti and CuSn3Ti5 were formed, and some Pb particle was also presented, d) the growth of intermetallics compound, e) formed theβ-Ti,α- Ti and Ti(ss,Cu) structure at the interface in the depress temperature process.
Diffusion bonding of Ti-6Al-4V/ZQSn10-10 with Cu interlayer was carried out and the tension strength of joint was a little better than that of direct joint under th best technique condition of P=10MPa, T=850℃, t=30min. The diffusion bonding joint is composed of Cu3Ti2, CuTi, CuTi2,β-Ti,α- Ti and Ti(ss,Cu). The fracture appearance is mixed type fracture, the intension of joint was mostly brittle fracture figure, but some plastic fracture figure also has been found. Ni interlayer can increase evidently the tensile strength of Ti-6Al-4V/ ZQSn10-10 diffusion bonding joint and the tensile strength of joint can reach to 155MPa, under the technique condition of P=10MPa, T=830℃, t=30min, Which is 52% of the ZQSn10-10. The tensile strength of Ti-6Al-4V/Ni/ZQSn10-10 joint was depended on Ti-6Al-4V/Ni interface, and NiTi and Ni3Ti were found out on the
引文
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[2]Li Zhuo-ran, Zhang Jiu-hai, Feng Ji-cai. Studies of Diffusion bonding of Tin-Bronze-Ni-Steel[J].Welding Technology. 1999,(2):6-7 .
[3]郭 伟 、赵 熹 华 、宋 敏 霞 ,TC4/Ni/QAl10-3-1.5 扩 散 连 接 研 究 ,焊 接 学报 , 2005( 7): 63-66
[4]Song Min-xia, Zhao Xi-hua, Guo Wei, Feng Ji-cai. Development and Present Situation of Diffusion Bonding of Titanium Alloy to Other Metals[J]. Welding&Joining. 2005(1):5-7.
[5]戚正风, 固态金属中的扩散与相变. 机械工业出版社,1998
[6]杨杨, 热处理后钛/钢爆炸复合界面显微组织结构. 中南工业大学学报,1995, (1)26: 105-107
[7]何康生等译,H,Φ.卡扎可夫著。真空扩散连接,国防工业出版社,1976,55-83
[8]徐国庆,曾岗,耿雪霏,牛济泰,Al/Ti 的扩散焊工艺.焊接,2003,(3):21-23
[9]邹贵生,任家烈,吴爱萍. Al及其合金作钎料或中间层连接陶瓷-金属.材料导报. 1999,13(2):16-18
[10]赵熹华,韩立军,赵蕾,钛合金-铜合金套筒扩散焊配合间隙选择研究.材料科学与工艺,1999, (7): 166-169
[11]Castaneda PP.J.Mechan.Phys.Solids 1991,39;45.
[12]顾怡红,万菊林, Ti6Al4V/Al2O3的扩散连接基界面问题的初步研究.机械工程材料, 1996, (1)20: 14-17
[13]于家兴,21世纪台工业复苏.钛工业进展,1995, (2) : 53-58
[14]钛的二元系相图 葛志明 国防工业出版社 22.135-150.
[15]马天军,TC4合金真空钎焊的发展。焊接技术,2004, (5):4-6
[16]周荣林等,相变扩散连接工艺参数对钛与不锈钢接头强度的影响. 中国有色金属学报, 1997, (4) 12: 663-667
[17]李小强,李元元,邵明, 加镍过渡层钛合金/不锈钢网的扩散连接技术. 华南理工大学学报(自然科学板), 2003, (6)31 : 51-55
[18]周荣林,张九海,田锡唐,钛/不锈钢相变扩散连接工艺研究.哈尔滨工业大学,焊接,1999, (2): 9-12
[19]程耀勇.利用 Ti 基混合粉反应钎焊 TC4 和金[A] .第九次全国焊接会议论文集[C].1999.10.15-9.
[20]Blackburn M J,Smith M P .Titanium alloy of the TiAl type [A],USPat,1979.(25)
[21]王长文,Al-Li 合金超塑成型壁厚分布及 SPF/DB 复合工艺研究。哈尔滨工业大学博 士论文,1998,3.2-7.
[22]黄泊云.TIAl 金属间化合物[M] .中南工业出版社.27-30.
[23]邹茉莲,钛合金TC4与1Cr18Ni9Ti不锈钢的扩散工艺探索.北京航空航天大学学报,1995, (3)21: 45-50
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