AIN/Cu-Cr-Zr复合材料的制备与性能研究
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摘要
铜和铜合金是传统的高导电(热)材料,但由于强度和硬度不足,其应用范围受到很大的限制。随着机械、电子以及航空航天工业的迅猛发展,迫切要求开发不仅具有良好导电性、而且具有较高强度和硬度,较低热膨胀系数的功能材料。
本文以开发高强度高导电铜基复合材料为目标,通过成分和工艺优化,采用机械合金化(MA)、冷压成形和复压复烧等复合强化工艺制备出了满足性能要求的Cu-Cr-Zr基复合材料。寻求最佳的材料制备工艺,满足对材料高强度、高导电性的性能要求。通过SEM,XRD、TEM和其它实验检测仪器对粉末的机械合金化过程,复合材料的微观组织特征以及机械、物理性能进行了系统研究,为拓展新型高性能铜基复合材料的应用领域打下坚实基础。
本文采用机械合金化工艺使在固态和液态下完全互不相溶的Cu-Zr合金系形成过饱和固溶体,产生严重的晶格畸变,显著细化晶粒。用冷压-烧结-复压-复烧工艺对Cu-Zr合金粉末致密化过程进行研究,系统探讨了Zr的含量、压制-烧结工艺对复合材料相对密度、相对电导率、强度、抗弯强度的影响。将Cu-Zr复合材料和Cu-Cr-Zr复合材料性能做一对比,在Cr含量相同的条件下,Zr的加入可以显著改善材料的硬度。少量稀土元素La的加入,使相对电导率有所提高。加入陶瓷颗粒AlN后,硬度明显提高。加入表面未处理纳米AlN颗粒,由于表面能高很容易团聚,分散不均匀,并且与铜基体材料界面结合不紧密,有明显的间隙存在。采用化学镀工艺对AlN颗粒表面镀Cu,以改善Cu-AlN界面状况。结果表明:AlN颗粒表面经化学镀处理后能提高复合材料界面结合强度,在基体和增强颗粒之间可以有效传递载荷,使复合材料的相对密度、相对电导率、硬度、抗弯强度均有所提高。
本文采用机械合金化工艺制备了Cu-Zr复合粉末,开发了相应的成形工艺,并与Cu-Cr-Zr、Cu-Cr-Zr-La、Cu-Cr-Zr-La- Al_2O_3、Cu-Cr-Zr-La-AlN加以对比,寻求最佳工艺参数。同时采用AlN颗粒增强Cu基复合材料,通过化学镀工艺对AlN颗粒进行表面处理,对Cu/AlN复合材料进行界面优化,探索其对复合材料性能的作用。本论文的研究结果对研制开发新型铜基复合材料有着重要的理论和现实意义。
Copper and copper alloys are the traditional high-conductivity materials, but its application is greatly restricted because of lack of strength and hardness performance. The development of electronic, mechanical, aeronautic and aerospace industries is in great demand of developing functional materials with high electrical conductivity, thermal conductivity and excellent mechanical properties, low coefficient of thermal expansion.
In this thesis, to develop copper matrix composites with high electrical conductivity, high strength and hardness, the components of the composite and the preparation technique were designed. Cu(-Zr) matrix composites were fabricated by mechanical alloying (MA) plus cold pressure forming and repressing and resintering process to find the best fabrication process to meet the high- strength,high-conductivity properties. The mechanical alloying process of powder and the composites microstructure, mechanical, physics properties were systematically observed and analyzed by means of SEM, XRD, TEM, and other test instruments. All of these works lay a solid foundation for developing the utilization area of novel advanced copper matrix composites.
Cu (-Zr) supersaturated solid solutions were prepared by mechanical alloying, whereas such a binary system is known to be immiscible in solid and liquid state. The crystalline of Cu-Zr alloy powders were significantly refined and lattice strain had serious lattice distortion during MA process.
Densification Process of Cu-Zr alloy powders was studies by means of cold pressing-sintering-repressing-reinterring method. The influence of different composition Cu-Zr composite on the relative density, conductivity, bending strength and hardness was discussed systematically.
Compare with the Cu-Zr composite,the hardness of the Cu-Cr-Zr composite was improved because of the smaller of Cr phase and Zr precipitated phases. The addition of a small number of rare earth element-La increased the composite conductivity and the hardness.
The hardness was improved obviously after adding ceramic particles AlN. The un-surface treatment of nano-particles AlN was easily reunited due to higher surface energy. The interface between nano-particles and the copper-based material did not close and existed clear gaps.
AlN particles were coated Cu by electro-less deposition to modify Cu-AlN interfaces. The results indicate that the interface of composites was compact. The interfacial bonding strength was improved and the loads can be transferred effectively between matrix and AlN by the surface modification with Cu. Therefore, the relative densities, conductivity, bending strength and hardness properties of composites are improved.
In this paper, Cu-Zr composite powder was prepared by mechanical alloying process. Cu-Zr composites were formed by cold pressure forming and repressing and resintering method and were compared with Cu-Cr-Zr, Cu-Cr-Zr-La, and Cu-Cr-Zr-La-Al_2O_3 and Cu-Cr-Zr-La-AlN composites to find the best process parameters. The Cu-matrix composites were reinforced by AlN particles. AlN particles were coated Cu by electro-less deposition to modify Cu-AlN interfaces. It is of great significances in theory and practice to develop the new type of copper matrix composites.
本文以开发高强度高导电铜基复合材料为目标,通过成分和工艺优化,采用机械合金化(MA)、冷压成形和复压复烧等复合强化工艺制备出了满足性能要求的Cu-Cr-Zr基复合材料。寻求最佳的材料制备工艺,满足对材料高强度、高导电性的性能要求。通过SEM,XRD、TEM和其它实验检测仪器对粉末的机械合金化过程,复合材料的微观组织特征以及机械、物理性能进行了系统研究,为拓展新型高性能铜基复合材料的应用领域打下坚实基础。
本文采用机械合金化工艺使在固态和液态下完全互不相溶的Cu-Zr合金系形成过饱和固溶体,产生严重的晶格畸变,显著细化晶粒。用冷压-烧结-复压-复烧工艺对Cu-Zr合金粉末致密化过程进行研究,系统探讨了Zr的含量、压制-烧结工艺对复合材料相对密度、相对电导率、强度、抗弯强度的影响。将Cu-Zr复合材料和Cu-Cr-Zr复合材料性能做一对比,在Cr含量相同的条件下,Zr的加入可以显著改善材料的硬度。少量稀土元素La的加入,使相对电导率有所提高。加入陶瓷颗粒AlN后,硬度明显提高。加入表面未处理纳米AlN颗粒,由于表面能高很容易团聚,分散不均匀,并且与铜基体材料界面结合不紧密,有明显的间隙存在。采用化学镀工艺对AlN颗粒表面镀Cu,以改善Cu-AlN界面状况。结果表明:AlN颗粒表面经化学镀处理后能提高复合材料界面结合强度,在基体和增强颗粒之间可以有效传递载荷,使复合材料的相对密度、相对电导率、硬度、抗弯强度均有所提高。
本文采用机械合金化工艺制备了Cu-Zr复合粉末,开发了相应的成形工艺,并与Cu-Cr-Zr、Cu-Cr-Zr-La、Cu-Cr-Zr-La- Al_2O_3、Cu-Cr-Zr-La-AlN加以对比,寻求最佳工艺参数。同时采用AlN颗粒增强Cu基复合材料,通过化学镀工艺对AlN颗粒进行表面处理,对Cu/AlN复合材料进行界面优化,探索其对复合材料性能的作用。本论文的研究结果对研制开发新型铜基复合材料有着重要的理论和现实意义。
Copper and copper alloys are the traditional high-conductivity materials, but its application is greatly restricted because of lack of strength and hardness performance. The development of electronic, mechanical, aeronautic and aerospace industries is in great demand of developing functional materials with high electrical conductivity, thermal conductivity and excellent mechanical properties, low coefficient of thermal expansion.
In this thesis, to develop copper matrix composites with high electrical conductivity, high strength and hardness, the components of the composite and the preparation technique were designed. Cu(-Zr) matrix composites were fabricated by mechanical alloying (MA) plus cold pressure forming and repressing and resintering process to find the best fabrication process to meet the high- strength,high-conductivity properties. The mechanical alloying process of powder and the composites microstructure, mechanical, physics properties were systematically observed and analyzed by means of SEM, XRD, TEM, and other test instruments. All of these works lay a solid foundation for developing the utilization area of novel advanced copper matrix composites.
Cu (-Zr) supersaturated solid solutions were prepared by mechanical alloying, whereas such a binary system is known to be immiscible in solid and liquid state. The crystalline of Cu-Zr alloy powders were significantly refined and lattice strain had serious lattice distortion during MA process.
Densification Process of Cu-Zr alloy powders was studies by means of cold pressing-sintering-repressing-reinterring method. The influence of different composition Cu-Zr composite on the relative density, conductivity, bending strength and hardness was discussed systematically.
Compare with the Cu-Zr composite,the hardness of the Cu-Cr-Zr composite was improved because of the smaller of Cr phase and Zr precipitated phases. The addition of a small number of rare earth element-La increased the composite conductivity and the hardness.
The hardness was improved obviously after adding ceramic particles AlN. The un-surface treatment of nano-particles AlN was easily reunited due to higher surface energy. The interface between nano-particles and the copper-based material did not close and existed clear gaps.
AlN particles were coated Cu by electro-less deposition to modify Cu-AlN interfaces. The results indicate that the interface of composites was compact. The interfacial bonding strength was improved and the loads can be transferred effectively between matrix and AlN by the surface modification with Cu. Therefore, the relative densities, conductivity, bending strength and hardness properties of composites are improved.
In this paper, Cu-Zr composite powder was prepared by mechanical alloying process. Cu-Zr composites were formed by cold pressure forming and repressing and resintering method and were compared with Cu-Cr-Zr, Cu-Cr-Zr-La, and Cu-Cr-Zr-La-Al_2O_3 and Cu-Cr-Zr-La-AlN composites to find the best process parameters. The Cu-matrix composites were reinforced by AlN particles. AlN particles were coated Cu by electro-less deposition to modify Cu-AlN interfaces. It is of great significances in theory and practice to develop the new type of copper matrix composites.
引文
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