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溶胶—凝胶法制备ZnO薄膜工艺优化及其压敏特性研究
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摘要
ZnO是一种Ⅱ-Ⅵ族宽禁带化合物半导体材料,在信息领域有着重要的应用。随着大规模集成电路的不断发展,ZnO薄膜优良的低压压敏特性已经引起研究人员的普遍关注。
     本文采用溶胶-凝胶法,在Si(111)衬底上使用旋转涂覆工艺制备了ZnO薄膜。实验应用正交设计的思想,结合XRD测试等方法对制备ZnO薄膜的工艺条件进行了优化,并对压敏特性ZnO薄膜的制备工艺进行了探讨。结果表明:在Si(111)衬底上制备具有高度c轴择优取向性、结晶状况良好的ZnO薄膜的实验方案为:Zn~(2+)浓度为0.35mol/L、陈化温度为50℃、预处理温度为200℃、退火温度为650℃;对于压敏特性ZnO薄膜,掺杂配方为:Bi_2O_3:Sb_2O_3:Co_2O_3:MnO_2:Cr_2O_3:Ni_2O_3=1:2:1:1:1:1、Zn~(2+):杂质浓度=97 mol%/l:3 mol%/l、退火温度750℃;Al系掺杂浓度范围为0.001-0.01mol/l。
     实验测得的ZnO薄膜的非线性系数为8.3~16.12,压敏电压为20V左右,具备良好的压敏特性。
ZnO is a novel II~VI family compound. It is a wide direct-gap semiconductor and has great uses in information age.Following the development of VLSI,ZnO thin films attracts much attention in varistors research field.
     In the paper, A Series of ZnO thin films were prepared on Si(111)in the sol-gel process. Applying the theory of orthogonal-design, the technological conditions were optimized after investigation and analysis of the samples by XRD and have a touch to preparing process of ZnO thin films varistors. The results revealed that, for preparing highly oriented along c-axis and films, the optimized growing parameters at Si (111) substrate were: ZnO:0.35mol/l(Zn~(2+))、50℃(agin temperature)、200℃(preheating temperature)、650℃(annealing temperature)and two hours(heating time) ; for ZnO varistors property thin films, the optimized growing parameters were: Bi_2O_3 : Sb_2O_3 : Co_2O_3 : MnO_2 : Cr_2O_3 : Ni_2O_3 = 1: 2: 1: 1: 1: 1 (impurity)、Zn~(2=) : impurity concentration = 97 mol%/l : 3 mol%/l、750℃(annealing temperature) ; AZO: impurity concentration is 0.001-0.1 mol/l.
     The result:αof ZnO thin films is 8.3~16.12,U_(1MA) is near 20V.
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