微细电解线切割加工技术的基础研究
|
摘要
电解加工是利用金属在电解液中可以发生阳极溶解的原理将零件加工成形的,其材料的减少过程以离子的形式进行。由于金属离子的尺寸非常微小,因此这种微溶解去除方式使得电解加工技术在微细制造领域有着很大的发展潜力。电火花线切割加工是用线电极靠电火花放电对工件进行切割加工,因为电极丝的损耗,必须采用30微米以上直径的线电极,而且为了补偿金属丝损耗必须使电极丝进行快速的运动,不可避免地带来了一定程度的运动误差。因此,它的微细加工能力得到很大的限制。
本文结合微细电解加工技术和线切割的基本思想,提出一种新的微细加工方法:微细电解线切割加工。原理上阴极电极丝不会损耗,采用微米级直径的电极丝,可加工出微米至数十微米尺度的复杂微结构件。提出的技术主要面向航空航天、精密仪器、生物医疗等领域。本文的主要内容包括以下几个方面:
1.建立了微细电解线切割加工的基本理论。分析了微细电解线切割加工的特点,利用法拉第定律和巴特勒-伏尔摩方程,建立了微细电解线切割加工的理论模型,得出线电极进给速度具有理论上限。将微流体边界层理论引入到微细电解线切割加工间隙流场特性的分析中,分析了微细电解线切割加工中微尺度间隙流场下物质的输运机理,提出了加快微尺度间隙中产物排出的技术方案。
2.设计了微细电解线切割加工系统。分别对运动系统、加工检测系统、线电极系统、超短脉宽电源、电解液系统进行设计。提出了加工间隙中短路的两种类型:加工产物堵塞性短路、加工机理性短路,研究了通过统计发生短路位置的分散程度来判别短路类型的方法,实现加工间隙状态的在线检测与辨识。在加工中采用罚函数法优化线电极的进给速度,并依此设计了伺服进给控制策略。最后,基于虚拟仪器技术设计了微细电解加工控制系统及其软件。
3.提出了在线制备微米尺度线电极的新方法。用实时测量金属丝自身电阻变化的方法来控制其腐蚀到所需的尺寸,并基于有限元电场分析优化设计了电化学腐蚀装置,保证线电极的腐蚀均匀性。基于虚拟仪器技术建立了线电极电化学腐蚀法制备监控系统。微细电解线切割的线电极制作和后续加工在同一工艺系统中连续完成,工艺兼容性好,对于提高微细加工精度十分有利。通过实验制备出直径为5μm的线电极。
4.进行了微细电解线切割加工工艺的实验研究。对影响加工精度、加工稳定性和表面质量的因素进行分析。通过微缝的加工实验,全面分析了进给速度、进给频率、电参数、电解液浓度和线电极直径等工艺参数对加工的影响规律。此外,还通过实验验证了线电极相对微幅振动法改善加工稳定性的可行性。
5.进行了微细结构电解线切割加工的实验研究。提出了两种微细电解线切割的加工模式:缝槽切割和结构加工。在缝槽切割模式中,将参数曲线分割为众多直线段,使线电极始终以恒定的线速度沿参数曲线轮廓运动,获得了各种形状缝宽为15μm、深宽比为10的微细缝槽结构;在结构加工模式中,对理论轮廓进行等距偏移,加工出切缝宽度为20μm左右的微型桨叶结构和曲率半径在1μm以下的微细尖角结构。
本文对微细电解线切割加工这一微细加工新技术进行了基础研究,为特殊性能材料的微细加工提供了新的加工途径,必将对微机电系统的进一步发展起到有力的推动作用。
Electrochemical machining (ECM) is an anodic dissolution process to machine workpiece in a flowing electrolyte where the shape of the cathode (as tool) is copied onto the workpiece (as anode) with the removal of the anode in ions. Due to the tiny size of metal ion, this micro-dissolution process brings ECM tremendous potential in the micro-manufacturing field. As for wire electrical discharge machining (WEDM), because of tool wear, the metal wire with the diameter of more than 30μm must be used as the wire electrode of WEDM, and the wire must be move quickly for the compensation of the tool wear. Therefore, WEDM has great limitations for its applications in micro machining in the future.
Wire electrochemical micro machining (WEMM), which is the combination of electrochemical micro machining and the idea of wire cutting, was proposed as a new method of micro machining in this dissertation. Because of no electrode wear in this process the micrometer scale metal wire can be used as the wire electrode in WEMM, and the micrometer or tens micrometer structure can be fabricated. The proposed technology can be used in the field of aviation & aerospace industry, precision instrument, biological and medicinal instrument. The dissertation consists of five sections, including:
1. The fundamental theory of WEMM was investigated. Firstly, the characteristics of WEMM were summarized. Secondly, the theoretical model of WEMM was founded based on the Bulter-Volmer equation and Faraday’laws, and the top limit of the feed speed was studied. At last, the boundary layer theory of micro fluid was introduced into the analysis of the transport mechanism of materials in the micro scale gap of WEMM, and the solution to improving the discharge of materials from the micro gap.
2. The machining system of WEMM was developed. The movement system, measuring system, wire electrode system, high-frequency short-pulse power supply and electrolyte system were designed. The two types of short-circuit: clogging short-circuit and unavoidable short-circuit was proposed, and the type of short-circuit can be determined by the locality distributing of short-circuit, then the state of the micro gap in WEMM was online measured and distinguished. The method of punitive function was used to optimize the velocity of feed forward, and the strategy of servo-control system were designed. Finally, the control system was founded using devices of virtual instruments, and the software of the system was designed based on Labwindows/CVI.
3. The new method of the online fabrication of the micrometer scale wire electrode used in WEMM was investigated. A model about the process of electrochemical etching was developed, the diameter of wire electrode was real-time monitored by precisely measuring the variation in resistance of the electrode. Based on electric field analysis, the device of electrochemical etching was designed to ensure the uniform wear of the wire electrode, and a monitoring system used for fabricating the wire electrodes was developed based on virtual instrument technology. The online fabrication of wire electrode and the following process of WEMM were integrated into one system. Because of the compatibility of the technology, the machining accuracy can be improved. Finally, a tungsten wire electrode of 5μm in diameter was experimentally fabricated.
4. The laws of machining process were experimentally investigated. The effects of various parameters on the machining accuracy, stability and surface quality were analyzed, and the impacts of feed speed, frequency of feed, electrical parameter, electrolyte and the diameter of wire electrode on the machining process were experimentally investigated. Besides, the slight vibration of workpiece took place along the direction of the wire electrode length for effectively refreshing electrolyte in the machining area. A slight vibration of workpiece taking place along the length direction of the wire electrode for effectively refreshing the electrolyte was experimentally proved to be able to improve the stability of WEMM.
5. The micro metal structures were obtained. Two models of machining process: cutting slits and fabricating structures were proposed. In model of cutting slits, parameter curve was divided into micro line segments, the wire electrode fed forward following the profile at constant speed, and the various micro grooves in width of 15μm and aspect-ratio of 10 were obtained; In model of fabricating structures, the profile was deviated from the same distance, micro blades with the slit width of 20μm and micro sharp-angles structure with the radius of 1μm were machined.
The proposed technique can provide a new manufacturing method for machining high-performance materials. Applying this technique to the fabrication of micro products would speed up the development of MEMS.
本文结合微细电解加工技术和线切割的基本思想,提出一种新的微细加工方法:微细电解线切割加工。原理上阴极电极丝不会损耗,采用微米级直径的电极丝,可加工出微米至数十微米尺度的复杂微结构件。提出的技术主要面向航空航天、精密仪器、生物医疗等领域。本文的主要内容包括以下几个方面:
1.建立了微细电解线切割加工的基本理论。分析了微细电解线切割加工的特点,利用法拉第定律和巴特勒-伏尔摩方程,建立了微细电解线切割加工的理论模型,得出线电极进给速度具有理论上限。将微流体边界层理论引入到微细电解线切割加工间隙流场特性的分析中,分析了微细电解线切割加工中微尺度间隙流场下物质的输运机理,提出了加快微尺度间隙中产物排出的技术方案。
2.设计了微细电解线切割加工系统。分别对运动系统、加工检测系统、线电极系统、超短脉宽电源、电解液系统进行设计。提出了加工间隙中短路的两种类型:加工产物堵塞性短路、加工机理性短路,研究了通过统计发生短路位置的分散程度来判别短路类型的方法,实现加工间隙状态的在线检测与辨识。在加工中采用罚函数法优化线电极的进给速度,并依此设计了伺服进给控制策略。最后,基于虚拟仪器技术设计了微细电解加工控制系统及其软件。
3.提出了在线制备微米尺度线电极的新方法。用实时测量金属丝自身电阻变化的方法来控制其腐蚀到所需的尺寸,并基于有限元电场分析优化设计了电化学腐蚀装置,保证线电极的腐蚀均匀性。基于虚拟仪器技术建立了线电极电化学腐蚀法制备监控系统。微细电解线切割的线电极制作和后续加工在同一工艺系统中连续完成,工艺兼容性好,对于提高微细加工精度十分有利。通过实验制备出直径为5μm的线电极。
4.进行了微细电解线切割加工工艺的实验研究。对影响加工精度、加工稳定性和表面质量的因素进行分析。通过微缝的加工实验,全面分析了进给速度、进给频率、电参数、电解液浓度和线电极直径等工艺参数对加工的影响规律。此外,还通过实验验证了线电极相对微幅振动法改善加工稳定性的可行性。
5.进行了微细结构电解线切割加工的实验研究。提出了两种微细电解线切割的加工模式:缝槽切割和结构加工。在缝槽切割模式中,将参数曲线分割为众多直线段,使线电极始终以恒定的线速度沿参数曲线轮廓运动,获得了各种形状缝宽为15μm、深宽比为10的微细缝槽结构;在结构加工模式中,对理论轮廓进行等距偏移,加工出切缝宽度为20μm左右的微型桨叶结构和曲率半径在1μm以下的微细尖角结构。
本文对微细电解线切割加工这一微细加工新技术进行了基础研究,为特殊性能材料的微细加工提供了新的加工途径,必将对微机电系统的进一步发展起到有力的推动作用。
Electrochemical machining (ECM) is an anodic dissolution process to machine workpiece in a flowing electrolyte where the shape of the cathode (as tool) is copied onto the workpiece (as anode) with the removal of the anode in ions. Due to the tiny size of metal ion, this micro-dissolution process brings ECM tremendous potential in the micro-manufacturing field. As for wire electrical discharge machining (WEDM), because of tool wear, the metal wire with the diameter of more than 30μm must be used as the wire electrode of WEDM, and the wire must be move quickly for the compensation of the tool wear. Therefore, WEDM has great limitations for its applications in micro machining in the future.
Wire electrochemical micro machining (WEMM), which is the combination of electrochemical micro machining and the idea of wire cutting, was proposed as a new method of micro machining in this dissertation. Because of no electrode wear in this process the micrometer scale metal wire can be used as the wire electrode in WEMM, and the micrometer or tens micrometer structure can be fabricated. The proposed technology can be used in the field of aviation & aerospace industry, precision instrument, biological and medicinal instrument. The dissertation consists of five sections, including:
1. The fundamental theory of WEMM was investigated. Firstly, the characteristics of WEMM were summarized. Secondly, the theoretical model of WEMM was founded based on the Bulter-Volmer equation and Faraday’laws, and the top limit of the feed speed was studied. At last, the boundary layer theory of micro fluid was introduced into the analysis of the transport mechanism of materials in the micro scale gap of WEMM, and the solution to improving the discharge of materials from the micro gap.
2. The machining system of WEMM was developed. The movement system, measuring system, wire electrode system, high-frequency short-pulse power supply and electrolyte system were designed. The two types of short-circuit: clogging short-circuit and unavoidable short-circuit was proposed, and the type of short-circuit can be determined by the locality distributing of short-circuit, then the state of the micro gap in WEMM was online measured and distinguished. The method of punitive function was used to optimize the velocity of feed forward, and the strategy of servo-control system were designed. Finally, the control system was founded using devices of virtual instruments, and the software of the system was designed based on Labwindows/CVI.
3. The new method of the online fabrication of the micrometer scale wire electrode used in WEMM was investigated. A model about the process of electrochemical etching was developed, the diameter of wire electrode was real-time monitored by precisely measuring the variation in resistance of the electrode. Based on electric field analysis, the device of electrochemical etching was designed to ensure the uniform wear of the wire electrode, and a monitoring system used for fabricating the wire electrodes was developed based on virtual instrument technology. The online fabrication of wire electrode and the following process of WEMM were integrated into one system. Because of the compatibility of the technology, the machining accuracy can be improved. Finally, a tungsten wire electrode of 5μm in diameter was experimentally fabricated.
4. The laws of machining process were experimentally investigated. The effects of various parameters on the machining accuracy, stability and surface quality were analyzed, and the impacts of feed speed, frequency of feed, electrical parameter, electrolyte and the diameter of wire electrode on the machining process were experimentally investigated. Besides, the slight vibration of workpiece took place along the direction of the wire electrode length for effectively refreshing electrolyte in the machining area. A slight vibration of workpiece taking place along the length direction of the wire electrode for effectively refreshing the electrolyte was experimentally proved to be able to improve the stability of WEMM.
5. The micro metal structures were obtained. Two models of machining process: cutting slits and fabricating structures were proposed. In model of cutting slits, parameter curve was divided into micro line segments, the wire electrode fed forward following the profile at constant speed, and the various micro grooves in width of 15μm and aspect-ratio of 10 were obtained; In model of fabricating structures, the profile was deviated from the same distance, micro blades with the slit width of 20μm and micro sharp-angles structure with the radius of 1μm were machined.
The proposed technique can provide a new manufacturing method for machining high-performance materials. Applying this technique to the fabrication of micro products would speed up the development of MEMS.
引文
[1] Gregory T.A.Kovacs.张文栋,董海峰,李永红,等译.微传感器与微执行器全书.北京:科学出版社,2003
[2] Tai-Ran Hsu.王晓浩,蓝金辉,杨兴,等译.MEMS和微系统—设计与制造.北京:机械工业出版社,2004.
[3] Chantal Khan Malek,Volker Saile.Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems:a review.Microelectronics Journal,2004,(35):131-143
[4]王沫然,李志信.基于MEMS的微泵研究进展.传感器技术,2002,21(6):59-61
[5] K.Deng, A.S.Dewa,D.C.Ritter,et al.Characterization of gear pumps fabricated by LIGA.Microsystem Technologies,1998 (4):163-167
[6] Volker Seidemann,Sebastian Butefisch,Stephanus Buttgenbach.Fabrication and investigation of in-plane compliant SU8 structures for MEMS and their application to micro valves and micro grippers.Sensors and Actuators A,2002,(97-98):457-461
[7] Wenmin Qu,Christian Wenzel,Gerald Gerlach.Fabrication of a 3D differential-capacitive acceleration sensor by UV-LIGA.Sensors and Actuators,1999,(77):14-20
[8] W.Qu,C.Wenzel,K.Drescher.A vertically sensitive accelerometer and its realization by depth UV lithography supported electroplating. Microelectronics Journal,2000,(31):569–575
[9]石晶,于建群.基于MEMS技术的毛细管电泳芯片.中国生物工程杂志.2003,23(10):89-92
[10]白兰,吴一辉,张平.基于MEMS的微流体混合器的研究与进展,哈尔滨工业大学学报,2004,36(4):543-545
[11]王科平,葛峻,秦明.MEMS静电执行光开关的设计与实验.电子器件,2003,26(3):240-252
[12] J.Mohr,A.Last,U.Wallrabe.Free Space Optical Components Based on LIGA Technology.In: 8th Microoptics Conference (MOC’01).Tokyo:Optical Soc.of Japan,Japan Soc.of Applied Physics,The Group of Microoptics,2001:106-111
[13] Yannick Ansel,Frank Gindele,Jorg Scheurer,et al.Optical Waveguide device realized using two SU-8 Layer.In:2002 IEEE/LEOS International Conference on Optical MEMS.Lugano:IEEE,2002:123-124
[14] X.Lafontan,F.Pressecq,F.Beaudoin,et al.The advent of MEMS in Space.Microelectronics Reliability,2003,(43):1061-1083
[15] Thomas George.MEMS/NEMS development for Space Application at NASA/JPL.In:Design,Test,Integration,and Packaging of MEMS/MOEMS 2002,Cannes:SPIE-Int.Soc.Opt.Eng,2002:556-567
[16] Ravi Khanna.MEMS fabrication perspectives from the MIT Microengine Project.Surface and Coatings Technology,2003,(163-164):273–280
[17]陈伟平,虞敦,王东红,等.MEMS在军事领域中的应用前景.遥测遥控,1998,19(1):14-19
[18]黄良甫,贾付云.空间微机电系统的研究与进展.真空与低温,2002,8(4):187-196
[19]饶勤.微机电系统的国防应用及其制造技术发展述评(上).航空制造工程,1998,(3):13-15
[20]饶勤.微机电系统的国防应用及其制造技术发展述评(下).航空制造工程,1998,(4):13-15
[21] Y.Watanabe,M.Edo,H.Nakazawa,et al.A new fabrication process of a planar coil using photosensitive polyimide and electroplating.Sensors and Actuators A,1996,(54):733-738
[22] A.Thies,V.Piotter,J.H.Hausselt,et al.A new method for mass fabrication of metallic microstructures.Microsystem Technologies,1998,(4):110-112
[23]姚劲松,王志勤,王飞,等.准LIGA工艺技术在加工微金属齿轮中的应用.光学精密工程,1995,3(2):64-66
[24] Seok-Whan Chung,Jong-Woo Shin,Yong-Kweon Kim,et al.Design and fabrication of micromirror supported by electroplated nickel posts.Sensors and Actuators A,1996,(54):464-467
[25] H.S.Cho,K.J.Hemker,K.Lian,et al.Measured mechanical properties of LIGA Ni structures.Sensors and Actuators A,2003,(103):59-63
[26] T.Hirata,O.T.Guenat,T.Akashi,et al.A numerical simulation on a pneumatic air table realize by Micro-EDM.Journal of Microelectromechanical systems,1999,8(4):523-528
[27] C.K.Chung,C.J.Lin,C.C.Chen,et al Combination of thick resist and electroforming technologies for monolithic inkjet application.Microsystem Technologies,2004,(10):462–466
[28] C.-L.Kuo,J.-D.Huang,H.-Y. Liang.Fabrication of 3D Metal Microstructures Using a Hybrid Process of Micro-EDM and Laser Assembly.Int J Adv Manuf Technol,2003,(21):796–800
[29] S.J.Chung,H.Hein,T.Hirata,et al.A micro cycloid-gear system fabricated by multi-exposure LIGA technique.Microsystem Technologies,2000,(6):149-153
[30] Terry Garino,Alfredo Morales,Thomas Buchheit,et al.The Fabrication of Stainless Steel Parts for MEMS.SAND REPORT,2002:1-20
[31] Jan Peirs,Dominiek Reynaerts,Filip Verplaetsen,et al.A Microturbine Made by Micro-Electro-Discharge Machining.In:The 16th European Conference on Solid-State Transducers, 2002:790-793
[32] Kenichi Kataoka,Shingo Kawamura,Toshihiro Itoh.Electroplating Ni micro-cantilevers for low contact-force IC probing.Sensors and Actuators A,2003,(103):116–121
[33] Frédéric Gillot,Pascal Mognol,Benoit Furet.Dimensional accuracy studies of copper shells used for electro-discharge machining electrodes made with rapid prototyping and the electroforming process.Journal of Materials Processing Technology,2005,(159):33~39
[34] Bohm J, Schubert A, Otto T,et al.Micro-metalforming with silicon silicon dies.Microsystem Technologies,2001,(7):191~196
[35]孔祥东,张玉林,宋会英等.微机电系统的微细加工技术.微纳电子技术,2004,(11):32~38
[36]李德胜,王东红,孙金玮等.MEMS技术及其应用.哈尔滨:哈尔滨工业大学出版社,2002
[37]孔祥东,张玉林,尹明.电子束三维光刻技术的研究.微细加工技术,2003,(4):9~13
[38]荣烈润.特种微细加工技术的现状及应用.机电一体化,2003,(3):6~9
[39]赵玉清.电子束离子束技术.西安:西安交通大学出版社,2002,3
[40] Hung N P,Fu Y Q,Ali M Y.Focused ion beam machining of silicon. Journal of Materials Processing Technology,2002,127(2):256~260
[41] S.J.Chung,H.Hein,T.Hirata,et al.A micro cycloid-gear system fabricated by multi-exposure LIGA technique.Microsystem Technologies,2000,(6):149-153
[42] Chunlei Wang.Guangyao Jia,Lili H.et al.A Novel Method for the Fabrication of High-Aspect Ratio C-MEMS Structures.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,2005,14(2):348-358
[43] Th.Schaller,L.Bohn,J. Mayer,et al.Microstructure grooves with a width of less than 50μm cut with ground hard metal micro end mills.Precision Engineering,1999,(23):229–235
[44] McGeough, J. A., Advanced Methods of Machining, Chapman and Hall,1988
[45]王建业,徐家文,电解加工原理及应用,国防工业出版社,2001:157-163
[46] Risko, D. G., Electrochemical Machining Innovations Solution for Higher Productivity, SME Advanced Manufacturing Technology III, MR90: 244-247
[47]朱荻,国外电解加工的研究进展,电加工与模具,2000,(1):11-16
[48]王建业,高频窄脉冲电解加工的机理研究,华南理工大学学报(自然科学版),2002,30(1):6-11
[49] Rajurkar, K. P., Kozak, J., Wei, B., et al, Study of Pulse Electrochemical Machining Characteristics, Annals of the CIRP, 1993, 42(1): 231-234
[50] Kozak, J., Rajurkar, K. P., Wei, B., Modeling and Analysis of Pulse Electrochemical Machining, ASME Journal of Engineer for industry, 1994, 116:316-323
[51] De Silva, A. K. M., Altena, H. S. J., McGeough, J. A., Precision ECM by Process Characteristic Modelling, Annals of the CIRP, 2000, 49(1):151-155
[52] Wei , B., Rajurkar, K. P, Accuracy and Dynamics of 3-Dimensional Numerical Control Electrochemical Machining (NC-ECM), Proc. of the Winter Annual of ASME, PED, 1990,45:33-45
[53] Kozak, J., Chuchro, M., Ruszaj, A., et al, The computer aided simulation of electrochemical process with universal spherical electrodes when machining sculptured surfaces, Journal of Materials Processing Technology, 2000,107:283-287
[54] Kozak, J., Budzynski, A. F., Domanowski, P., Computer simulation electrochemical shaping (ECM-CNC) using a universal tool electrode, Journal of Materials Processing Technology, 1998, 76:161–164
[55]朱永伟,徐家文,胡平旺,数控展成电解加工整体叶轮的研究与应用,航空学报,2001,22(4):376-378
[56] Wei, B., Yu, C.Y., Xu, J. W., Numerical-controlled electrochemical machining (NC-ECM), Proceedings of ASEM, 1988:135-140
[57]徐家文,王建业. 21世纪初电解加工的发展和应用.电加工与模具,2001, (6):1～5
[58]徐家文,朱永伟,胡平旺等.整体叶轮的数控电解加工及其在航天制造中的应用前景.宇航材料工艺,2003(1):13～18
[59]徐家文.整体叶轮的特种加工方法.航空精密制造技术,1992(4):19～21
[60]朱永伟,徐家文,胡平旺.数控展成电解加工整体叶轮的研究与应用.航空学报.2001,Vol.22(4):376～378
[61] Rajurkar, K. P., Zhu, D., McGeough, J. A., New Developments in Electrochemical Machining, Annals of the CIRP, 1999, 48(2): 567-580
[62]赵万生,王振龙,郭东明等.国外特种加工技术的最近进展.电加工,1999(5):12～19
[63]杨大春,云乃彰,严德荣.硬脆金属的超声电解复合加工研究.电加工与模具,2002(2):31～33
[64] De Silva, A. K., McGeough, J., Hybrid Electrodischarge-Electrochemical Process for Roughing and Finishing Dies and Moulds, Proceedings of the ISEM-12, 1998:397-406
[65] V. Fascio, R. Wüthrich, H. Bleuler, Spark assisted chemical engraving in the light of electrochemistry, Electrochimica Acta, 2004, 49:3997-4003
[66] Imai, Y., Cliftion, D., McGeough, J. A., Some Ultrasonic Effects in machining Materials Encountered in the Offshore Industry, Proc. 30th MTDR Conference, MacMillar Press, London, 1993:119-124
[67] Phillips,R. E., ECG: Combining Electrochemical Attack and Abrasion, Manufacturing Engineering, 1986:46-48
[68] Tehrani F. A. and Atkinson, J., A Study of Pulsed Electrochemical Grinding, Proceedings of the ISEM-11, 1995:543-552
[69] Takashi Mineta. Electrochemical etching of a shape memory alloy using new electrolyte solutions. Journal of Micromechanic and Microengineering, 2004(14): 76～80
[70]李嘉晰,马保吉,范植坚.光刻胶掩膜微细电化学加工参数的实验研究.电加工与模具,2004(6):17～20
[71] Datta, M.,Electrochemical Micromachining in Electrochemical Technology: Innovations and New Developments, Tokyo, 1996
[72] Datta, M., Fabrication of an Array of Precision Nozzles by Through-Mask Electro chemical Micromachining, Journal of Electrochemical Society, 1995, 142 (11): 655-669
[73] Datta, M., Romankiw, L. T., Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces, U.S. Patent,5284554, 1994-02-08
[74] Shenoy,R. V., Datta, M., Effect of Mask Wall Angle on Shape Evolution during Through-Mask Electrochemical Micromachining, Journal of Electrochemical Society, 1996, 143:544-549
[75]张朝阳,朱荻,王明环.超短脉冲电流微细电解加工技术研究.中国机械工程,2005(14):1295～1298
[76] Takashi Mineta. Electrochemical etching of a shape memory alloy using new electrolyte solutions. Journal of Micromechanic and Microengineering, 2004(14): 76～80
[77] M. Datta. Microfabrication by electrochemical metal removal. IBM Journal of Research and Development,1998,Vol.42(5):655～669
[78] Kozak, J., Rajurkar, K.P., Balkrishna, R., Study of electrochemical jet machining process,Transactions of the ASME, 1996,118:490-499
[79]施文轩,张明歧,殷旻等,电射流加工工艺研究和发展,电加工与模具, 2001, 1: 36-39
[80] Johns, B. A., Advanced Machining Techniques for Turbine Blades, Industrial Lubrication and Tribology, 1984, 36(1):4-9
[81] Ahmed, M.S.,Duffield, A., Deep hole drilling using ECM,SME Technical Paper (Series) MS, 1989:809-816
[82]施文轩,张明歧,殷旻,电液束加工工艺的研究及其发展,航空制造技术,2001,6:25-27
[83] Sridhar Sastry, D., Electro-Stream Drilling of High Speed Steel, M. Tech. Theses in Indian Institute of Technology Kanpur,July 1999
[84] Schuster R, Kirchiner V, Allongue P,et al.Electrochemical micromachining.Science,2000,289(5476):98~101
[85] Kock M,Kirchner V,Schuster R.Electrochemical micromachining with ultrashort voltage pulses-a versatile method with lithographical precision.Electrochimica Acta,2003,48(20-22):3213~3219
[86] P. Allongue, P. Jiang, V. Kirchner, A. L. Trimmer, and R. Schuster. Electrochemical micromachining of p-Type Silicon. J. Phys. Chem, B.2004,5:1-6
[87] Kim B H,Na C W,Lee Y S,et al.Micro Electrochemical Machining of 3D Micro Structure Using Dilute Sulfuric Acid.CIRP Annals-Manufacturing Technology,2005,54(1):191~194
[88] Li Yong, Zheng Yunfei, Yang Guang, Peng Liangqiang. Localized electrochemical micromachining with gap control. Sensors and Actuators A, 2003, 108: 144～148
[89]李小海,王振龙,赵万生.微细电化学加工研究新进展.电加工与模具. 2004(2): 1～5
[90]张朝阳.纳秒脉冲电流微细电解加工技术研究.南京航空航天大学博士学位论文,2007
[91] Liu Anwei, Hu Xiaotang,Liu Wenhui,and Ji Guijun.Improved control technique for the electrochemical fabrication scanning tunneling microscopy microtips. Review of Scientific Instruments.1997(68):3811~3813
[92] Inger Ekvall, Erik Wahlstr?m,Dan Claesson, H?kan Olin and Eva Olsson. Preparation and characterization of electrochemically etched W tips for STM.Meas.Sci.Technol, 1999(10): 11~18
[93] Yoshiaki Nakamura,Yutaka Mera,Koji Maeda. A reproducible method to fabricate atomically sharp tips for scanning tunneling microscopy. Review of Scientific Instruments, 2000, Vol (70)8:3373~3376
[94] Sophie Kerfriden,AyssarH.Nahlé,Sheelagh A. Campbell, Frank C.Walsh and James R.Smith. The electrochemical etching of tungsten STM tips. Electrochimica Acta, 1998.Vol(43),No12-13: 1939~1944
[95] Yu,Z.Y.,Kozak,J.,Rajurkar,K.P.,2003,2003,Modelling and simulation of micro EDM process, Annals of the CIRP,Vol.52/1: 143~146
[96] Masuzawa,T.,Okajima,K.,Taguchi,T.,2002,EDM-lathe for micromachining, Annals of the CIRP, Vol.51/1: 355~358
[97] Allen,D.M.,Almond,H.J.A.,Bhongal,J.S.,1999,Typical metrology of micro -hole arrays made in stainless steel foils by two-stage micro-EDM,Annals of the CIRP,Vol. 48/1:127~130
[98]黄燕花,董申,袁光辉,等.微电极精密车削技术.电加工与模具,2003(4):14～16
[99]曹国辉王振龙迟关心等.基于单脉冲放电的钨微细电极快速成形方法及其应用研究.机械工程学报,2003(7):43～47
[100] Hideki Takezawa, Hiroaki Hamamatsu, Naotake Mohri, 2004,Development of micro-EDM-center with rapidly sharpened electrode, Journal of Materials Processing Technology, V149:p112~116
[101] Zhu, D.,Wang,K.,Yang,J.M., 2003, Design of electrode profile in electrochemical manufacturing process,Annals of the CIRP, Vol.52/ 1:169~172
[102] Young-Mo Lim., Soo Hyun Kim.,2001, An electrochemical fabrication method foe extremely thin cylindrical micropin,International Journal of Machine toos&Manufacture,V41:2287~2296
[103] Young-Mo Lim., Hyung-Jun Lim., Jang Ryol Liu, 2003, Fabrication of cylindrical micro pins with various diameters using DC current density control, Journal of Materials Processing Technology,Vol.141: 251~255
[104]王明环.微细电解加工实验研究.南京航空航天大学博士学位论文,2007
[105]刘晋春,赵家齐,赵万生.特种加工技术.第3版.机械工业出版社,1998:52～60
[106]于滨.微细电火花线切割加工控制系统及工艺规律研究.哈尔滨工业大学博士学位论文,2004
[107] CIMT’99特种加工机床评述组.第六届中国国际机床展览会特种加工机床展品水平分析.电加工,2000,(1):1~10
[108]沈洪.低速走丝电火花线切割机走丝系统的现状和发展.电加工与模具,2000,(6):17~20
[109] W. Menz. LIGA and related technologies for industrial application. Sensors and actuators,1996, 54:785~789
[110] Y. F. Luo. Rupture Failure and Mechanical Strength of the Electrode Wire Used in Wire EDM. Journal of Materials Processing Technology. 1999,94:208~215
[111] O. Koch, W. Ehrfeld, F. Michel, H.P. Gurber. Micro-ElectroDischarge Machining Application, Strategy and Technology. Proceedings 2nd Int. Workshop on Microfactories, Fribourg, 2000:79~82
[112]朱荻,王明环,明平美等.微细电化学加工技术.纳米技术与精密工程,2005,3(2):151~155
[113]电解加工编译组.电解加工.北京:国防工业出版社,1977
[114]王建业,徐家文.电解加工原理及应用.北京:国防工业出版社,2001
[115]赵葛霄,黄玉辉.电子束加工技术在微细弯孔加工中的应用研究.电加工与模具,2000,6:28-29
[116]李小海.微细电解加工系统及其工艺技术研究.哈尔滨工业大学博士学位论文,2006
[117]徐惠宇.微细电解加工系统及其相关工艺的研究.南京航空航天大学博士学位论文,2004
[118]李荻.电化学原理.北京:北京航空航天大学出版社,1999
[119]阿伦.J.巴德,拉里.福克纳著,邵元华等译.电化学方法.北京:化学工业出版社,2005
[120] Jerry Goodisman.Electrochemistry. New York:Wiley,1987
[121]赵葛霄,吕文阁.特种加工技术在精密微细加工中的应用.工具技术.2001,35(8):5~8
[122]查全性.电极过程动力学导论.北京:科学出版社,1987
[123]田昭武.电化学研究方法.北京:科学出版社,1984
[124]刘永辉.电化学测试技术.北京:北京航空航天大学出版社,1987
[125]张朝阳.纳秒脉冲电流微细电解加工技术研究.南京航空航天大学博士学位论文,2007
[126] Kenney Jason A, Hwanga G S.Two-dimensional computational model for electrochemical micromachining with ultrashort voltage pulses.Applied Physics Letters,2004,84(19):3774~3776
[127] Kenney Jason A, Hwanga G S. Electrochemical machining with ultrashort voltage pulses: modelling of charging dynamics and feature profile evolution. Nanotechnology,2005,16(7):309~313
[128] J.F.Douglas, J.M.Gasiorek, J.A.Swaffied.流体力学.第一版.北京:高等教育出版社,1992
[129]刘应中,缪国平.高等流体力学.第1版.上海:上海交大出版社,2000
[130]冯炭颖,周兆英,叶雄英.微流体驱动与控制技术研究进展,力学进展.2002,V 32n 1,1 -3
[131]严宗毅.低雷诺数流理论.第1版.北京:北京大学出版社,2002
[132]刘惠枝,舒宏纪.边界层理论.第1版.北京:人民交通出版社,1991
[133]文书明.微流边界层理论及其应用.第1版.北京:冶金工业出版社,2002
[134] L.Yong, Z.Yunfei, Y.Guang, P.Liangqiang, Localized electrochemical micro machining with gap control, Sensors and actuators A,2003 (108):144～148.
[135]史先传.三面进给叶片电解加工系统的研制及其关键技术的研究.南京航空航天大学博士学位论文,2004
[136]龚磊,吴健康,微通道流体流动双电层阻力效应,应用数学和力学, 2006, Vol.27:1219～1225.
[137] Schuster R, Kirchiner V, Allongue P,et al.Electrochemical micromachining.Science,2000,289(5476):98~101.
[138] Bhattacharyya B,Munda J,Malapati M.Advancement in electrochemical micro-machining. International Journal of Machine Tools & Manufacture,2004,44(15):1577~1589
[139]清水贤资,鸿田五郎(彭斌译).脉冲电路.北京:科学出版社,2000
[140]谢西峰.高频脉冲电铸电源的实验研究[硕士学位论文].南京:南京航空航天大学,2003
[141]高速走丝电火花线切割CAD/CAM系统关键技术研究(全文);硕士;广东工业大学
[142]刘子建,黄红武.宗子安CAD原理与应用技术.长沙:湖南大学出版社,1997
[143]陆永华,赵东标,朱荻,等.脉冲电解加工间隙测控方法的研究进展.现代制造工程,2004 (12):13~16
[144]史先传,朱荻,徐惠宇.电解加工的间隙监测与控制.机械科学与技术,2005,24(5):536~539
[145]北京森社科技公司.CHB-25NP产品说明书, http://www.bj701.com/download /pdf/ CHB-25NP-1-1.PDF,2004
[146]王建业,徐家文,电解加工原理及应用,国防工业出版社,2001:157-163
[147]周箭,虚拟仪器及其技术研究,浙江大学学报,2000,34(6):686-689
[148] Ciancarlo ,F., Libero, N., Development of virtual data acquisition systems based on multimedia internet working, Computer Standards & Interfaces, 1999, 21:224-228
[149]秦树人,虚拟仪器及其最新发展,振动、测试与诊断,2000,20:123-129
[150] Yu,Z.Y.,Kozak,J.,Rajurkar,K.P.,2003,2003,Modelling and simulation of micro EDM process, Annals of the CIRP,Vol.52/1: 143~146
[151] Masuzawa,T.,Okajima,K.,Taguchi,T.,2002,EDM-lathe for micromachining, Annals of the CIRP, Vol.51/1: 355~358
[152] Allen,D.M.,Almond,H.J.A.,Bhongal,J.S.,1999,Typical metrology of micro -hole arrays madein stainless steel foils by two-stage micro-EDM,Annals of the CIRP,Vol. 48/1:127~130.
[153]黄燕花,董申,袁光辉,等.微电极精密车削技术.电加工与模具,2003(4):14～16
[154]曹国辉王振龙迟关心等.基于单脉冲放电的钨微细电极快速成形方法及其应用研究.机械工程学报,2003(7):43～47
[155] Hideki Takezawa, Hiroaki Hamamatsu, Naotake Mohri, 2004,Development of micro-EDM-center with rapidly sharpened electrode, Journal of Materials Processing Technology, V149:p112~116
[156] Hideki Takezawa, Hiroaki Hamamatsu, Naotake Mohri, 2004,Development of micro-EDM-center with rapidly sharpened electrode, Journal of Materials Processing Technology, V149:p112~116
[157] Zhu, D.,Wang,K.,Yang,J.M., 2003, Design of electrode profile in electrochemical manufacturing process,Annals of the CIRP, Vol.52/ 1:169~172
[158] Young-Mo Lim., Soo Hyun Kim.,2001, An electrochemical fabrication method foe extremely thin cylindrical micropin,International Journal of Machine toos&Manufacture,V41:2287~2296
[159] Datta M , Landolt D.Fundamental aspects and applications of electrochemical microfabrication.Electrochimics Acta,2000,(45):2535~2558
[160]王明环,朱荻,徐惠宇.微螺旋电极在改善微细电解加工性能中的应用.机械科学与技术,2006,25(3):348~351
[161]徐惠宇,朱荻.微细群缝的精密电解加工研究.中国机械工程,2004,15(21):1912~1915张朝阳,朱荻,王明环,等.超短脉冲电流微细电解加工技术研究.中国机械工程,2005,16(14):1295~1298
[162]刘祚成,高速走丝线切割机床CAD/CAM系统(含工艺参数库)研究,电子科技大学,硕士学位论文,2005
[163]郭艳玲,赵万生,李论等.数控线切割三维直纹面直接刀补算法的研究.航空精密制造技术,2000(6):35～38
[2] Tai-Ran Hsu.王晓浩,蓝金辉,杨兴,等译.MEMS和微系统—设计与制造.北京:机械工业出版社,2004.
[3] Chantal Khan Malek,Volker Saile.Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems:a review.Microelectronics Journal,2004,(35):131-143
[4]王沫然,李志信.基于MEMS的微泵研究进展.传感器技术,2002,21(6):59-61
[5] K.Deng, A.S.Dewa,D.C.Ritter,et al.Characterization of gear pumps fabricated by LIGA.Microsystem Technologies,1998 (4):163-167
[6] Volker Seidemann,Sebastian Butefisch,Stephanus Buttgenbach.Fabrication and investigation of in-plane compliant SU8 structures for MEMS and their application to micro valves and micro grippers.Sensors and Actuators A,2002,(97-98):457-461
[7] Wenmin Qu,Christian Wenzel,Gerald Gerlach.Fabrication of a 3D differential-capacitive acceleration sensor by UV-LIGA.Sensors and Actuators,1999,(77):14-20
[8] W.Qu,C.Wenzel,K.Drescher.A vertically sensitive accelerometer and its realization by depth UV lithography supported electroplating. Microelectronics Journal,2000,(31):569–575
[9]石晶,于建群.基于MEMS技术的毛细管电泳芯片.中国生物工程杂志.2003,23(10):89-92
[10]白兰,吴一辉,张平.基于MEMS的微流体混合器的研究与进展,哈尔滨工业大学学报,2004,36(4):543-545
[11]王科平,葛峻,秦明.MEMS静电执行光开关的设计与实验.电子器件,2003,26(3):240-252
[12] J.Mohr,A.Last,U.Wallrabe.Free Space Optical Components Based on LIGA Technology.In: 8th Microoptics Conference (MOC’01).Tokyo:Optical Soc.of Japan,Japan Soc.of Applied Physics,The Group of Microoptics,2001:106-111
[13] Yannick Ansel,Frank Gindele,Jorg Scheurer,et al.Optical Waveguide device realized using two SU-8 Layer.In:2002 IEEE/LEOS International Conference on Optical MEMS.Lugano:IEEE,2002:123-124
[14] X.Lafontan,F.Pressecq,F.Beaudoin,et al.The advent of MEMS in Space.Microelectronics Reliability,2003,(43):1061-1083
[15] Thomas George.MEMS/NEMS development for Space Application at NASA/JPL.In:Design,Test,Integration,and Packaging of MEMS/MOEMS 2002,Cannes:SPIE-Int.Soc.Opt.Eng,2002:556-567
[16] Ravi Khanna.MEMS fabrication perspectives from the MIT Microengine Project.Surface and Coatings Technology,2003,(163-164):273–280
[17]陈伟平,虞敦,王东红,等.MEMS在军事领域中的应用前景.遥测遥控,1998,19(1):14-19
[18]黄良甫,贾付云.空间微机电系统的研究与进展.真空与低温,2002,8(4):187-196
[19]饶勤.微机电系统的国防应用及其制造技术发展述评(上).航空制造工程,1998,(3):13-15
[20]饶勤.微机电系统的国防应用及其制造技术发展述评(下).航空制造工程,1998,(4):13-15
[21] Y.Watanabe,M.Edo,H.Nakazawa,et al.A new fabrication process of a planar coil using photosensitive polyimide and electroplating.Sensors and Actuators A,1996,(54):733-738
[22] A.Thies,V.Piotter,J.H.Hausselt,et al.A new method for mass fabrication of metallic microstructures.Microsystem Technologies,1998,(4):110-112
[23]姚劲松,王志勤,王飞,等.准LIGA工艺技术在加工微金属齿轮中的应用.光学精密工程,1995,3(2):64-66
[24] Seok-Whan Chung,Jong-Woo Shin,Yong-Kweon Kim,et al.Design and fabrication of micromirror supported by electroplated nickel posts.Sensors and Actuators A,1996,(54):464-467
[25] H.S.Cho,K.J.Hemker,K.Lian,et al.Measured mechanical properties of LIGA Ni structures.Sensors and Actuators A,2003,(103):59-63
[26] T.Hirata,O.T.Guenat,T.Akashi,et al.A numerical simulation on a pneumatic air table realize by Micro-EDM.Journal of Microelectromechanical systems,1999,8(4):523-528
[27] C.K.Chung,C.J.Lin,C.C.Chen,et al Combination of thick resist and electroforming technologies for monolithic inkjet application.Microsystem Technologies,2004,(10):462–466
[28] C.-L.Kuo,J.-D.Huang,H.-Y. Liang.Fabrication of 3D Metal Microstructures Using a Hybrid Process of Micro-EDM and Laser Assembly.Int J Adv Manuf Technol,2003,(21):796–800
[29] S.J.Chung,H.Hein,T.Hirata,et al.A micro cycloid-gear system fabricated by multi-exposure LIGA technique.Microsystem Technologies,2000,(6):149-153
[30] Terry Garino,Alfredo Morales,Thomas Buchheit,et al.The Fabrication of Stainless Steel Parts for MEMS.SAND REPORT,2002:1-20
[31] Jan Peirs,Dominiek Reynaerts,Filip Verplaetsen,et al.A Microturbine Made by Micro-Electro-Discharge Machining.In:The 16th European Conference on Solid-State Transducers, 2002:790-793
[32] Kenichi Kataoka,Shingo Kawamura,Toshihiro Itoh.Electroplating Ni micro-cantilevers for low contact-force IC probing.Sensors and Actuators A,2003,(103):116–121
[33] Frédéric Gillot,Pascal Mognol,Benoit Furet.Dimensional accuracy studies of copper shells used for electro-discharge machining electrodes made with rapid prototyping and the electroforming process.Journal of Materials Processing Technology,2005,(159):33~39
[34] Bohm J, Schubert A, Otto T,et al.Micro-metalforming with silicon silicon dies.Microsystem Technologies,2001,(7):191~196
[35]孔祥东,张玉林,宋会英等.微机电系统的微细加工技术.微纳电子技术,2004,(11):32~38
[36]李德胜,王东红,孙金玮等.MEMS技术及其应用.哈尔滨:哈尔滨工业大学出版社,2002
[37]孔祥东,张玉林,尹明.电子束三维光刻技术的研究.微细加工技术,2003,(4):9~13
[38]荣烈润.特种微细加工技术的现状及应用.机电一体化,2003,(3):6~9
[39]赵玉清.电子束离子束技术.西安:西安交通大学出版社,2002,3
[40] Hung N P,Fu Y Q,Ali M Y.Focused ion beam machining of silicon. Journal of Materials Processing Technology,2002,127(2):256~260
[41] S.J.Chung,H.Hein,T.Hirata,et al.A micro cycloid-gear system fabricated by multi-exposure LIGA technique.Microsystem Technologies,2000,(6):149-153
[42] Chunlei Wang.Guangyao Jia,Lili H.et al.A Novel Method for the Fabrication of High-Aspect Ratio C-MEMS Structures.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,2005,14(2):348-358
[43] Th.Schaller,L.Bohn,J. Mayer,et al.Microstructure grooves with a width of less than 50μm cut with ground hard metal micro end mills.Precision Engineering,1999,(23):229–235
[44] McGeough, J. A., Advanced Methods of Machining, Chapman and Hall,1988
[45]王建业,徐家文,电解加工原理及应用,国防工业出版社,2001:157-163
[46] Risko, D. G., Electrochemical Machining Innovations Solution for Higher Productivity, SME Advanced Manufacturing Technology III, MR90: 244-247
[47]朱荻,国外电解加工的研究进展,电加工与模具,2000,(1):11-16
[48]王建业,高频窄脉冲电解加工的机理研究,华南理工大学学报(自然科学版),2002,30(1):6-11
[49] Rajurkar, K. P., Kozak, J., Wei, B., et al, Study of Pulse Electrochemical Machining Characteristics, Annals of the CIRP, 1993, 42(1): 231-234
[50] Kozak, J., Rajurkar, K. P., Wei, B., Modeling and Analysis of Pulse Electrochemical Machining, ASME Journal of Engineer for industry, 1994, 116:316-323
[51] De Silva, A. K. M., Altena, H. S. J., McGeough, J. A., Precision ECM by Process Characteristic Modelling, Annals of the CIRP, 2000, 49(1):151-155
[52] Wei , B., Rajurkar, K. P, Accuracy and Dynamics of 3-Dimensional Numerical Control Electrochemical Machining (NC-ECM), Proc. of the Winter Annual of ASME, PED, 1990,45:33-45
[53] Kozak, J., Chuchro, M., Ruszaj, A., et al, The computer aided simulation of electrochemical process with universal spherical electrodes when machining sculptured surfaces, Journal of Materials Processing Technology, 2000,107:283-287
[54] Kozak, J., Budzynski, A. F., Domanowski, P., Computer simulation electrochemical shaping (ECM-CNC) using a universal tool electrode, Journal of Materials Processing Technology, 1998, 76:161–164
[55]朱永伟,徐家文,胡平旺,数控展成电解加工整体叶轮的研究与应用,航空学报,2001,22(4):376-378
[56] Wei, B., Yu, C.Y., Xu, J. W., Numerical-controlled electrochemical machining (NC-ECM), Proceedings of ASEM, 1988:135-140
[57]徐家文,王建业. 21世纪初电解加工的发展和应用.电加工与模具,2001, (6):1～5
[58]徐家文,朱永伟,胡平旺等.整体叶轮的数控电解加工及其在航天制造中的应用前景.宇航材料工艺,2003(1):13～18
[59]徐家文.整体叶轮的特种加工方法.航空精密制造技术,1992(4):19～21
[60]朱永伟,徐家文,胡平旺.数控展成电解加工整体叶轮的研究与应用.航空学报.2001,Vol.22(4):376～378
[61] Rajurkar, K. P., Zhu, D., McGeough, J. A., New Developments in Electrochemical Machining, Annals of the CIRP, 1999, 48(2): 567-580
[62]赵万生,王振龙,郭东明等.国外特种加工技术的最近进展.电加工,1999(5):12～19
[63]杨大春,云乃彰,严德荣.硬脆金属的超声电解复合加工研究.电加工与模具,2002(2):31～33
[64] De Silva, A. K., McGeough, J., Hybrid Electrodischarge-Electrochemical Process for Roughing and Finishing Dies and Moulds, Proceedings of the ISEM-12, 1998:397-406
[65] V. Fascio, R. Wüthrich, H. Bleuler, Spark assisted chemical engraving in the light of electrochemistry, Electrochimica Acta, 2004, 49:3997-4003
[66] Imai, Y., Cliftion, D., McGeough, J. A., Some Ultrasonic Effects in machining Materials Encountered in the Offshore Industry, Proc. 30th MTDR Conference, MacMillar Press, London, 1993:119-124
[67] Phillips,R. E., ECG: Combining Electrochemical Attack and Abrasion, Manufacturing Engineering, 1986:46-48
[68] Tehrani F. A. and Atkinson, J., A Study of Pulsed Electrochemical Grinding, Proceedings of the ISEM-11, 1995:543-552
[69] Takashi Mineta. Electrochemical etching of a shape memory alloy using new electrolyte solutions. Journal of Micromechanic and Microengineering, 2004(14): 76～80
[70]李嘉晰,马保吉,范植坚.光刻胶掩膜微细电化学加工参数的实验研究.电加工与模具,2004(6):17～20
[71] Datta, M.,Electrochemical Micromachining in Electrochemical Technology: Innovations and New Developments, Tokyo, 1996
[72] Datta, M., Fabrication of an Array of Precision Nozzles by Through-Mask Electro chemical Micromachining, Journal of Electrochemical Society, 1995, 142 (11): 655-669
[73] Datta, M., Romankiw, L. T., Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-conducting or poorly conducting surfaces, U.S. Patent,5284554, 1994-02-08
[74] Shenoy,R. V., Datta, M., Effect of Mask Wall Angle on Shape Evolution during Through-Mask Electrochemical Micromachining, Journal of Electrochemical Society, 1996, 143:544-549
[75]张朝阳,朱荻,王明环.超短脉冲电流微细电解加工技术研究.中国机械工程,2005(14):1295～1298
[76] Takashi Mineta. Electrochemical etching of a shape memory alloy using new electrolyte solutions. Journal of Micromechanic and Microengineering, 2004(14): 76～80
[77] M. Datta. Microfabrication by electrochemical metal removal. IBM Journal of Research and Development,1998,Vol.42(5):655～669
[78] Kozak, J., Rajurkar, K.P., Balkrishna, R., Study of electrochemical jet machining process,Transactions of the ASME, 1996,118:490-499
[79]施文轩,张明歧,殷旻等,电射流加工工艺研究和发展,电加工与模具, 2001, 1: 36-39
[80] Johns, B. A., Advanced Machining Techniques for Turbine Blades, Industrial Lubrication and Tribology, 1984, 36(1):4-9
[81] Ahmed, M.S.,Duffield, A., Deep hole drilling using ECM,SME Technical Paper (Series) MS, 1989:809-816
[82]施文轩,张明歧,殷旻,电液束加工工艺的研究及其发展,航空制造技术,2001,6:25-27
[83] Sridhar Sastry, D., Electro-Stream Drilling of High Speed Steel, M. Tech. Theses in Indian Institute of Technology Kanpur,July 1999
[84] Schuster R, Kirchiner V, Allongue P,et al.Electrochemical micromachining.Science,2000,289(5476):98~101
[85] Kock M,Kirchner V,Schuster R.Electrochemical micromachining with ultrashort voltage pulses-a versatile method with lithographical precision.Electrochimica Acta,2003,48(20-22):3213~3219
[86] P. Allongue, P. Jiang, V. Kirchner, A. L. Trimmer, and R. Schuster. Electrochemical micromachining of p-Type Silicon. J. Phys. Chem, B.2004,5:1-6
[87] Kim B H,Na C W,Lee Y S,et al.Micro Electrochemical Machining of 3D Micro Structure Using Dilute Sulfuric Acid.CIRP Annals-Manufacturing Technology,2005,54(1):191~194
[88] Li Yong, Zheng Yunfei, Yang Guang, Peng Liangqiang. Localized electrochemical micromachining with gap control. Sensors and Actuators A, 2003, 108: 144～148
[89]李小海,王振龙,赵万生.微细电化学加工研究新进展.电加工与模具. 2004(2): 1～5
[90]张朝阳.纳秒脉冲电流微细电解加工技术研究.南京航空航天大学博士学位论文,2007
[91] Liu Anwei, Hu Xiaotang,Liu Wenhui,and Ji Guijun.Improved control technique for the electrochemical fabrication scanning tunneling microscopy microtips. Review of Scientific Instruments.1997(68):3811~3813
[92] Inger Ekvall, Erik Wahlstr?m,Dan Claesson, H?kan Olin and Eva Olsson. Preparation and characterization of electrochemically etched W tips for STM.Meas.Sci.Technol, 1999(10): 11~18
[93] Yoshiaki Nakamura,Yutaka Mera,Koji Maeda. A reproducible method to fabricate atomically sharp tips for scanning tunneling microscopy. Review of Scientific Instruments, 2000, Vol (70)8:3373~3376
[94] Sophie Kerfriden,AyssarH.Nahlé,Sheelagh A. Campbell, Frank C.Walsh and James R.Smith. The electrochemical etching of tungsten STM tips. Electrochimica Acta, 1998.Vol(43),No12-13: 1939~1944
[95] Yu,Z.Y.,Kozak,J.,Rajurkar,K.P.,2003,2003,Modelling and simulation of micro EDM process, Annals of the CIRP,Vol.52/1: 143~146
[96] Masuzawa,T.,Okajima,K.,Taguchi,T.,2002,EDM-lathe for micromachining, Annals of the CIRP, Vol.51/1: 355~358
[97] Allen,D.M.,Almond,H.J.A.,Bhongal,J.S.,1999,Typical metrology of micro -hole arrays made in stainless steel foils by two-stage micro-EDM,Annals of the CIRP,Vol. 48/1:127~130
[98]黄燕花,董申,袁光辉,等.微电极精密车削技术.电加工与模具,2003(4):14～16
[99]曹国辉王振龙迟关心等.基于单脉冲放电的钨微细电极快速成形方法及其应用研究.机械工程学报,2003(7):43～47
[100] Hideki Takezawa, Hiroaki Hamamatsu, Naotake Mohri, 2004,Development of micro-EDM-center with rapidly sharpened electrode, Journal of Materials Processing Technology, V149:p112~116
[101] Zhu, D.,Wang,K.,Yang,J.M., 2003, Design of electrode profile in electrochemical manufacturing process,Annals of the CIRP, Vol.52/ 1:169~172
[102] Young-Mo Lim., Soo Hyun Kim.,2001, An electrochemical fabrication method foe extremely thin cylindrical micropin,International Journal of Machine toos&Manufacture,V41:2287~2296
[103] Young-Mo Lim., Hyung-Jun Lim., Jang Ryol Liu, 2003, Fabrication of cylindrical micro pins with various diameters using DC current density control, Journal of Materials Processing Technology,Vol.141: 251~255
[104]王明环.微细电解加工实验研究.南京航空航天大学博士学位论文,2007
[105]刘晋春,赵家齐,赵万生.特种加工技术.第3版.机械工业出版社,1998:52～60
[106]于滨.微细电火花线切割加工控制系统及工艺规律研究.哈尔滨工业大学博士学位论文,2004
[107] CIMT’99特种加工机床评述组.第六届中国国际机床展览会特种加工机床展品水平分析.电加工,2000,(1):1~10
[108]沈洪.低速走丝电火花线切割机走丝系统的现状和发展.电加工与模具,2000,(6):17~20
[109] W. Menz. LIGA and related technologies for industrial application. Sensors and actuators,1996, 54:785~789
[110] Y. F. Luo. Rupture Failure and Mechanical Strength of the Electrode Wire Used in Wire EDM. Journal of Materials Processing Technology. 1999,94:208~215
[111] O. Koch, W. Ehrfeld, F. Michel, H.P. Gurber. Micro-ElectroDischarge Machining Application, Strategy and Technology. Proceedings 2nd Int. Workshop on Microfactories, Fribourg, 2000:79~82
[112]朱荻,王明环,明平美等.微细电化学加工技术.纳米技术与精密工程,2005,3(2):151~155
[113]电解加工编译组.电解加工.北京:国防工业出版社,1977
[114]王建业,徐家文.电解加工原理及应用.北京:国防工业出版社,2001
[115]赵葛霄,黄玉辉.电子束加工技术在微细弯孔加工中的应用研究.电加工与模具,2000,6:28-29
[116]李小海.微细电解加工系统及其工艺技术研究.哈尔滨工业大学博士学位论文,2006
[117]徐惠宇.微细电解加工系统及其相关工艺的研究.南京航空航天大学博士学位论文,2004
[118]李荻.电化学原理.北京:北京航空航天大学出版社,1999
[119]阿伦.J.巴德,拉里.福克纳著,邵元华等译.电化学方法.北京:化学工业出版社,2005
[120] Jerry Goodisman.Electrochemistry. New York:Wiley,1987
[121]赵葛霄,吕文阁.特种加工技术在精密微细加工中的应用.工具技术.2001,35(8):5~8
[122]查全性.电极过程动力学导论.北京:科学出版社,1987
[123]田昭武.电化学研究方法.北京:科学出版社,1984
[124]刘永辉.电化学测试技术.北京:北京航空航天大学出版社,1987
[125]张朝阳.纳秒脉冲电流微细电解加工技术研究.南京航空航天大学博士学位论文,2007
[126] Kenney Jason A, Hwanga G S.Two-dimensional computational model for electrochemical micromachining with ultrashort voltage pulses.Applied Physics Letters,2004,84(19):3774~3776
[127] Kenney Jason A, Hwanga G S. Electrochemical machining with ultrashort voltage pulses: modelling of charging dynamics and feature profile evolution. Nanotechnology,2005,16(7):309~313
[128] J.F.Douglas, J.M.Gasiorek, J.A.Swaffied.流体力学.第一版.北京:高等教育出版社,1992
[129]刘应中,缪国平.高等流体力学.第1版.上海:上海交大出版社,2000
[130]冯炭颖,周兆英,叶雄英.微流体驱动与控制技术研究进展,力学进展.2002,V 32n 1,1 -3
[131]严宗毅.低雷诺数流理论.第1版.北京:北京大学出版社,2002
[132]刘惠枝,舒宏纪.边界层理论.第1版.北京:人民交通出版社,1991
[133]文书明.微流边界层理论及其应用.第1版.北京:冶金工业出版社,2002
[134] L.Yong, Z.Yunfei, Y.Guang, P.Liangqiang, Localized electrochemical micro machining with gap control, Sensors and actuators A,2003 (108):144～148.
[135]史先传.三面进给叶片电解加工系统的研制及其关键技术的研究.南京航空航天大学博士学位论文,2004
[136]龚磊,吴健康,微通道流体流动双电层阻力效应,应用数学和力学, 2006, Vol.27:1219～1225.
[137] Schuster R, Kirchiner V, Allongue P,et al.Electrochemical micromachining.Science,2000,289(5476):98~101.
[138] Bhattacharyya B,Munda J,Malapati M.Advancement in electrochemical micro-machining. International Journal of Machine Tools & Manufacture,2004,44(15):1577~1589
[139]清水贤资,鸿田五郎(彭斌译).脉冲电路.北京:科学出版社,2000
[140]谢西峰.高频脉冲电铸电源的实验研究[硕士学位论文].南京:南京航空航天大学,2003
[141]高速走丝电火花线切割CAD/CAM系统关键技术研究(全文);硕士;广东工业大学
[142]刘子建,黄红武.宗子安CAD原理与应用技术.长沙:湖南大学出版社,1997
[143]陆永华,赵东标,朱荻,等.脉冲电解加工间隙测控方法的研究进展.现代制造工程,2004 (12):13~16
[144]史先传,朱荻,徐惠宇.电解加工的间隙监测与控制.机械科学与技术,2005,24(5):536~539
[145]北京森社科技公司.CHB-25NP产品说明书, http://www.bj701.com/download /pdf/ CHB-25NP-1-1.PDF,2004
[146]王建业,徐家文,电解加工原理及应用,国防工业出版社,2001:157-163
[147]周箭,虚拟仪器及其技术研究,浙江大学学报,2000,34(6):686-689
[148] Ciancarlo ,F., Libero, N., Development of virtual data acquisition systems based on multimedia internet working, Computer Standards & Interfaces, 1999, 21:224-228
[149]秦树人,虚拟仪器及其最新发展,振动、测试与诊断,2000,20:123-129
[150] Yu,Z.Y.,Kozak,J.,Rajurkar,K.P.,2003,2003,Modelling and simulation of micro EDM process, Annals of the CIRP,Vol.52/1: 143~146
[151] Masuzawa,T.,Okajima,K.,Taguchi,T.,2002,EDM-lathe for micromachining, Annals of the CIRP, Vol.51/1: 355~358
[152] Allen,D.M.,Almond,H.J.A.,Bhongal,J.S.,1999,Typical metrology of micro -hole arrays madein stainless steel foils by two-stage micro-EDM,Annals of the CIRP,Vol. 48/1:127~130.
[153]黄燕花,董申,袁光辉,等.微电极精密车削技术.电加工与模具,2003(4):14～16
[154]曹国辉王振龙迟关心等.基于单脉冲放电的钨微细电极快速成形方法及其应用研究.机械工程学报,2003(7):43～47
[155] Hideki Takezawa, Hiroaki Hamamatsu, Naotake Mohri, 2004,Development of micro-EDM-center with rapidly sharpened electrode, Journal of Materials Processing Technology, V149:p112~116
[156] Hideki Takezawa, Hiroaki Hamamatsu, Naotake Mohri, 2004,Development of micro-EDM-center with rapidly sharpened electrode, Journal of Materials Processing Technology, V149:p112~116
[157] Zhu, D.,Wang,K.,Yang,J.M., 2003, Design of electrode profile in electrochemical manufacturing process,Annals of the CIRP, Vol.52/ 1:169~172
[158] Young-Mo Lim., Soo Hyun Kim.,2001, An electrochemical fabrication method foe extremely thin cylindrical micropin,International Journal of Machine toos&Manufacture,V41:2287~2296
[159] Datta M , Landolt D.Fundamental aspects and applications of electrochemical microfabrication.Electrochimics Acta,2000,(45):2535~2558
[160]王明环,朱荻,徐惠宇.微螺旋电极在改善微细电解加工性能中的应用.机械科学与技术,2006,25(3):348~351
[161]徐惠宇,朱荻.微细群缝的精密电解加工研究.中国机械工程,2004,15(21):1912~1915张朝阳,朱荻,王明环,等.超短脉冲电流微细电解加工技术研究.中国机械工程,2005,16(14):1295~1298
[162]刘祚成,高速走丝线切割机床CAD/CAM系统(含工艺参数库)研究,电子科技大学,硕士学位论文,2005
[163]郭艳玲,赵万生,李论等.数控线切割三维直纹面直接刀补算法的研究.航空精密制造技术,2000(6):35～38
© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号 地址：北京市海淀区学院路29号 邮编：100083 电话：办公室：(+86 10)66554848；文献借阅、咨询服务、科技查新：66554700 |