摘要
通过对结构和性能的分析与优化,设计并研制了不同场板和宽槽条件下的高工作电压GaAs HFET器件。直流和射频测试结果表明:提升场板长度和宽槽宽度可以有效提高器件的工作电压。器件在南京电子器件研究所流片,最终制备出的器件性能为:击穿电压大于84 V,在20 V工作电压下截止频率为9 GHz,3 GHz时功率增益为15.87 dB、功率附加效率为53%。
High operating voltage GaAs HFETs with different field-plates and wide-recesses were designed and fabricated after performance analysis and structure optimization. The DC test and RF test results indicate that increasing wide-recess and field-plate can improve operating voltage of device. The device is fabricated in Nanjing Electronic Devices Institute. The final performances of device are that breakdown voltage is greater than 84 V, cut-off frequency is 9 GHz at 20 V, power gain is 15.87 dB and power added efficiency is 53% at 3 GHz.
引文
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