摘要
采用开路电位-时间曲线、阴极极化曲线、不同测试电位下的交流阻抗图谱等电化学测试手段,对化学复合镀Ni-P-SiO_2的机制进行了研究。结果表明:基体在化学复合镀Ni-P-SiO_2溶液中具有最佳的反应时间,不考虑温度时最佳的反应时间为4 000s。向镀液中加入SiO_2微粒可以增加膜电阻,对Ni-P合金的沉积具有阻化作用。通过研究次磷酸钠的阳极氧化行为发现,交流阻抗曲线由高频的电感弧和低频的电容弧组成。加入Ni 2+可使电化学反应电阻明显降低,使得次磷酸钠的氧化反应更容易进行。
The mechanism of electroless composite plating of Ni-P-SiO_2 was studied by means of electrochemical methods,such as open circuit potential-time curve,cathodic polarization curve and AC impedance curves under different test potential.The results showed that the substrate has the best reaction time in Ni-P-SiO_2 electroless composite plating bath,and the best reaction time was 4 000 sif the influence of temperature was not considered.The addition of SiO_2 to the plating bath can increase the film resistance,and it has the effect of inhibiting the deposition of Ni-P alloy.Through the study of anodic oxidation behavior of sodium hypophosphite,it was found that the AC impedance curve consist of an inductance arc in the high frequency range and a capacitive arc in the low frequency range.Ni~(2+) can obviously decrease the electrochemical reaction resistance,which promote the oxidation reaction of sodium hypophosphite.
引文
[1]钱利华,黄新民,吴玉程,等.Ni-P-SiO2/TiO2化学复合镀工艺研究[J].电镀与涂饰,2004,23(2):4-8.
[2]李健健.低碳钢表面Ni-P-β-SiC化学复合镀层制备及性能[D].西安:西安科技大学,2013.
[3]张新美.高磷酸性化学镀Ni-P合金的工艺研究[D].山东:山东大学,2006.
[4]缪文桦.光亮剂对化学镀镍镀层的性能影响[D].江苏:江苏科技大学,2005.
[5]车承焕.复合镀技术的发展和应用[J].材料保护,1991,24(9):4-7.