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化学复合镀Ni-P-SiO_2机制的研究
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  • 英文篇名:Study on the Mechanism of Electroless Composite Plating of Ni-P-SiO_2
  • 作者:黄晓梅 ; 向旭
  • 英文作者:HUANG Xiaomei;XIANG Xu;College of Materials Science and Chemical Engineering,Harbin Engineering University;
  • 关键词:开路电位-时间曲线 ; 阴极极化曲线 ; 极化度 ; 交流阻抗图谱 ; 阳极氧化行为
  • 英文关键词:open circuit potential-time curve;;cathodic polarization curve;;degree of polarization;;AC impedance curve;;anodic oxidation behavior
  • 中文刊名:DDHB
  • 英文刊名:Electroplating & Pollution Control
  • 机构:哈尔滨工程大学材料科学与化学工程学院;
  • 出版日期:2019-01-30
  • 出版单位:电镀与环保
  • 年:2019
  • 期:v.39;No.225
  • 语种:中文;
  • 页:DDHB201901020
  • 页数:4
  • CN:01
  • ISSN:31-1507/X
  • 分类号:61-64
摘要
采用开路电位-时间曲线、阴极极化曲线、不同测试电位下的交流阻抗图谱等电化学测试手段,对化学复合镀Ni-P-SiO_2的机制进行了研究。结果表明:基体在化学复合镀Ni-P-SiO_2溶液中具有最佳的反应时间,不考虑温度时最佳的反应时间为4 000s。向镀液中加入SiO_2微粒可以增加膜电阻,对Ni-P合金的沉积具有阻化作用。通过研究次磷酸钠的阳极氧化行为发现,交流阻抗曲线由高频的电感弧和低频的电容弧组成。加入Ni 2+可使电化学反应电阻明显降低,使得次磷酸钠的氧化反应更容易进行。
        The mechanism of electroless composite plating of Ni-P-SiO_2 was studied by means of electrochemical methods,such as open circuit potential-time curve,cathodic polarization curve and AC impedance curves under different test potential.The results showed that the substrate has the best reaction time in Ni-P-SiO_2 electroless composite plating bath,and the best reaction time was 4 000 sif the influence of temperature was not considered.The addition of SiO_2 to the plating bath can increase the film resistance,and it has the effect of inhibiting the deposition of Ni-P alloy.Through the study of anodic oxidation behavior of sodium hypophosphite,it was found that the AC impedance curve consist of an inductance arc in the high frequency range and a capacitive arc in the low frequency range.Ni~(2+) can obviously decrease the electrochemical reaction resistance,which promote the oxidation reaction of sodium hypophosphite.
引文
[1]钱利华,黄新民,吴玉程,等.Ni-P-SiO2/TiO2化学复合镀工艺研究[J].电镀与涂饰,2004,23(2):4-8.
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    [3]张新美.高磷酸性化学镀Ni-P合金的工艺研究[D].山东:山东大学,2006.
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    [5]车承焕.复合镀技术的发展和应用[J].材料保护,1991,24(9):4-7.

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