玻璃基交叉波导的损耗特性研究
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摘要
玻璃材料上的光波导是实现光电印制电路板(EOCB)中导光层制作的重要候选材料,交叉波导是EOCB上常用的集成光学结构,交叉损耗是其关键的参数之一。采用离子交换(IE)法和电场辅助离子迁移(FAIM)技术在玻璃基片上制作了宽分别为5、10、20、30和40μm的垂直交叉光波导,并对波导宽度对波导损耗的影响进行了研究。研究结果表明,玻璃交叉波导损耗对波导宽度有明显的依赖关系,当波导宽从40μm减小到5μm时,交叉波导损耗从0.071dB减小到0.019dB。研究结果可为EOCB上波导交叉结构的优化提供了参考。
Cross-waveguide is one of building blocks widely employed in electro-optical circuit board(EOCB)light-guiding layer.To characterize the dependence of cross-waveguide loss on waveguide width,perpendicular cross-waveguides with different widths of 5μm,10μm,20μm,30μm and 40μm have been manufactured by ion-exchange(IE),and subsequently electric field-assisted ion-migration(FAIM)in glass substrate.Crossing loss of these waveguides has been characterized on these waveguides.Results show that the crossing loss of waveguide on glass substrate exhibits significant dependence on waveguide width:with waveguide width decreasing from 40μm to 5μm,the crossing loss of glass-based waveguide decreases from 0.071dB/cross to 0.019dB/cross.The dependence of crossing loss on optical waveguide provides a new dimension for the optimization of EOCB.
Cross-waveguide is one of building blocks widely employed in electro-optical circuit board(EOCB)light-guiding layer.To characterize the dependence of cross-waveguide loss on waveguide width,perpendicular cross-waveguides with different widths of 5μm,10μm,20μm,30μm and 40μm have been manufactured by ion-exchange(IE),and subsequently electric field-assisted ion-migration(FAIM)in glass substrate.Crossing loss of these waveguides has been characterized on these waveguides.Results show that the crossing loss of waveguide on glass substrate exhibits significant dependence on waveguide width:with waveguide width decreasing from 40μm to 5μm,the crossing loss of glass-based waveguide decreases from 0.071dB/cross to 0.019dB/cross.The dependence of crossing loss on optical waveguide provides a new dimension for the optimization of EOCB.
引文
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[2]Ramaswamy R V.Ion-exchanged glass waveguide:a review[J].Journal of Lightwave Technology,1988,6(6):984.1002.
[3]HAO Yin-lei,GU Jin-hui,ZHENG Wei-wei,et al.Electric conductance variation of glass substrate in the process of field-assisted io-diffusion[J],Journal of Optoelectronics·Laser,2010,21(6):875-879.郝寅雷,谷金辉,郑伟伟,等.电场辅助离子扩散过程中玻璃基片的电导变化[J].光电子·激光,2010,21(6):875-879.
[4]David A Hutt,Karen Williams,Paul P Conway,et al.Challenges in the manufacture of glass substrates for electrical and optical interconnect[J].Circuit World,2007,33(1):22-30.
[5]HAO Yin-lei,ZENG Fu-lin,WANG Zhi-jian.Manufacturing of double-lyared multimode optical waveguides in glass substrate[J].Infrared and Laser Engineering,2015,44(10):3000-3004.郝寅雷,曾福林,王志坚.玻璃基片上双层多模光波导的制备[J].红外与激光工程,2015,44(10):3000-3004.
[6]Henning Schroder,Norbert Arndt-Staufenbiel.Electricaloptical circuit boards optical waveguides and coupling elements based on the thin glass Layer concept[J].Japanese Journal of Applied Physics,2008,47(8):6660-6663.
[7]Richard Charles Alexander Pitwon,Lars Brusberg,Henning Schroder,et al.Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides[J].Journal of Lightwave Technology,2015,33(4):741-754.
[8]Takaaki Ishigure,Yusuke Takeyoshi.Polymer waveguide with 4-channel graded-index circular cores for parallel optical interconnects[J].Optical Express,2007,15(9):5843-5850.
[9]WAN Zhu-jun,YUAN Jing,WU Ya-ming,et al.Research on loss and crosstalk of cross-waveguide in planar lightwave circuit[J].Semiconductor Optoelectronics,2008,29(4):475-477.万助军,袁菁,吴亚明,等.平面光路中交叉波导的损耗和串扰研究[J].半导体光电,2008,29(4):475-477.
[10]XIA Qian,LI Kang,PANG Fu-fei,et al.Transmission characteristics of multimode crossing optical waveguides[J].Semiconductor Optoelectronics,2013,34(6):966-970.夏倩,李康,庞拂飞,等.交叉多模光波导传输特性分析[J].半导体光电,2013,34(6):966-970.
[11]Takaaki Ishigure,Keishiro Shitanda,Yutaro Oizmi.Indexprofile design for low-loss crossed multimode waveguide for optical printed circuit board[J].Optics Express,2015,23(17):22262.
[12]Krahenbuhl Roger,Lamprecht Tobias,Zgraggen Eugen Krahenbuhl,et al.High-precision,self-aligened,optical fiber connectiveity solution for single-mode waveguides embedded in optical PCBs[J].Journal of Lightwave Technology,2015,33(4):865-871.
[13]John R S E,Amb C M,Swatowski B W,et al.Thermally stable low loss optical silicones:A key enabler for electro-optical printed circuit boards[J].Journal of Lightwave Technology,2015,33(4):814-819.
[14]Cai D K,Neyer A.Thermal stability of optical coupling solutions in silicone-based optical interconnects[J].IEEE Transactios on Components,Packaging and Manufacturing Technology,2013,3(2):213-220.
[15]Schmidtke K,Flens F,Worrall A,et al.960 Gb/s optical backplane ecosystem using embedded polymer waveguides and demonstration in a T2G SAS storage array[J].Journal of Lightwave Technology,2013,31(24):3970-3975.
[16]Hendrickx N,Van Erps J,Van Steenberge G,et al.Tolerance analysis for multilayer optical interconnectios integrated on a printed circuit board[J].Journal of Lithwave Technology,2007,25(9):2395-2401.
[17]Li Cheng S,Wei Chung L,Hsiang Hung C,et al.Characterization of organic multi-mode optical waveguides for electro-optical printed circuit boards(EOPCB)[J].Circuit World,2006,32(1):8-15.
[18]Immonen M,Wu J,Hui J Y,et al.Development of electrooptical PCBs with polymer waveguides for high-speed intra-system interconnects[J].Circuit World,2012,38(3):104-112.
[19]Dengke Cai,Andreas Neyer.Polydimethylsiloxane(PDMS)based optical interconnect with copper-clad FR4substrates[J].Sensors and Actuators B:Chemical,2011,160(11):777-783.
[20]Cai D K,Neyer A.Large-scale silicone-rubber-based optical interconnect packaged with FR4[J].Journal of MIcroelectromechanical Systems,2010,19(6):1362-1369.
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