石英玻璃晶圆的加工工艺
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摘要
石英玻璃晶圆(quartz glass wafer)在半导体、光学等行业中应用广泛,随着半导体及光学技术的飞速发展,石英玻璃晶圆的需求量快速增长,下游厂商对石英玻璃晶圆加工精度的要求也愈发严格。为满足下游厂商对于石英玻璃晶圆产品质量与数量的要求,解决石英玻璃晶圆加工制造过程当中加工效率低、产品精度差、检验包装不规范等问题。基于客户实际使用反馈,参照硅类晶圆加工方法并结合石英玻璃基板的加工经验,从材料制造、坯料制备、精密退火、多刀切割、成型加工、精密磨抛、成品检验和清洗包装等方面对石英玻璃晶圆的加工工艺统筹开展了研究。现行工艺制造的产品能够满足绝大多数相关下游厂商对于石英玻璃晶圆质量的要求,同时实现了量产化。该生产工艺已经过市场验证,对实际生产具有指导意义。
Quartz glass wafer has been widely applied in semiconductor and optical industries. With the rapid development of semiconductor and optical technology, the demand for quartz glass wafer rapidly grows. And the requirements for the processing precision of quartz glass wafer are increasingly strict. In order to meet the customer′ s demand for quality and quantity of quartz glass wafer, and solving the problems of low processing efficiency, low product precision, non-standard testing and non-standard packaging, based on the actual feedbacks from the use of customer, and refer the processing experience and processing methods of silicon wafer and quartz substrate, the processing techniques of quartz glass wafer was studied from the material making, blank making, precision annealing, multitool cutting, shaping processing, precision polishing, product inspection, cleaning and packaging. Quartz glass wafer, which is produced by current production process, can meet the customer′ s demand for product quality. And the current production process achieves the mass production. These processing techniques have been validated by market, which can guide the practical operation.
Quartz glass wafer has been widely applied in semiconductor and optical industries. With the rapid development of semiconductor and optical technology, the demand for quartz glass wafer rapidly grows. And the requirements for the processing precision of quartz glass wafer are increasingly strict. In order to meet the customer′ s demand for quality and quantity of quartz glass wafer, and solving the problems of low processing efficiency, low product precision, non-standard testing and non-standard packaging, based on the actual feedbacks from the use of customer, and refer the processing experience and processing methods of silicon wafer and quartz substrate, the processing techniques of quartz glass wafer was studied from the material making, blank making, precision annealing, multitool cutting, shaping processing, precision polishing, product inspection, cleaning and packaging. Quartz glass wafer, which is produced by current production process, can meet the customer′ s demand for product quality. And the current production process achieves the mass production. These processing techniques have been validated by market, which can guide the practical operation.
引文
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[9]Wang Zhifang.Research on grinding and dislocations of wafer[J].Infrared and Laser Engineering,2006,35(S):188-191.(in Chinese)王志芳.晶片研磨速率及损伤层的研究[J].红外与激光工程,2006,35(S):188-191.
[10]Hu Gangxiang.Research on the double-sided polishing mechanism and process optimization for silicon wafer[D].Hangzhou:Zhejiang University of Technology,2007.(in Chinese)胡刚祥.单晶硅双面抛光加工理论及工艺优化的研究[D].杭州:浙江工业大学,2007.
[11]Xiao Fang.Study of water mark issue in semiconductor manufacture WET process[D].Shanghai:Shanghai Jiaotong University,2007.(in Chinese)肖方.晶圆清洗工艺中水痕问题的研究[D].上海:上海交通大学,2007.
[2]Hao Yinlei,Zeng Fulin,Wang Zhijian,et al.Manufacturing of double-layered multimode optical waveguides in glass substrate[J].Infrared and Laser Engineering,2015,44(10):3000-3004.(in Chinese)郝寅雷,曾福林,王志坚,等.玻璃基片上双层多模光波导的制备[J].红外与激光工程,2015,44(10):3000-3004.
[3]Wang Yufen,Sun Liancheng.Quartz Glass[M].Beijing:Chemical Industry Press,2007.(in Chinese)王玉芬,刘连成.石英玻璃[M].北京:化学工业出版社,2007.
[4]Sui Mei,Sun Yuancheng,Song Xuefu,et al.Research of structural stress of CVD synthetic silica glass[J].Journal of Wuhan University of Technology,2010,32(22):106-110.(in Chinese)隋梅,孙元成,宋学富,等.CVD合成石英玻璃的结构均匀性研究[J].武汉理工大学学报,2010,32(22):106-110.
[5]Kong Min,Hua Ning.Finite element analysis of annealing process of quartz glass[J].Journal of Wuhan University of Technology,2013,35(S):6-10.(in Chinese)孔敏,花宁.石英玻璃精密退火过程有限元分析[J].武汉理工大学学报,2013,35(S):6-10.
[6]Kong Min,Hua Ning.Application of multiple-cut in roduction of quartz glass plate[J].China Building Materials Science&Technology,2012(2):29-30.(in Chinese)孔敏,花宁.多刀切割技术在石英玻璃片生产中的应用[J].中国建材科技,2012(2):29-30.
[7]Qiu Zhongjun,Zhou Libo,Fang Fengzhou,et al.Chemical mechanical grinding for quartz glass[J].Optics and Precision Engineering,2010,18(7):1554-1561.(in Chinese)仇中军,周立波,房丰洲,等.石英玻璃的化学机械磨削加工[J].光学精密工程,2010,18(7):1554-1561.
[8]Wang Huijun,Zhang Feihu,Zhao Hang,et al.Effect of several processing parameters on material removal ratio in ultrasonic-magnetorheological compound finishing[J].Opt Precision Eng,2007,15(10):1583-1588.(in Chinese)王慧军,张飞虎,赵航,等.超声波磁流变复合抛光中几种工艺参数对材料去除率的影响[J].光学精密工程,2007,15(10):1583-1588.
[9]Wang Zhifang.Research on grinding and dislocations of wafer[J].Infrared and Laser Engineering,2006,35(S):188-191.(in Chinese)王志芳.晶片研磨速率及损伤层的研究[J].红外与激光工程,2006,35(S):188-191.
[10]Hu Gangxiang.Research on the double-sided polishing mechanism and process optimization for silicon wafer[D].Hangzhou:Zhejiang University of Technology,2007.(in Chinese)胡刚祥.单晶硅双面抛光加工理论及工艺优化的研究[D].杭州:浙江工业大学,2007.
[11]Xiao Fang.Study of water mark issue in semiconductor manufacture WET process[D].Shanghai:Shanghai Jiaotong University,2007.(in Chinese)肖方.晶圆清洗工艺中水痕问题的研究[D].上海:上海交通大学,2007.
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