引线键合过程的动力学建模
|
摘要
以键合点对换能系统的相互作用为考虑的出发点,建立了有时变阻尼项的动力学模型来反映键合过程。通过Matlab数值仿真研究此模型的特性,并与实测数据对照,发现模型中加载项和粘性项的变化,可对应实际键合的特定阶段,由此证实该模型能够较合理地解释键合过程的强度形成规律,同时有助于对键合机理的研究和对工艺的监测与优化。
A dynamic model with time-varying damping term is established to simulate a bonding process. Then, the performance of model is studied through Matlab numerical simulation. Compared with the experimental data, it is found that the changes of the loading term and viscous term in the model can correspond to the specific phases of the actual bonding process which proves that the model could explain the strength formation. It is also helpful to explore bonding mechanism and for process monitoring.
A dynamic model with time-varying damping term is established to simulate a bonding process. Then, the performance of model is studied through Matlab numerical simulation. Compared with the experimental data, it is found that the changes of the loading term and viscous term in the model can correspond to the specific phases of the actual bonding process which proves that the model could explain the strength formation. It is also helpful to explore bonding mechanism and for process monitoring.
引文
[1]Mark L.Wirebond Technology Rolls on[EB/OL].http://semiengineering/wirebond-technology-rolls-on,2017-05-08/2017-11-04.
[2]王福亮,李军辉,韩雷,钟掘.键合时间对粗铝丝超声引线键合强度的影响[J].焊接学报,2006,27(5):47-51.
[3]韩雷,吕雷.引线键合的动力相图和等效受载模型[J].电子学报,2010,38(11):2697-2703.
[4]Zhang Q,Shi S J,Chen W S.An electromechanical coupling model of a bending vibration type piezoelectric ultrasonic transducer[J].Ultrasonics,2016,66:18-26.
[5]M Guerdane.Self-diffusion in intermetallic Al Au4:Molecular dynamics study down to temperatures relevant to wire bonding[J].Computational Materials Science,2017,129:13-23.
[6]Huang K K,Chi L H.A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging[J].Microelectronics Reliabilit,2017,78:272-279.
[7]Tang C G,Zhu J H,Wei S Y.Effect of strain rate on mechanical behaviors of Ti10V2Fe3Al and 30Cr Mn Si Ni2A[J].Transactions of Nonferrous Metals Society of China,2000,1:76-79.
[8]吕雷.键合过程中换能系统振动的关联维数和Lyapunov指数实验研究[D].长沙:中南大学,2009:48-65.
[9]P Grassberger,I Procaccia.Dimensions and entropies of strange attractors from a fluctuating dynamics approach[J].Physica D:Nonlinear Phenomena,1983,13:34-54.
[10]韩雷,王福亮,李军辉,隆志力.微电子封装超声键合机理与技术[M].北京:科学出版社,2014:371-372.
[2]王福亮,李军辉,韩雷,钟掘.键合时间对粗铝丝超声引线键合强度的影响[J].焊接学报,2006,27(5):47-51.
[3]韩雷,吕雷.引线键合的动力相图和等效受载模型[J].电子学报,2010,38(11):2697-2703.
[4]Zhang Q,Shi S J,Chen W S.An electromechanical coupling model of a bending vibration type piezoelectric ultrasonic transducer[J].Ultrasonics,2016,66:18-26.
[5]M Guerdane.Self-diffusion in intermetallic Al Au4:Molecular dynamics study down to temperatures relevant to wire bonding[J].Computational Materials Science,2017,129:13-23.
[6]Huang K K,Chi L H.A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging[J].Microelectronics Reliabilit,2017,78:272-279.
[7]Tang C G,Zhu J H,Wei S Y.Effect of strain rate on mechanical behaviors of Ti10V2Fe3Al and 30Cr Mn Si Ni2A[J].Transactions of Nonferrous Metals Society of China,2000,1:76-79.
[8]吕雷.键合过程中换能系统振动的关联维数和Lyapunov指数实验研究[D].长沙:中南大学,2009:48-65.
[9]P Grassberger,I Procaccia.Dimensions and entropies of strange attractors from a fluctuating dynamics approach[J].Physica D:Nonlinear Phenomena,1983,13:34-54.
[10]韩雷,王福亮,李军辉,隆志力.微电子封装超声键合机理与技术[M].北京:科学出版社,2014:371-372.