表面活性剂对电沉积钴析氢的影响研究
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摘要
低热膨胀系数的钴具有取代铜成为下一代集成电路互连金属的前景而备受关注。本文研究了不同表面活性剂对电沉积钴析氢的影响,分别使用了阴离子表面活性剂十二烷基硫酸钠、阳离子表面活性剂三乙醇胺和非离子表面活性剂聚乙二醇、N-甲基吡咯烷酮、聚乙烯吡咯烷酮。通过霍尔槽电镀实验及电化学测试方法分析了不同表面活性剂对电沉积钴的影响,并探究了表面活性剂对镀层质量的影响。使用金相显微镜和扫描电子显微镜观察镀层,通过接触角测试仪探究不同表面活性剂对镀层的润湿性。对比实验表明,表面活性剂能够抑制析氢并可有效改善电沉积钴镀层质量。
Cobalt has been focused because it has the potential for alternative copper to be the next generation material in integrated circuit interconnection with its low coefficient of thermal expansion property. In this paper,the effects of surfactants on cobalt deposition were studied,including sodium dodecyl sulfate,triethanolamine,polyethylene glycol,N-methyl pyrrolidone and polyvinylpyrrolidone. The effects of surfactants on the quality of coatings were investigated by Hull cell plating experiments and electrochemical tests. The quality of the coating was analyzed by using a metallographic microscope and a scanning electron microscope and wetting properties of the surfactants to the coating were tested. Comparative experiments show that surfactant can inhibit hydrogen evolution and can effectively improve the quality of electroplated cobalt deposition.
Cobalt has been focused because it has the potential for alternative copper to be the next generation material in integrated circuit interconnection with its low coefficient of thermal expansion property. In this paper,the effects of surfactants on cobalt deposition were studied,including sodium dodecyl sulfate,triethanolamine,polyethylene glycol,N-methyl pyrrolidone and polyvinylpyrrolidone. The effects of surfactants on the quality of coatings were investigated by Hull cell plating experiments and electrochemical tests. The quality of the coating was analyzed by using a metallographic microscope and a scanning electron microscope and wetting properties of the surfactants to the coating were tested. Comparative experiments show that surfactant can inhibit hydrogen evolution and can effectively improve the quality of electroplated cobalt deposition.
引文
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[2] Huang Q,Lyons T W,Sides W D,et al. Electrodeposition of cobalt for interconnect application:Effect of dimethylglyoxime[J]. Journal of the Electrochemical Society,2016,163(13):D715-D721.
[3]刘霁云,赵阳,董世运,等.镍钴合金镀层研究进展[J].电镀与精饰,2017,39(7):21-25.
[4]徐文柱.表面活性剂在电镀中的应用[J].过滤与分离,2014,24(4):40-45.
[5]鲍雪,陆太进,魏然,等.表面接触角的测量及表面张力在宝玉石鉴定中的应用[J].岩矿测量,2006,33(5):681-689.
[6]李建,黄飞飞,周益,等.接触角测试的量高法的适用范围[J].科学工程与技术,2013,16:4486-4490.
[7]陈文录,丁万春,李宝环.脉冲电镀添加剂和氯离子对铜电极过程作用的电化学研究[J].印制电路信息,2003,4:39-48.
[8]李果,毛华军.几种表面活性剂对柴油及多环芳烃的增溶作用[J].环境科学研究,2011,24(7):775-780.
[9]郭力.电镀中表面活性剂的选择和应用研究[J].广东化工,2015,42(8):119-121.
[10]李春华.三乙醇胺和EDTA·2Na双配合体快速化学镀铜研究[D].长沙:中南大学,2007.
[11] Kondo K,Amakusa S,Murakawa K,et al. Electroless copper plating solution and process for formation of copper film[P]. US5039338. 1991.
[12]唐徐情.镀液组成对电镀镀层的影响机制研究[D].长春:吉林大学,2016.
[13]李立清,王义,安文娟.酸性硫酸盐镀铜添加剂研究[J].电镀与精饰,2016,38(11):20-23.
[14]马婷芳,史铁钧.聚乙烯吡咯烷酮的性能、合成及应用[J].应用化工,2002,31(3):16-18.
[15]孙启安.镍-石墨烯复合镀层工艺与性能研究[D].太原:太原科技大学,2006.
[16]谢宝如.钨钴共沉积的电化学行为研究[D].赣州:江西理工大学,2015.
[17]郭平.析氢反应与过电位的关系以及氢过电位的应用[J].河北化工,2009,32(7):12-14.