主动式电流体微槽平板热管的理论分析
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摘要
毛细极限常常制约了传统微型平板热管对高热流密度电子器件的冷却。本文采用结构简单、能耗低的电流体力学强化技术与微槽平板热管相结合,建立了一维电流体微槽平板热管稳态轴向流动传热的数学模型,研究了在不同电场强度下工质压力、流速等沿轴向的分布情况.数学分析表明,在本文的研究条件下,当场强为13 kV cm~(-1)时,微型热管的最大传热极限是无电场作用时的11.2倍.微槽平板热管施加电场可加强液体从冷凝段到蒸发段的回流,减少热管对毛细压差的需求,大大提高了热管的传热能力,有助于实现高热流密度电子器件的快速冷却.
The capillary limit tends to restrict the cooling of high heat flux electronic devices by traditional mini flat heat pipe. Electrohydrodynamics, with simple structure and little energy consumption, is an effective strengthening heat transfer technology. This paper sets up one dimensional axial steady fluid flow and heat transfer mathematical model of mini-groove flat heat pipe based on electrohydrodynamics, aiming at studying the axial distribution of working fluid pressure, velocity,etc. under different electrical field intensities. According to mathematical analysis, the maximum heat transfer limit of mini flat heat pipe under field intensity 13 kV·cm-1 is 11.1 times of that without electrical field intensity under the condition of this paper. Applying electrical field to mini-groove flat heat pipe can enhance the liquid backflow from condensation section to evaporation section, decrease the requirement of capillary pressure difference for heat pipe and obviously improve the heat transfer capability of heat pipe, which can contribute to realizing the rapid cooling of high heat flux electronic devices.
The capillary limit tends to restrict the cooling of high heat flux electronic devices by traditional mini flat heat pipe. Electrohydrodynamics, with simple structure and little energy consumption, is an effective strengthening heat transfer technology. This paper sets up one dimensional axial steady fluid flow and heat transfer mathematical model of mini-groove flat heat pipe based on electrohydrodynamics, aiming at studying the axial distribution of working fluid pressure, velocity,etc. under different electrical field intensities. According to mathematical analysis, the maximum heat transfer limit of mini flat heat pipe under field intensity 13 kV·cm-1 is 11.1 times of that without electrical field intensity under the condition of this paper. Applying electrical field to mini-groove flat heat pipe can enhance the liquid backflow from condensation section to evaporation section, decrease the requirement of capillary pressure difference for heat pipe and obviously improve the heat transfer capability of heat pipe, which can contribute to realizing the rapid cooling of high heat flux electronic devices.
引文
[1] Jiao A J, Ma H B, Critser J K. Evaporation Heat Transfer Characteristics of a Grooved Heat Pipe with Micro-trapezoidal Grooves[J]. International of Journal Heat and Mass Transfer, 2007, 50(6):2905-2911
[2] Jeong S I, Seyedyagoobi J. Performance Enhancement of a Monogroove Heat Pipe With Electrohydrodynamic Conduction Pumping[C]//ASME 2002 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2002:71-77
[3] Chubb L W. Improvements Relating to Methods and Apparatus for Heating Liquids:UK Patent[P]. 1961
[4] Yazdani M, Seyed-Yagoobi J. Electrically Induced Dielectric Liquid Film Flow Based on Electric Conduction Phenomenon[J]. IEEE Transactions on Dielectrics&Electrical Insulation, 2009, 16(3):768-777
[5] Yu Z, Hallinani K, Bhagat W, et al. Electrohydrodynamically Augmented Micro Heat Pipes[J]. Journal of Thermophysics&Heat Transfer, 2015, 16(2):180-186
[6] Suman B. A Steady State Model and Maximum Heat Transport Capacity of an Electrohydrodynamically Augmented Micro-grooved Heat Pipe[J]. International Journal of Heat&Mass Transfer, 2006, 49(21/22):3957-3967
[7] Bryan J E, Seyedyagoobi J. Heat Transport Enhancement of Monogroove Heat Pipe with Electrohydrodynamic Pumping[J]. Journal of Thermophysics&Heat Transfer,2015, 11(3):454-460
[8] Carey V P. Liquid-vapor Phase-change Phenomena[M].London:Taylor&Francis, 1992
[9] Gumerov N A. Determination of the Accomodation Coefficient Using Vapor/Gas Bubble Dynamics in an Acoustic Field[J]. Chemical Communications, 1999, 46(21):3797-3799
[10]袁嘉成.电场强化单组分汽液相变传热的热力学机理及其应用[D].广州:华南理工大学,2016YUAN Jiacheng. Theory and Application of Heat Transfer by Liquid-Vapor Phase Change with Electric Field[J].Guang Zhou:South China University of Technology, 2016
[11] Ma H B, Peterson G P. Experimental Investigation of the Maximum Heat Transport in Triangular Grooves[J]. Journal of Heat Transfer, 1996, 118(8):740-745
[2] Jeong S I, Seyedyagoobi J. Performance Enhancement of a Monogroove Heat Pipe With Electrohydrodynamic Conduction Pumping[C]//ASME 2002 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2002:71-77
[3] Chubb L W. Improvements Relating to Methods and Apparatus for Heating Liquids:UK Patent[P]. 1961
[4] Yazdani M, Seyed-Yagoobi J. Electrically Induced Dielectric Liquid Film Flow Based on Electric Conduction Phenomenon[J]. IEEE Transactions on Dielectrics&Electrical Insulation, 2009, 16(3):768-777
[5] Yu Z, Hallinani K, Bhagat W, et al. Electrohydrodynamically Augmented Micro Heat Pipes[J]. Journal of Thermophysics&Heat Transfer, 2015, 16(2):180-186
[6] Suman B. A Steady State Model and Maximum Heat Transport Capacity of an Electrohydrodynamically Augmented Micro-grooved Heat Pipe[J]. International Journal of Heat&Mass Transfer, 2006, 49(21/22):3957-3967
[7] Bryan J E, Seyedyagoobi J. Heat Transport Enhancement of Monogroove Heat Pipe with Electrohydrodynamic Pumping[J]. Journal of Thermophysics&Heat Transfer,2015, 11(3):454-460
[8] Carey V P. Liquid-vapor Phase-change Phenomena[M].London:Taylor&Francis, 1992
[9] Gumerov N A. Determination of the Accomodation Coefficient Using Vapor/Gas Bubble Dynamics in an Acoustic Field[J]. Chemical Communications, 1999, 46(21):3797-3799
[10]袁嘉成.电场强化单组分汽液相变传热的热力学机理及其应用[D].广州:华南理工大学,2016YUAN Jiacheng. Theory and Application of Heat Transfer by Liquid-Vapor Phase Change with Electric Field[J].Guang Zhou:South China University of Technology, 2016
[11] Ma H B, Peterson G P. Experimental Investigation of the Maximum Heat Transport in Triangular Grooves[J]. Journal of Heat Transfer, 1996, 118(8):740-745