脉冲周期对黄金电沉积层的影响（英文）
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摘要
在无氰黄金电沉积工艺的基础上,利用双向脉冲电源,经过20 h的电沉积可以得到质量较好的厚度达150μm的黄金样品。通过以脉冲周期为单一变量实验,研究了脉冲周期对黄金电沉积层的影响,利用扫描电镜、X射线衍射仪以及维氏硬度计探讨了黄金电沉积层的微观形貌、平均晶粒尺寸以及维氏硬度。结果显示,当脉冲周期为45～75 ms时,电沉积层的维氏硬度HV0.1较高,最高可以达到1170 MPa,且电沉积层具有较强的(111)晶面的择优取向。较强的(111)晶面择优取向伴随着电沉积层更加平整的微观形貌以及更高的维氏硬度。
Electroformed gold layers were prepared by bidirectional pulse electrodeposition process, with thickness up to 150 μm in 20 h from cyanide-free bath. Through a single variable experiment, in which the pulse period was treated as a single variable, we studied the effect of pulse period on the properties of electroformed layer of gold using bidirectional pulse power. Scanning electron microscopy, X-ray diffraction, and Vickers hardness test were used to research the surface morphology, average crystal size and hardness of electroformed gold layers. Results show that the microhardness of electroformed layer of gold is higher when pulse period changes between 45 and 75 ms, which can reach to 1170 MPa. Strong(111) preferred orientation can result in flatter micro surface and higher microhardness of electroformed gold layers.
Electroformed gold layers were prepared by bidirectional pulse electrodeposition process, with thickness up to 150 μm in 20 h from cyanide-free bath. Through a single variable experiment, in which the pulse period was treated as a single variable, we studied the effect of pulse period on the properties of electroformed layer of gold using bidirectional pulse power. Scanning electron microscopy, X-ray diffraction, and Vickers hardness test were used to research the surface morphology, average crystal size and hardness of electroformed gold layers. Results show that the microhardness of electroformed layer of gold is higher when pulse period changes between 45 and 75 ms, which can reach to 1170 MPa. Strong(111) preferred orientation can result in flatter micro surface and higher microhardness of electroformed gold layers.
引文
1 Xu Weiyuan.Plating and Finishing[J],1987,9(2):7
2 Tang Peter T.Electrochemica Acta[J],2001,47(1-2):61
3 Pang Mei,Li Hongyou,Li Zheyi et al.Electroplating&Pollution Control[J],2010,30(1):11
4 Liu Zhengwei,Zheng Min,Robert D Hilty et al.Electrochimica Acta[J],2011,56(5):2546
5 Frade T,Bouzon V,Gomes A et al.Surface and Coatings Technology[J],2010,204(21-22):3592
6 Cheng Minyuan,Chen Keiwei,Liu Tzengfeng et al.Thin Solid Films[J],2010,518(24):7468
7 Sylwestrowicz W,Hall E O.Proceeding of the Physical Society.Section B[J],1951,64(6):495
8 Schiotz Jakob,Jacobsen Karsten W.Science[J],2003,301(5638):1357
9 Li Y G,Lasia A.Journal of the Electrochemical Society[J],1997,144(6):1979
10 Nakahara S.Journal of Crystal Growth[J],1986,75(2):212
2 Tang Peter T.Electrochemica Acta[J],2001,47(1-2):61
3 Pang Mei,Li Hongyou,Li Zheyi et al.Electroplating&Pollution Control[J],2010,30(1):11
4 Liu Zhengwei,Zheng Min,Robert D Hilty et al.Electrochimica Acta[J],2011,56(5):2546
5 Frade T,Bouzon V,Gomes A et al.Surface and Coatings Technology[J],2010,204(21-22):3592
6 Cheng Minyuan,Chen Keiwei,Liu Tzengfeng et al.Thin Solid Films[J],2010,518(24):7468
7 Sylwestrowicz W,Hall E O.Proceeding of the Physical Society.Section B[J],1951,64(6):495
8 Schiotz Jakob,Jacobsen Karsten W.Science[J],2003,301(5638):1357
9 Li Y G,Lasia A.Journal of the Electrochemical Society[J],1997,144(6):1979
10 Nakahara S.Journal of Crystal Growth[J],1986,75(2):212