摘要
采用多物理场耦合仿真技术设计了一部W波段低副瓣平板缝隙阵天线,重点研究了热-结构-电磁多物理场耦合的仿真设计方法,通过对W波段平板缝隙阵天线在温度场、位移场和电磁场综合环境下的耦合分析,验证了高频天线单一的电磁理论仿真结果与实际使用时的电气指标存在较大的差异,这对预测和优化复杂弹载环境下W波段平板缝隙阵天线的电气性能具有重要的指导意义。
A W-band planar slot array antenna with low side-lobe level is designed by using the multi-physical-field coupling simulation technology. Simulation design method of thermal-structure-electromagnetic multi-physical-field coupling is researched as a focus. Coupling analyses of the W-band planar slot array antenna under the integrated environment consisting of temperature field,displacement field,and electromagnetic field show that there are great differences between simulation results based on only electromagnetic theory and actual electrical specifications of a high-frequency antenna. This paper has important guiding significance for predicating and optimizing electrical specifications of W-band planar slot array antennas under complex missile-borne environment.
引文
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