用户名: 密码: 验证码:
智能包装的应用与发展趋势分析
详细信息    查看全文 | 推荐本文 |
  • 英文篇名:Application and Development Trend of Intelligent Packaging
  • 作者:刘辰雨 ; 张改梅 ; 宋晓利 ; 鲁建东 ; 曹玥 ; 石佳子
  • 英文作者:LIU Chen-yu;ZHANG Gai-mei;SONG Xiao-li;LU Jian-dong;CAO Yue;SHI Jia-zi;Beijing Institute of Graphic Communication;
  • 关键词:智能包装 ; 温度指示器 ; 射频识别技术 ; 增强现实 ; 传感器
  • 英文关键词:intelligent packaging;;temperature indicator;;radio frequency identification;;augmented reality;;sensor
  • 中文刊名:BZGC
  • 英文刊名:Packaging Engineering
  • 机构:北京印刷学院;
  • 出版日期:2019-08-10
  • 出版单位:包装工程
  • 年:2019
  • 期:v.40;No.405
  • 基金:北京印刷学院科技项目(ED201804,EB201701)
  • 语种:中文;
  • 页:BZGC201915013
  • 页数:7
  • CN:15
  • ISSN:50-1094/TB
  • 分类号:89-95
摘要
目的为促进智能包装技术发展,进一步拓展智能包装的功能与应用领域。方法总结指示器、条形码、射频识别、增强现实、传感器等智能包装技术的应用现状,详细分析智能包装的市场需求和面临的机遇与挑战,并提出未来的研究方向。结论智能包装在传统包装的基础上结合了新的科学技术,增加了包装的功能,具有广阔的发展前景,但其目前仍处于发展的初始阶段,依然存在成本高、安全性不足、环境污染、技术应用范围不广等问题。通过分析智能包装的需求和探讨未来的研究方向,进一步开发新技术与新型环保材料、加强信息交互,是非常必要的。
        The work aims to promote the development of intelligent packaging technology and further expand the function and application field of intelligent packaging. The application status of intelligent packaging technologies such as indicators, barcodes, radio frequency identification, augmented reality and sensors was summarized. The market demand for intelligent packaging and the opportunities and challenges were analyzed in detail, and the future research direction was proposed. Intelligent packaging combines new science and technology on the basis of traditional packaging, which increases the function of packaging, and enables the intelligent packaging to have broad development prospects. However,intelligent packaging is still at the start-up stage, and has disadvantages such as high cost, insufficient safety, environmental pollution and application limitation. It is necessary to further develop new technologies and new environmentally friendly materials and to strengthen information interaction by analyzing the needs of intelligent packaging and exploring future research directions.
引文
[1]崇岚,潘军辉,熊鹏文.智能包装技术的应用现状和发展前景[J].包装工程,2017,38(15):159-164.CHONG Lan,PAN Jun-hui,XIONG Peng-wen.Development and Applications of Intelligent Packaging Technology[J].Packaging Engineering,2017,38(15):159-164.
    [2]张改梅.智能包装技术及其应用领域[J].印刷技术,2007(29):19-22.ZHANG Gai-mei.Intelligent Packaging Technology and Its Application Fields[J].Printing Technology2007(29):19-22.
    [3]许文才,李东立.智能包装技术的发展与应用[J].印刷工业,2009(4):11-14.XU Wen-cai,LI Dong-li.Development and Application of Intelligent Packaging Technology[J].Printing Industry,2009(4):11-14.
    [4]张建辉.智能结构的研究现状及其前景展望[J].科学技术与工程,2008,8(21):5886-5890.ZHANG Jian-hui.Research Status and Prospects of Intelligent Structure[J].Science Technology and Engineering,2008,8(21):5886-5890.
    [5]FANG Z,ZHAO Y,WARNER R D,et al.Active and Intelligent Packaging in Meat Industry[J].Trends in Food Science&Technology,2017,61(Complete):60-71.
    [6]SOHAIL M,SUN D W,ZHU Z.Recent Developments in Intelligent Packaging for Enhancing Food Quality and Safety[J].Critical Reviews in Food Science and Nutrition,2018(1):1-41.
    [7]谢勇,刘林,王凯丽,等.包装用智能标签的应用及研究进展[J].包装工程,2017,38(19):121-126.XIE Yong,LIU Lin,WANG Kai-li,et al.Application and Research Progress of the Intelligent Label for Packaging[J].Packaging Engineering,2017,38(19):121-126.
    [8]POYATOSRACIONERO E,ROSLIS J V,VIVANCOSJ L,et al.Recent Advances on Intelligent Packaging as Tools to Reduce Food Waste[J].Journal of Cleaner Production,2018,172:3398-3409.
    [9]PEREIRA Jr V A,DE ARRUDA I N Q,STEFANI R.Active Chitosan/PVA Films with Anthocyanins from Brassica Oleraceae(Red Cabbage)as Time-Temperature Indicators for Application in Intelligent Food Packaging[J].Food Hydrocolloids,2015,43:180-188.
    [10]WU D,WANG Y,CHEN J,et al.Preliminary Study on Time-Temperature Indicator(TTI)System Based on Urease[J].Food Control,2013,34(1):230-234.
    [11]KOUTSOUMANIS K P,GOUGOULI M.Use of Time Temperature Integrators in Food Safety Management[J].Trends in Food Science&Technology,201543(2):236-244.
    [12]郭鹏飞,何昊葳,付亚波,等.气敏类智能包装标签技术的研究进展[J].包装工程,2018,39(11):13-18.GUO Peng-fei,HE Hao-wei,FU Ya-bo,et al.Research Progress of Gas Sensitive Smart Packaging Labels[J].Packaging Engineering,2018,39(11):13-18.
    [13]JUNG J,LEE K,PULIGUNDLA P,et al.Chitosan-based Carbon Dioxide Indicator to Communicate the Onset of Kimchi Ripening[J].LWT-Food Science and Technology,2013,54(1):101-106.
    [14]GHAANI M,COZZOLINO C A,CASTELLI G,et al An Overview of the Intelligent Packaging Technologies in the Food Sector[J].Trends in Food Science&Technology,2016,51:1-11.
    [15]A Big Data Approach for Logistics Trajectory Discovery from RFID-enabled Production Data[J].International Journal of Production Economics,2015,165:260-272.
    [16]PAULUS R M.Inkjet Printed Paper Based Frequency Selective Surfaces and Skin Mounted RFID Tags:the Interrelation between Silver Nanoparticle Ink,Paper Substrate and Low Temperature Sintering Technique[J].Journal of Materials Chemistry C,2015,3(9):2132-2140.
    [17]FENG Y,XIE L,CHEN Q,et al.Low-Cost Printed Chipless RFID Humidity Sensor Tag for Intelligent Packaging[J].IEEE Sensors Journal,2015,15(6):3201-3208.
    [18]GUO Z X,NGAI E W T,YANG C,et al.An RFID-based Intelligent Decision Support System Architecture for Production Monitoring and Scheduling in a Distributed Manufacturing Environment[J].International Journal of Production Economics,2015,159:16-28.
    [19]ZHANG J,TIAN G Y.UHF RFID Tag Antenna-based Sensing for Corrosion Detection&Characterization Using Principal Component Analysis[J].IEEE Transactions on Antennas and Propagation,2016,64(10):4405-4414.
    [20]KUMARI L,NARSAIAH K,GREWAL M K,et al.Application of RFID in Agri-food Sector[J].Trends in Food Science&Technology,2015,43(2):144-161.
    [21]赵彬,杨祖彬,崔爽.信息型智能包装标签技术的研究进展[J].包装工程,2017,38(3):77-82.ZHAO Bin,YANG Zu-bin,CUI Shuang.Research Progress of Smart Packaging Labels of Information Type[J].Packaging Engineering,2017,38(3):77-82.
    [22]程雁飞.增强现实在智能包装中的应用趋势[J].包装工程,2018,39(7):27-30.CHENG Yan-fei.Application Trend of Augmented Reality in Intelligent Packaging[J].Packaging Engineering,2018,39(7):27-30.
    [23]MAKRIS S,KARAGIANNIS P,KOUKAS S,et al.Augmented Reality System for Operator Support in Human-Robot Collaborative Assembly[J].CIRP Annals,2016,65(1):61-64.
    [24]张改梅,曹玥,王璐,等.基于增强现实技术有机番茄智能包装的研究及开发[J].包装工程,2018,39(21):1-5.ZHANG Gai-mei,CAO Yue,WANG Lu,et al.Research and Development of Intelligent Packaging for the Organic Tomato Based on Augmented Reality Technology[J].Packaging Engineering,2018,39(21):1-5.
    [25]VANDERROOST M,RAGAERT P,DEVLIEGHEREF,et al.Intelligent Food Packaging:The Next Generation[J].Trends in Food Science&Technology,2014,39(1):47-62.
    [26]BORCHERT N B,KERRY J P,PAPKOVSKY D B.ACO2 Sensor Based on Pt-porphyrin Dye and FRETScheme for Food Packaging Applications[J].Sensors and Actuators B:Chemical,2013,176:157-165.
    [27]ZHU C,YANG G,LI H,et al.Electrochemical Sensors and Biosensors Based on Nanomaterials and Nanostructures[J].Analytical Chemistry,2014,87(1):230-249.
    [28]DAS R,CHANSIN G.Smart Packaging Comes to Market:Brand Enhancement with Electronics2014-2024,IDTechEx,2013.
    [29]GUILLERMO F,ISMAEL S,CARRASCO Raúl,et al Intelligent Packaging Systems:Sensors and Nanosensors to Monitor Food Quality and Safety[J].Journal of Sensors,2016:1-8.
    [30]智能包装技术基础形成市场规模有望突破2000亿[EB/OL].http://www.cpp114.com/news/newsShow_266595.htm.
    [31]TRUNG T Q,LEE N E.Flexible and Stretchable Physical Sensor Integrated Platforms for Wearable Human-Activity Monitoringand Personal Healthcare[J].Advanced Materials,2016,28(22):4338-4372.
    [32]DASGUPTA N,RANJAN S,MUNDEKKAD D,et al Nanotechnology in Agro-food:from Field to Plate[J].Food Research International,2015,69:381-400.
    [33]ZHANG J,LIU X,NERI G,et al.Nanostructured Materials for Room-temperature Gas Sensors[J].Advanced Materials,2016,28(5):795-831.
    [34]BOWLES M,LU J.Removing the Blinders:A Literature Review on the Potential of Nanoscale Technologies for the Management of Supply Chains[J].Technological Forecasting&Social Change,2014,82(1):190-198.
    [35]NECHYPORCHUK O,BELGACEM M N,BRAS JProduction of Cellulose Nanofibrils:A Review of Recent Advances[J].Industrial Crops and Products,2016,93:2-25.
    [36]CHEN K,GAO W,EMAMINEJAD S,et al.Printed Carbon Nanotube Electronics and Sensor Systems[J]Advanced Materials,2016,28(22):4397-4414.
    [37]SECOR E B,HERSAM M C.Emerging Carbon and Post-carbon Nanomaterial Inks for Printed Electronics[J].The Journal of Physical Chemistry Letters2015,6(4):620-626.
    [38]WU W.Inorganic Nanomaterials for Printed Electronics:a Review[J].Nanoscale,2017,9(22):7342-7372.
    [39]SCHAEFER Dirk,et al.Smart Packaging:Opportunities and Challenges[J].Procedia CIRP,2018(72):1022-1027.

© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号

地址:北京市海淀区学院路29号 邮编:100083

电话:办公室:(+86 10)66554848;文献借阅、咨询服务、科技查新:66554700