CuCrSnZn合金析出相价电子结构计算与强化机理分析
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摘要
基于经验电子理论(EET理论)及程氏改进的TFD理论,计算了CuCrSnZn合金时效处理后析出的析出相Cr与基体Cu形成的α-Cu(111)/Cr(110)相界面的价电子结构,利用界面结合因子ρ、△ρ分析了合金界面电子结构与合金的析出强化和软化温度的关系。结果表明,α-Cu(111)/Cr(110)晶面电子密度差较大,界面应力较大,有效阻碍了位错的运动和界面的推移,从而提高了合金的强度和软化温度。
Based on the empirical electron theory and the improved thomas-fermi-dirac theory,the interface valence electron structure of α-Cu(111)/Cr(110) were calculated.The Cr phase was precipitated from Cu matrix in CuCrSnZn alloy after aging trentment.Structure parameters of ρ and △ρ,the relationships of the interface valence electron structures with the precipitation strengthening and softening temperature were discussed by the electrons.The results show that the a-Cu(111)/Cr(110) crystal plane electron density difference △ρ is larger,so the interfacial stress is greater,which makes the resistance to dislocation and interface motion stronger.As a result,the strength and softening temperature are increased.
Based on the empirical electron theory and the improved thomas-fermi-dirac theory,the interface valence electron structure of α-Cu(111)/Cr(110) were calculated.The Cr phase was precipitated from Cu matrix in CuCrSnZn alloy after aging trentment.Structure parameters of ρ and △ρ,the relationships of the interface valence electron structures with the precipitation strengthening and softening temperature were discussed by the electrons.The results show that the a-Cu(111)/Cr(110) crystal plane electron density difference △ρ is larger,so the interfacial stress is greater,which makes the resistance to dislocation and interface motion stronger.As a result,the strength and softening temperature are increased.
引文
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[2]刘平.铜合金功能材料[M].北京:科学出版社,2004:113.
[3]SU Juan-hua,REN Feng-zhang,LIU Ping.Aging strengthening in rapidly solidified Cu-Cr-Sn-Zn alloy[J].Journal of Materials Science andTechnology,2009,25(2):230-232.
[4]JIA S G,ZHENG M S,LIU P,et al.Aging properties studies in a Cu-Ag-Cr alloy[J].Mater Sci Eng A,2006,419(1-2):8-11.
[5]贾淑果,刘平,郑茂盛,等.铜合金固溶强化的电子理论解释[J].中国有色金属学报,2008,18(8):1522-1526.JIA Shu-guo,LIU Ping,ZHENG Mao-sheng,et al.Explanation based on electron theory for solid solution strengthening in copper alloy[J].TheChinese Journal of Nonferrous Metals,2008,18(8):1522-1526.
[6]李飞,赵侠,李鑫,等.Cu-Zn合金固溶体的价电子结构分析[J].兵器材料科学与工程,2009,32(6):23-26.LI Fei,ZHAO Xia,LI Xin,et al.Analysis of valence electron structures of Cu-Zn alloy solid solution[J].Ordnance Material Science and Engineering,2009,32(6):23-26.
[7]张瑞林.固体与分子经验电子理论[M].长春:吉林科学技术出版社,1993:225-427.
[8]刘平,康布熙,曹兴国,等.快速凝固Cu-Cr合金时效析出的共格强化效应[J].金属学报,1999,35(6):561-564.LIU Ping,KANG Bu-xi,CAO Xing-guo.Coherent strengthening of aging precipitation in rapidly solidified Cu-Cr alloy[J].Acta Metallurgica Sinica,1999,35(6):561-564.
[9]Weatherly G C,Humble P,Borlaan D.Precipitation in a Cu-0.55wt%-Cr alloy[J].Acta Metall,1979,27(12):1815-1828.
[10]刘志林,李志林,刘伟东.界面电子结构与界面性能[M].北京:科学出版社,2002:14-99.
[11]屈华,刘伟东,张坤.Ti3Al基合金(0001)α2//(110)β界面价电子结构分析[J].稀有金属材料与工程,2008,43(10):1569-1572.QU Hua,LIU Wei-dong,ZHANG Kun.Ti3Al based alloy(0001)α2//(110)βinterface valence electron structure analysis[J].Rare Metal Materialsand Engineering,2008,43(10):1569-1572.
[12]李志林,刘志林,孙振国.合金相结构因子和界面结合因子的计算方法及其在合金设计中的应用[J].金属学报,1999,35(7):673-681.LI Zhi-lin,LIU Zhi-lin,SUN Zheng-guo.Calculation of the phase structure factors and interface conjunction factors of alloy and their application toalloy design[J].Acta Metallurgica Sinica,1999,35(7):673-681.
[13]徐长征,王庆娟,黄美权,等.冷变形Cu-0.36Cr(wt%)合金的抗软化性能和再结晶行为[J].金属热处理,2007,32(5):38-42.XU Chang-zheng,WANG Qing-juan,HUANG Mei-quan,et al.Softening resistant performance and recrvstallization behavior of cold-deformed Cu-0.36Cr(wt)alloy[J].Heat Treatment of Metals,2007,32(5):38-42.