引线框架用Cu-Sn-Ni-P合金抗软化性能的研究
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摘要
研究了化学成分、退火处理对引线框架用Cu-Sn-Ni-P合金抗软化性能的影响。对抗软化处理试样的硬度和显微组织进行研究,并与常规的引线框架材料进行对比分析。结果表明,Cu-Sn-Ni-P合金经低温退火后材料的性能及抗软化性能均有所改善。锌元素的添加能提高合金的力学性能和再结晶温度。综合比较C194,C7025和Cu-Sn-Ni-P引线框架材料,Cu-Sn-Ni-P合金性能指标介于C194与C7025合金中间,因具有生产工艺简单和成本低廉,可满足中高端引线框架材料的市场需求。
The effects of chemical composition and annealing treatment on the softening resistance performance of Cu-Sn-Ni-P alloy for lead frame were investigated. The hardness and microstructure of the specimens after softening treatment were studied, which was compared with common lead frame. The results show that the hardness and softening resistance of Cu-Sn-Ni-P alloy after low temperature annealing treatment are enhanced. The addition of Zn to Cu-Sn-Ni-P alloy can enhance the hardness and recrystallization temperature. By the comparison of C194, C7025 and Cu-Sn-Ni-P alloy, it is considered that the performance index of Cu-Sn-Ni-P alloy is between C19400 and C7025, which can meet the needs of middle-high grade lead frame market, owing to its simple production process and low cost.
The effects of chemical composition and annealing treatment on the softening resistance performance of Cu-Sn-Ni-P alloy for lead frame were investigated. The hardness and microstructure of the specimens after softening treatment were studied, which was compared with common lead frame. The results show that the hardness and softening resistance of Cu-Sn-Ni-P alloy after low temperature annealing treatment are enhanced. The addition of Zn to Cu-Sn-Ni-P alloy can enhance the hardness and recrystallization temperature. By the comparison of C194, C7025 and Cu-Sn-Ni-P alloy, it is considered that the performance index of Cu-Sn-Ni-P alloy is between C19400 and C7025, which can meet the needs of middle-high grade lead frame market, owing to its simple production process and low cost.
引文
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[2]陈文革,王纯.IC用金属铜基引线框架和电子封装材料研究进展[J].材料导报,2002(7):29-30.
[3]范莉,刘平,贾淑果.铜基引线框架材料研究进展[J].材料开发与应用,2008,23(4):101-108.
[4]向文永,陈小祝,匡同春.集成电路用引线框架材料的研究现状与趋势[J].材料导报,2006,20(3):122-125.
[5]范莉,刘平,贾淑果.高强度Cu-Ni-Si系引线框架材料研究进展[J].热加工工艺,2008,37(20):104-107.
[6]赵谢群.引线框架铜合金材料研究及开发进展[J].稀有金属,2003,27(6):777-781.
[7]Nomura K.A new copper alloy,CAC5,with excellent stress relaxation resistance for automotive electrical connectors[J].Kobelco Technology Review,2013,31(11):82-89.
[8]李国俊.高弹性合金的现状与发展趋势[J].材料导报,1993,7(4):18-19.
[9]余永宁.材料科学基础[M].北京:高等教育出版社,2006.
[10]孙建春,刘筱薇,周安若.弹性合金的研究现状及趋势[J].材料热处理,2006,35(18):52-55.
[11]路俊攀,李湘海.加工铜及铜合金金相图谱[M].长沙:中南大学出版社有限责任公司,2010.