摘要
LED是一种半导体发光器件,相对于传统光源具有节能、环保、寿命长等诸多优点,正发展成为新一代照明光源,但LED发光同时会产生较多热量,芯片局部热流密度可达100 W/m~2。若无法将产生的热量及时散出,将会对LED正常工作带来不利影响。通过分析现有大功率LED灯散热方式、封装结构等设计方案,提出一种可用250 W白光LED替代500 W场地照明金属卤素灯的大功率LED场地照明用灯,并能有效控制芯片结点温度小于85℃。
LED is a kind of semiconductor luminous device. Compared to traditional light sources,LED has such advantages as energy saving, environmental protection and long service life. So it is being developed as a new generation of light source, but LED will produce a lot of heat during the illumination time. The partial heat flux density of the core is up to 100 W/m2. It will bring adverse effects on LED normal work if there is no way to dissipate the heat inside. By the analysis of the design schemes of the current large power LED with the dissipation ways and packaging structure, finally a kind of large power LED field lighting was proposed to use LED with 250 W instead of the halogen lamp with 500 W,and the junction temperature can be controlled less than 85℃.
引文
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