金刚石粒径及含量对超音速激光沉积金刚石/Cu复合涂层微观结构及性能的影响
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摘要
目的研究不同金刚石粒径及含量对超音速激光沉积金刚石/Cu复合涂层微观结构及性能的影响。方法利用超音速激光沉积技术制备金刚石/Cu复合涂层。采用扫描电镜和摩擦磨损测试对涂层的显微组织结构和磨损性能进行了分析,用激光闪烁法测量复合涂层的热导率。结果金刚石均匀分布在复合涂层中,原始粉末中金刚石体积分数从30%增加到50%时,复合涂层中金刚石颗粒的面积占比仅从14.01%升至16.79%,远低于金刚石颗粒在原始粉末中的含量。400目金刚石/Cu复合涂层的平均热导率为296 W/(m·K),摩擦系数为0.551;800目金刚石/Cu复合涂层的平均热导率为238 W/(m·K),摩擦系数为0.545。结论原始粉末中金刚石配比的增加并未对复合涂层中金刚石含量的提升有显著作用。金刚石/Cu复合涂层的热导率随着增强相颗粒含量的增加而降低,随着增强相颗粒粒径的增大而提高。不同粒径金刚石颗粒的添加能显著降低Cu涂层的摩擦系数,且小粒径金刚石颗粒的添加使复合涂层的摩擦系数更低和更稳定,从而使其具有更小的磨损量和磨痕宽度,表现出较优的耐磨损性能。
The work aims to study the effects of different diamond particle sizes and contents on the microstructure andproperties of diamond/Cu composite coatings prepared by supersonic laser deposition. The microstructure and wear propertiesof the coatings were analyzed by scanning electron microscopy and friction and wear test. The thermal conductivity of thecomposite coating was measured by laser scintillation. The diamond particles were evenly distributed in the composite coating.When the content of 800-mesh diamond particles in the original composite powder increased from 30% to 50%, the area ratio ofdiamond particles in the composite coating only increased from 14.01% to 16.79%, which was much lower than that of the dia-mond particles in the original composite powder. The average thermal conductivity and friction coefficient of the 400-meshdiamond/Cu composite coating were 296 W/(m·K) and 0.551, respectively; and the average thermal conductivity and frictioncoefficient of the 800-mesh diamond/Cu composite coating were 238 W/(m·K) and 0.545. The increase of diamond ratio in theoriginal composite powder does not have a significant effect on the increase of diamond content in the composite coating. Thethermal conductivity of the diamond/Cu composite coating decreases as the content of the diamond particles increases, and in-creases as the particle size of the diamond particles increases. The addition of diamond of different particle sizes can signifi-cantly reduce the friction coefficient of the Cu coating, and the diamond in smaller size can make the friction coefficient muchlower and the coating more stable and then lead to lower wear amount and smaller scar width, so that the excellent wear resis-tance is obtained.
The work aims to study the effects of different diamond particle sizes and contents on the microstructure andproperties of diamond/Cu composite coatings prepared by supersonic laser deposition. The microstructure and wear propertiesof the coatings were analyzed by scanning electron microscopy and friction and wear test. The thermal conductivity of thecomposite coating was measured by laser scintillation. The diamond particles were evenly distributed in the composite coating.When the content of 800-mesh diamond particles in the original composite powder increased from 30% to 50%, the area ratio ofdiamond particles in the composite coating only increased from 14.01% to 16.79%, which was much lower than that of the dia-mond particles in the original composite powder. The average thermal conductivity and friction coefficient of the 400-meshdiamond/Cu composite coating were 296 W/(m·K) and 0.551, respectively; and the average thermal conductivity and frictioncoefficient of the 800-mesh diamond/Cu composite coating were 238 W/(m·K) and 0.545. The increase of diamond ratio in theoriginal composite powder does not have a significant effect on the increase of diamond content in the composite coating. Thethermal conductivity of the diamond/Cu composite coating decreases as the content of the diamond particles increases, and in-creases as the particle size of the diamond particles increases. The addition of diamond of different particle sizes can signifi-cantly reduce the friction coefficient of the Cu coating, and the diamond in smaller size can make the friction coefficient muchlower and the coating more stable and then lead to lower wear amount and smaller scar width, so that the excellent wear resis-tance is obtained.
引文
[1]GOTO Y,KAMEBUCHI Y,HAGIO T,et al.Electrodeposition of copper/carbonous nanomaterial composite coatings for heat-dissipation materials[J].Coatings,2017,8(1):5.
[2]邓安强,樊静波,谭占秋,等.金刚石/铜复合材料在电子封装材料领域的研究进展[J].金刚石与磨料磨具工程,2010,30(5):56-61.DENG An-qiang,FAN Jing-bo,TAN Zhan-qiu,et al.Research progress of diamond/Cu composite material for electronic packaging[J].Diamond&abrasives engineering,2010,30(5):56-61.
[3]赵妍冰,刘克明,陆德平,等.金刚石/铜电子封装复合材料的研究状况及展望[J].热处理技术与装备,2013,34(6):31-36.ZHAO Yan-bing,LIU Ke-ming,LU De-ping,et al.Research status and prospect of CD/Cu composite for electronic packaging material[J].Heat treatment technology and equipment,2013,34(6):31-36.
[4]张晓宇,蔺伟康,许旻,等.添加稀土Nd改善金刚石/铜复合材料界面[J].表面技术,2018,47(5):27-32.ZHANG Xiao-yu,LIN Wei-kang,XU Min,et al.Addition of rare earth neodymium to improve interface of diamond/copper composites[J].Surface technology,2018,47(5):27-32.
[5]曲聪凯.铜结晶器表面激光熔覆Ni基涂层的组织性能研究[D].沈阳:东北大学,2010.QU Cong-kai.The structure and property study on Ni-based coating prepared by laser on the surface of crystallizer copper alloy[D].Shenyang:Northeastern University,2010.
[6]张荻,苑孟颖,谭占秋,等.金刚石/Cu复合界面导热改性及其纳米化研究进展[J].金属学报,2018,54(11):1586-1596.ZHANG Di,YUAN Meng-ying,TAN Zhan-qiu,et al.Progress in interface modification and nanoscale study of diamond/Cu composites[J].Acta metallurgica sinica,2018,54(11):1586-1596.
[7]PELLIZZARI M,CIPOLLONI G.Tribological behaviour of Cu based materials produced by mechanical milling/alloying and spark plasma sintering[J].Wear,2017,376-377:958-967.
[8]CHE Q L,ZHANG J J,CHEN X K,et al.Spark plasma sintering of titanium-coated diamond and copper-titanium powder to enhance thermal conductivity of diamond/copper composites[J].Materials science in semiconductor processing,2015,33:67-75.
[9]李信,龙剑平,胥明.金刚石颗粒/金属基复合材料的研究进展[J].特种铸造及有色合金,2012,32(7):654-656.LI Xin,LONG Jian-ping,XU Ming.Progress in diamond/metal matrix composites[J].Special costing&nonferrous alloys,2012,32(7):654-656.
[10]ABYZOV A M,KRUSZEWSKI M J,CIUPINSKI?,et al.Diamond-tungsten based coating-copper composites with high thermal conductivity produced by pulse plasma sintering[J].Materials&design,2015,76:97-109.
[11]张永忠,金具涛,涂义,等.纯铜表面激光熔覆铜合金涂层的组织及耐磨性[J].金属热处理,2009,34(4):28-32.ZHANG Yong-zhong,JIN Ju-tao,TU Yi,et al.Microstructure and wear resistance of laser clad copper alloy coating on pure copper[J].Heat treatment of metals,2009,34(4):28-32.
[12]IRAVANI M,KHAJEPOUR A,CORBIN S,et al.Preplaced laser cladding of metal matrix diamond composite on mild steel[J].Surface&coatings technology,2012,206(8):2089-2097.
[13]BRAY M,COCKBURN A,O'NEILL W.The laser-assisted cold spray process and deposit characterization[J].Surface&coatings technology,2009,203(19):2851-2857.
[14]YAO J H,YANG L J,LI B,et al.Beneficial effects of laser irradiation on the deposition process of diamond/Ni60 composite coating with cold spray[J].Applied surface science,2015,330:300-308.
[15]YAO J H,YANG L J,LI B,et al.Characteristics and performance of hard Ni60 alloy coating produced with supersonic laser deposition technique[J].Materials&design,2015,83:26-35.
[16]杨理京,李争显,黄春良,等.激光辅助冷喷涂制备高硬度材料涂层的研究进展[J].材料导报,2018,32(3):412-417.YANG Li-jing,LI Zheng-xian,HUANG Chun-liang,et al.Producing hard material coatings by laser-assisted cold spray:A technological review[J].Materials review,2018,32(3):412-417.
[17]YANG L J,LI B,YAO J H,et al.Effects of diamond size on the deposition characteristic and tribological behavior of diamond/Ni60 composite coating prepared by supersonic laser deposition[J].Diamond&related materials,2015,58:139-148.
[18]刘永正.金刚石/铜复合材料热导率研究[C]//中国功能材料科技与产业高层论坛论文集.镇江:江苏大学,2009:323-325.LIU Yong-zheng.Study on thermal conductivity of diamond/copper composites[C]//Proceedings of China high-level forum on functional materials technology and industry.Zhenjiang:Jiangsu University,2009:323-325.
[19]WANG J D,LI L Q,LIN P P,et al.Effect of TiC particle size on the microstructure and tensile properties of TiCp/Ti6Al4V composites fabricated by laser melting deposition[J].Optics&laser technology,2018,105:195-206.
[20]刘艳娥.刹车片金属陶瓷复合材料制备及摩擦特性研究[J].铸造技术,2018,39(6):1329-1331.LIU Yan-e.Preparation and friction characteristics of brake pad made from ceramic composite materials[J].Foundry technology,2018,39(6):1329-1331.
[21]马彦宇.铜基钎料钎焊颗粒增强复合涂层的研究[D].长春:吉林大学,2007.MA Yan-yu.Study on Cu-based filler metal brazed composite coating with particle reinforced[D].Changchun:Jilin University,2007.
[22]NA H,BAE G,SHIN S,et al.Advanced deposition characteristics of kinetic sprayed bronze/diamond composite by tailoring feedstock properties[J].Composites science&technology,2009,69(3-4):463-468.
[23]KIM H J,JANG J H,CHANG H L.Assessment of metal/diamond composite coating by cold spray deposition[J].Journal of the Korean institute of metals and materials,2007,45(7):409-415.
[24]晏义伍.颗粒尺寸对Si Cp/Al复合材料性能的影响规律及其数值模拟[D].哈尔滨:哈尔滨工业大学,2007.YAN Yi-wu.Effect of particle size on properties of Si Cp/Al composites and its numerical simulation[D].Harbin:Harbin Institute of Technology,2007.
[25]余志华,张建云,周贤良,等.电子封装Si Cp/Al复合材料导热性能研究与进展[J].金属功能材料,2009,16(1):59-64.YU Zhi-hua,ZHANG Jian-yun,ZHOU Xian-liang,et al.Research and development on thermal conductivity of SiC/Al composites applied to electronic packaging[J].Metallic functional materials,2009,16(1):59-64.
[26]HASSELMAN D P H,JOHNSON L F.Effective thermal conductivity of composites with interfacial thermal barrier resistance[J].Journal of composite materials,1987,21(6):508-515.
[27]SKOLIANOS S,KATTAMIS T Z.Tribological properties of SiCp-reinforced Al-4.5%Cu-1.5%Mg alloy composites[J].Materials science&engineering A,1993,163(1):107-113.
[2]邓安强,樊静波,谭占秋,等.金刚石/铜复合材料在电子封装材料领域的研究进展[J].金刚石与磨料磨具工程,2010,30(5):56-61.DENG An-qiang,FAN Jing-bo,TAN Zhan-qiu,et al.Research progress of diamond/Cu composite material for electronic packaging[J].Diamond&abrasives engineering,2010,30(5):56-61.
[3]赵妍冰,刘克明,陆德平,等.金刚石/铜电子封装复合材料的研究状况及展望[J].热处理技术与装备,2013,34(6):31-36.ZHAO Yan-bing,LIU Ke-ming,LU De-ping,et al.Research status and prospect of CD/Cu composite for electronic packaging material[J].Heat treatment technology and equipment,2013,34(6):31-36.
[4]张晓宇,蔺伟康,许旻,等.添加稀土Nd改善金刚石/铜复合材料界面[J].表面技术,2018,47(5):27-32.ZHANG Xiao-yu,LIN Wei-kang,XU Min,et al.Addition of rare earth neodymium to improve interface of diamond/copper composites[J].Surface technology,2018,47(5):27-32.
[5]曲聪凯.铜结晶器表面激光熔覆Ni基涂层的组织性能研究[D].沈阳:东北大学,2010.QU Cong-kai.The structure and property study on Ni-based coating prepared by laser on the surface of crystallizer copper alloy[D].Shenyang:Northeastern University,2010.
[6]张荻,苑孟颖,谭占秋,等.金刚石/Cu复合界面导热改性及其纳米化研究进展[J].金属学报,2018,54(11):1586-1596.ZHANG Di,YUAN Meng-ying,TAN Zhan-qiu,et al.Progress in interface modification and nanoscale study of diamond/Cu composites[J].Acta metallurgica sinica,2018,54(11):1586-1596.
[7]PELLIZZARI M,CIPOLLONI G.Tribological behaviour of Cu based materials produced by mechanical milling/alloying and spark plasma sintering[J].Wear,2017,376-377:958-967.
[8]CHE Q L,ZHANG J J,CHEN X K,et al.Spark plasma sintering of titanium-coated diamond and copper-titanium powder to enhance thermal conductivity of diamond/copper composites[J].Materials science in semiconductor processing,2015,33:67-75.
[9]李信,龙剑平,胥明.金刚石颗粒/金属基复合材料的研究进展[J].特种铸造及有色合金,2012,32(7):654-656.LI Xin,LONG Jian-ping,XU Ming.Progress in diamond/metal matrix composites[J].Special costing&nonferrous alloys,2012,32(7):654-656.
[10]ABYZOV A M,KRUSZEWSKI M J,CIUPINSKI?,et al.Diamond-tungsten based coating-copper composites with high thermal conductivity produced by pulse plasma sintering[J].Materials&design,2015,76:97-109.
[11]张永忠,金具涛,涂义,等.纯铜表面激光熔覆铜合金涂层的组织及耐磨性[J].金属热处理,2009,34(4):28-32.ZHANG Yong-zhong,JIN Ju-tao,TU Yi,et al.Microstructure and wear resistance of laser clad copper alloy coating on pure copper[J].Heat treatment of metals,2009,34(4):28-32.
[12]IRAVANI M,KHAJEPOUR A,CORBIN S,et al.Preplaced laser cladding of metal matrix diamond composite on mild steel[J].Surface&coatings technology,2012,206(8):2089-2097.
[13]BRAY M,COCKBURN A,O'NEILL W.The laser-assisted cold spray process and deposit characterization[J].Surface&coatings technology,2009,203(19):2851-2857.
[14]YAO J H,YANG L J,LI B,et al.Beneficial effects of laser irradiation on the deposition process of diamond/Ni60 composite coating with cold spray[J].Applied surface science,2015,330:300-308.
[15]YAO J H,YANG L J,LI B,et al.Characteristics and performance of hard Ni60 alloy coating produced with supersonic laser deposition technique[J].Materials&design,2015,83:26-35.
[16]杨理京,李争显,黄春良,等.激光辅助冷喷涂制备高硬度材料涂层的研究进展[J].材料导报,2018,32(3):412-417.YANG Li-jing,LI Zheng-xian,HUANG Chun-liang,et al.Producing hard material coatings by laser-assisted cold spray:A technological review[J].Materials review,2018,32(3):412-417.
[17]YANG L J,LI B,YAO J H,et al.Effects of diamond size on the deposition characteristic and tribological behavior of diamond/Ni60 composite coating prepared by supersonic laser deposition[J].Diamond&related materials,2015,58:139-148.
[18]刘永正.金刚石/铜复合材料热导率研究[C]//中国功能材料科技与产业高层论坛论文集.镇江:江苏大学,2009:323-325.LIU Yong-zheng.Study on thermal conductivity of diamond/copper composites[C]//Proceedings of China high-level forum on functional materials technology and industry.Zhenjiang:Jiangsu University,2009:323-325.
[19]WANG J D,LI L Q,LIN P P,et al.Effect of TiC particle size on the microstructure and tensile properties of TiCp/Ti6Al4V composites fabricated by laser melting deposition[J].Optics&laser technology,2018,105:195-206.
[20]刘艳娥.刹车片金属陶瓷复合材料制备及摩擦特性研究[J].铸造技术,2018,39(6):1329-1331.LIU Yan-e.Preparation and friction characteristics of brake pad made from ceramic composite materials[J].Foundry technology,2018,39(6):1329-1331.
[21]马彦宇.铜基钎料钎焊颗粒增强复合涂层的研究[D].长春:吉林大学,2007.MA Yan-yu.Study on Cu-based filler metal brazed composite coating with particle reinforced[D].Changchun:Jilin University,2007.
[22]NA H,BAE G,SHIN S,et al.Advanced deposition characteristics of kinetic sprayed bronze/diamond composite by tailoring feedstock properties[J].Composites science&technology,2009,69(3-4):463-468.
[23]KIM H J,JANG J H,CHANG H L.Assessment of metal/diamond composite coating by cold spray deposition[J].Journal of the Korean institute of metals and materials,2007,45(7):409-415.
[24]晏义伍.颗粒尺寸对Si Cp/Al复合材料性能的影响规律及其数值模拟[D].哈尔滨:哈尔滨工业大学,2007.YAN Yi-wu.Effect of particle size on properties of Si Cp/Al composites and its numerical simulation[D].Harbin:Harbin Institute of Technology,2007.
[25]余志华,张建云,周贤良,等.电子封装Si Cp/Al复合材料导热性能研究与进展[J].金属功能材料,2009,16(1):59-64.YU Zhi-hua,ZHANG Jian-yun,ZHOU Xian-liang,et al.Research and development on thermal conductivity of SiC/Al composites applied to electronic packaging[J].Metallic functional materials,2009,16(1):59-64.
[26]HASSELMAN D P H,JOHNSON L F.Effective thermal conductivity of composites with interfacial thermal barrier resistance[J].Journal of composite materials,1987,21(6):508-515.
[27]SKOLIANOS S,KATTAMIS T Z.Tribological properties of SiCp-reinforced Al-4.5%Cu-1.5%Mg alloy composites[J].Materials science&engineering A,1993,163(1):107-113.