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环保导电银浆的制备及其电子纸的性能研究
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  • 英文篇名:Preparation of environmental-friendly conductive silver paste and properties of electronic paper
  • 作者:侯成敏 ; 寇艳萍 ; 李娜 ; 曹从军
  • 英文作者:HOU Chengmin;KOU Yanping;LI Na;CAO Congjun;School of Printing, Packaging Engineering and Digital Media Technology,Xi'an University of Technology;
  • 关键词:导电银浆 ; 淀粉 ; 硝酸银 ; 电阻率 ; 电子纸
  • 英文关键词:conductive silver paste;;starch;;silver nitrate;;electrical resistivity;;electronic paper
  • 中文刊名:GNCL
  • 英文刊名:Journal of Functional Materials
  • 机构:西安理工大学印刷包装与数字媒体学院;
  • 出版日期:2019-05-30
  • 出版单位:功能材料
  • 年:2019
  • 期:v.50;No.428
  • 基金:陕西省自然科学基金资助项目(2016JQ2029);; 国家自然科学基金资助项目(51803167);; 陕西省科协人才托举计划资助项目(20160116);; 陕西省教育厅科研计划资助项目(18JK0586);; 西安市建设科技研究资助项目(SJW2015-24)
  • 语种:中文;
  • 页:GNCL201905034
  • 页数:6
  • CN:05
  • ISSN:50-1099/TH
  • 分类号:205-209+214
摘要
导电银浆是制备电子元器件的关键功能材料。以银和淀粉为做导电填料,按照淀粉/硝酸银质量比分别为2∶1,1∶1,1∶2和1∶3,用氧化还原法制备导电银浆。通过测量电阻研究物理因素(加热烧结、紫外光照照射、泡水、超声波等)对导电银浆导电性能的影响,用显微镜观察导电银浆的形貌。结果表明,淀粉/硝酸银为1∶3时,形成了均匀的淀粉为核、银粒子为壳的导电颗粒。比例为1∶2和1∶3时,在低温加热烧结过程中电阻率降低到初始值的60%~70%。所得银浆能耐受紫外光照、水泡和超声波。其中1∶3导电性最佳。最后,用淀粉/硝酸银比例为1∶3的银浆,分别与30%、45%和60%的墨水混合,涂布纸张,并经低温热烧结后,所得电子纸的电阻率为10 mΩ/cm。
        Conductive silver paste is a key functional material for the preparation of electronic components. Conductive silver paste with silver and starch used as conductive fillers was prepared by redox method with molar ratio of starch to silver nitrate of 2∶1, 1∶1, 1∶2 and 1∶3. The effect of physical factors, such as heating and sintering, ultraviolet light irradiation, soaking water, and ultrasonic wave, on the conductivity of the conductive silver paste was studied by measuring resistance, and the morphology of the conductive silver paste was observed with a microscope. The results showed that when the starch/silver nitrate was 1∶3, the uniform conductive particles with starch as core and silver particles as shell were formed. When the ratio was 1∶2 and 1∶3, the resistivity decreased to 60% to 70% of the initial value during the low-temperature heating and sintering. The resulting silver paste was resistant to UV light, blisters and ultrasound. Among them, the conductivity for the sample prepared with the molar ratio of 1∶3 was the best. Finally, a silver paste with a starch/silver nitrate ratio of 1∶3 was mixed with 30%, 45%, or 60% of the ink, coated with paper, and subjected to low-temperature thermal sintering, and the resulting electronic paper had a resistivity of 10 mΩ/cm.
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